SBOS335E June   2005  – December 2018 TMP300

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Pinout
      2.      Application Schematic
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Electrical Characteristics
    4. 6.4 Typical Characteristics
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Feature Description
      1. 7.2.1 Calculating RSET
      2. 7.2.2 Using VTEMP to Trip the Digital Output
      3. 7.2.3 Analog Temperature Output
      4. 7.2.4 Using a DAC to Set the Trip Point
      5. 7.2.5 Hysteresis
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

At VS = 5V, unless otherwise noted.
TMP300 tc_iq-tmp_sup_sbos335.gif
Figure 1. Quiescent Current Over Temperature and Supply
TMP300 tc_rset-tmp_sbos335.gif
Figure 3. RSET vs Temperature
TMP300 tc_typ_ana_err_sbos335.gif
Figure 5. Typical Analog Output Error
TMP300 tc_psr-tmp_sbos335.gif
Figure 7. Trip PSR Over Temperature
TMP300 tc_rset_shift_sbos335.gif
Figure 2. RSET Shift Resulting From RSET Tolerance
TMP300 tc_typ_trip_err_sbos335.gif
Figure 4. Typical Trip Error
TMP300 tc_ana_psr_sbos335.gif
Figure 6. Analog PSR Over Temperature