SBOS383D December   2006  – December 2016 TMP411

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
  8. Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Series Resistance Cancellation
      2. 9.3.2 Differential Input Capacitance
      3. 9.3.3 Temperature Measurement Data
      4. 9.3.4 THERM (Pin 4) and ALERTor THERM2 (Pin 6)
      5. 9.3.5 Sensor Fault
      6. 9.3.6 Undervoltage Lockout
      7. 9.3.7 Filtering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Conversion
    5. 9.5 Programming
      1. 9.5.1  Serial Interface
      2. 9.5.2  Bus Overview
      3. 9.5.3  Timing Diagrams
      4. 9.5.4  Serial Bus Address
      5. 9.5.5  Read and Write Operations
      6. 9.5.6  Timeout Function
      7. 9.5.7  High-Speed Mode
      8. 9.5.8  General Call Reset
      9. 9.5.9  Software Reset
      10. 9.5.10 SMBus Alert Function
    6. 9.6 Register Map
      1. 9.6.1  Register Information
      2. 9.6.2  Pointer Register
      3. 9.6.3  Temperature Registers
      4. 9.6.4  Limit Registers
      5. 9.6.5  Status Register
      6. 9.6.6  Configuration Register
      7. 9.6.7  Resolution Register
      8. 9.6.8  Conversion Rate Register
      9. 9.6.9  N-Factor Correction Register
      10. 9.6.10 Minimum and Maximum Registers
      11. 9.6.11 Consecutive Alert Register
      12. 9.6.12 THERM Hysteresis Register
      13. 9.6.13 Remote Temperature Offset Register
      14. 9.6.14 Identification Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.