SBOS383D December   2006  – December 2016 TMP411

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  8. 8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Series Resistance Cancellation
      2. 9.3.2 Differential Input Capacitance
      3. 9.3.3 Temperature Measurement Data
      4. 9.3.4 THERM (Pin 4) and ALERTor THERM2 (Pin 6)
      5. 9.3.5 Sensor Fault
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Filtering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Conversion
    5. 9.5 Programming
      1. 9.5.1  Serial Interface
      2. 9.5.2  Bus Overview
      3. 9.5.3  Timing Diagrams
      4. 9.5.4  Serial Bus Address
      5. 9.5.5  Read and Write Operations
      6. 9.5.6  Timeout Function
      7. 9.5.7  High-Speed Mode
      8. 9.5.8  General Call Reset
      9. 9.5.9  Software Reset
      10. 9.5.10 SMBus Alert Function
    6. 9.6 Register Map
      1. 9.6.1  Register Information
      2. 9.6.2  Pointer Register
      3. 9.6.3  Temperature Registers
      4. 9.6.4  Limit Registers
      5. 9.6.5  Status Register
      6. 9.6.6  Configuration Register
      7. 9.6.7  Resolution Register
      8. 9.6.8  Conversion Rate Register
      9. 9.6.9  N-Factor Correction Register
      10. 9.6.10 Minimum and Maximum Registers
      11. 9.6.11 Consecutive Alert Register
      12. 9.6.12 THERM Hysteresis Register
      13. 9.6.13 Remote Temperature Offset Register
      14. 9.6.14 Identification Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

Remote temperature sensing on the TMP411 measures small voltages using low currents, and therefore noise at the device inputs must be minimized. Most applications using the TMP411 have high digital content with several clocks and logic-level transitions that create a noisy environment. The layout must adhere to the following guidelines:

  • Place the TMP411 as close to the remote junction sensor as possible.
  • Route the D+ and D– traces next to each other and shield the traces from adjacent signals using ground guard traces, as shown in Figure 21. If a multilayer PCB is used, bury these traces between ground or VDD planes to shield them from extrinsic noise sources. TI recommends using 5-mm (0.127 mm) PCB traces.
  • Minimize additional thermocouple junctions caused by copper-to-solder connections. If these junctions are used, make the same number and approximate location of copper-to-solder connections in the D+ and D– connections to cancel any thermocouple effects.
  • Use a 0.1–µF local bypass capacitor directly between the V+ and GND pins of the TMP411, as shown in Figure 22. Minimize filter capacitance between D+ and D– to 1000 pF or less for optimum measurement performance. This capacitance includes any cable capacitance between the remote temperature sensor and the TMP411 .
  • If the connection between the remote temperature sensor and the TMP411 is less than eight inches (20 cm), use a twisted-wire pair connection. If the connection measures more than eight inches (20 cm), use a twisted, shielded pair with the shield grounded as close to the TMP411 as possible. Leave the remote sensor connection end of the shield wire open to avoid grounded loops and 60-Hz pickup.
TMP411 Fig_19_SBOS383D.gif Figure 21. Example Signal Traces
TMP411 Fig_20_SBOS383D.gif Figure 22. Suggested Bypass Capacitor Placement

12.2 Layout Example

TMP411 Fig_23_TMP411_Device_Layout.gif Figure 23. TMP411 Device Layout