SBOS762B November   2016  – June 2017 TMP468

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
          1. 7.5.1.4.1 Single Register Reads
          2. 7.5.1.4.2 Block Register Reads
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 TMP468 Register Reset
      3. 7.5.3 Lock Register
    6. 7.6 Register Maps
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Value Registers
        3. 7.6.1.3  Software Reset Register
        4. 7.6.1.4  THERM Status Register
        5. 7.6.1.5  THERM2 Status Register
        6. 7.6.1.6  Remote Channel Open Status Register
        7. 7.6.1.7  Configuration Register
        8. 7.6.1.8  η-Factor Correction Register
        9. 7.6.1.9  Remote Temperature Offset Register
        10. 7.6.1.10 THERM Hysteresis Register
        11. 7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12 Block Read - Auto Increment Pointer
        13. 7.6.1.13 Lock Register
        14. 7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from A Revision (March 2017) to B Revision

  • Updated packaging information Go

Changes from * Revision (November 2016) to A Revision

  • Added 16-pin VQFN package version throughout data sheet.Go
  • Deleted Description (cont.) section and moved text to Description section Go
  • Added VQFN package and body size information to Device Information table Go
  • Added copyright statement to Typical Application SchematicGo
  • Added RGT (VQFN) pinout diagram in the Pin Configuration and Functions section Go
  • Added remote junction temperature parameter and values to Recommended Operating Conditions table Go
  • Changed formatting of Thermal Information table note Go
  • Changed TMP468 Thermal Information table package from "RGT (QFN)" to "RGT (VQFN)"Go
  • Updated formatting of Two-Wire Timing Requirements table Go
  • Changed Timing Requirements table note parameter from tVD;DATA to tVD;DATGo
  • Added 2017 copyright to Functional Block Diagram Go
  • Changed table headers in Continuous Conversion Times table Go
  • Added 2017 copyright to Typical Application schematic in Application Information sectionGo
  • Changed η-factor setting from 1.003674 to 1.0067 in Figure 23 table note in Typical Application sectionGo
  • Changed conversion rate from 16 conversions/second to 1 conversion/second in the Detailed Design Procedure sectionGo
  • Changed units of Equation 7 from "µs" to "µA"Go