SPRS797C November   2012  – October 2018 TMS320F28050 , TMS320F28051 , TMS320F28052 , TMS320F28053 , TMS320F28054 , TMS320F28055

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
      1. Table 5-1 TMS320F2805x Current Consumption at 60-MHz SYSCLKOUT
      2. 5.4.1     Reducing Current Consumption
      3. 5.4.2     Current Consumption Graphs (VREG Enabled)
    5. 5.5  Electrical Characteristics
    6. 5.6  Thermal Resistance Characteristics for PN Package
    7. 5.7  Thermal Design Considerations
    8. 5.8  Emulator Connection Without Signal Buffering for the MCU
    9. 5.9  Parameter Information
      1. 5.9.1 Timing Parameter Symbology
      2. 5.9.2 General Notes on Timing Parameters
    10. 5.10 Test Load Circuit
    11. 5.11 Power Sequencing
      1. Table 5-3 Reset (XRS) Timing Requirements
      2. Table 5-4 Reset (XRS) Switching Characteristics
    12. 5.12 Clock Specifications
      1. 5.12.1 Device Clock Table
        1. Table 5-5 2805x Clock Table and Nomenclature (60-MHz Devices)
        2. Table 5-6 Device Clocking Requirements/Characteristics
        3. Table 5-7 Internal Zero-Pin Oscillator (INTOSC1, INTOSC2) Characteristics
      2. 5.12.2 Clock Requirements and Characteristics
        1. Table 5-8  XCLKIN Timing Requirements - PLL Enabled
        2. Table 5-9  XCLKIN Timing Requirements - PLL Disabled
        3. Table 5-10 XCLKOUT Switching Characteristics (PLL Bypassed or Enabled)
    13. 5.13 Flash Timing
      1. Table 5-11 Flash/OTP Endurance for T Temperature Material
      2. Table 5-12 Flash/OTP Endurance for S Temperature Material
      3. Table 5-13 Flash/OTP Endurance for Q Temperature Material
      4. Table 5-14 Flash Parameters at 60-MHz SYSCLKOUT
      5. Table 5-15 Flash/OTP Access Timing
      6. Table 5-16 Flash Data Retention Duration
  6. 6Detailed Description
    1. 6.1 Overview
      1. 6.1.1  CPU
      2. 6.1.2  Control Law Accelerator
      3. 6.1.3  Memory Bus (Harvard Bus Architecture)
      4. 6.1.4  Peripheral Bus
      5. 6.1.5  Real-Time JTAG and Analysis
      6. 6.1.6  Flash
      7. 6.1.7  M0, M1 SARAMs
      8. 6.1.8  L0 SARAM, and L1, L2, and L3 DPSARAMs
      9. 6.1.9  Boot ROM
        1. 6.1.9.1 Emulation Boot
        2. 6.1.9.2 GetMode
        3. 6.1.9.3 Peripheral Pins Used by the Bootloader
      10. 6.1.10 Security
      11. 6.1.11 Peripheral Interrupt Expansion Block
      12. 6.1.12 External Interrupts (XINT1 to XINT3)
      13. 6.1.13 Internal Zero-Pin Oscillators, Oscillator, and PLL
      14. 6.1.14 Watchdog
      15. 6.1.15 Peripheral Clocking
      16. 6.1.16 Low-power Modes
      17. 6.1.17 Peripheral Frames 0, 1, 2, 3 (PFn)
      18. 6.1.18 General-Purpose Input/Output Multiplexer
      19. 6.1.19 32-Bit CPU-Timers (0, 1, 2)
      20. 6.1.20 Control Peripherals
      21. 6.1.21 Serial Port Peripherals
    2. 6.2 Memory Maps
    3. 6.3 Register Map
    4. 6.4 Device Emulation Registers
    5. 6.5 VREG, BOR, POR
      1. 6.5.1 On-chip VREG
        1. 6.5.1.1 Using the On-chip VREG
        2. 6.5.1.2 Disabling the On-chip VREG
      2. 6.5.2 On-chip Power-On Reset and Brownout Reset Circuit
    6. 6.6 System Control
      1. 6.6.1 Internal Zero-Pin Oscillators
      2. 6.6.2 Crystal Oscillator Option
      3. 6.6.3 PLL-Based Clock Module
      4. 6.6.4 Loss of Input Clock (NMI-watchdog Function)
      5. 6.6.5 CPU-watchdog Module
    7. 6.7 Low-power Modes Block
    8. 6.8 Interrupts
      1. 6.8.1 External Interrupts
        1. 6.8.1.1 External Interrupt Electrical Data/Timing
          1. Table 6-26 External Interrupt Timing Requirements
          2. Table 6-27 External Interrupt Switching Characteristics
    9. 6.9 Peripherals
      1. 6.9.1  Control Law Accelerator
        1. 6.9.1.1 CLA Device-Specific Information
        2. 6.9.1.2 CLA Register Descriptions
      2. 6.9.2  Analog Block
        1. 6.9.2.1 Analog-to-Digital Converter
          1. 6.9.2.1.1 ADC Device-Specific Information
          2. 6.9.2.1.2 ADC Electrical Data/Timing
            1. Table 6-32  ADC Electrical Characteristics
            2. Table 6-34  ADC Power Modes
            3. 6.9.2.1.2.1 External ADC Start-of-Conversion Electrical Data/Timing
              1. Table 6-35 External ADC Start-of-Conversion Switching Characteristics
            4. 6.9.2.1.2.2 Internal Temperature Sensor
              1. Table 6-36 Temperature Sensor Coefficient
            5. 6.9.2.1.2.3 ADC Power-Up Control Bit Timing
              1. Table 6-37 ADC Power-Up Delays
            6. 6.9.2.1.2.4 ADC Sequential and Simultaneous Timings
        2. 6.9.2.2 Analog Front End
          1. 6.9.2.2.1 AFE Device-Specific Information
          2. 6.9.2.2.2 AFE Register Descriptions
          3. 6.9.2.2.3 PGA Electrical Data/Timing
          4. 6.9.2.2.4 Comparator Block Electrical Data/Timing
            1. Table 6-45 Electrical Characteristics of the Comparator/DAC
          5. 6.9.2.2.5 VREFOUT Buffered DAC Electrical Data
            1. Table 6-46 Electrical Characteristics of VREFOUT Buffered DAC
      3. 6.9.3  Detailed Descriptions
      4. 6.9.4  Serial Peripheral Interface
        1. 6.9.4.1 SPI Device-Specific Information
        2. 6.9.4.2 SPI Register Descriptions
        3. 6.9.4.3 SPI Master Mode Electrical Data/Timing
          1. Table 6-48 SPI Master Mode External Timing (Clock Phase = 0)
          2. Table 6-49 SPI Master Mode External Timing (Clock Phase = 1)
        4. 6.9.4.4 SPI Slave Mode Electrical Data/Timing
          1. Table 6-50 SPI Slave Mode External Timing (Clock Phase = 0)
          2. Table 6-51 SPI Slave Mode External Timing (Clock Phase = 1)
      5. 6.9.5  Serial Communications Interface
        1. 6.9.5.1 SCI Device-Specific Information
        2. 6.9.5.2 SCI Register Descriptions
      6. 6.9.6  Enhanced Controller Area Network
        1. 6.9.6.1 eCAN Device-Specific Information
        2. 6.9.6.2 eCAN Register Descriptions
      7. 6.9.7  Inter-Integrated Circuit
        1. 6.9.7.1 I2C Device-Specific Information
        2. 6.9.7.2 I2C Register Descriptions
        3. 6.9.7.3 I2C Electrical Data/Timing
          1. Table 6-58 I2C Timing Requirements
          2. Table 6-59 I2C Switching Characteristics
      8. 6.9.8  Enhanced Pulse Width Modulator
        1. 6.9.8.1 ePWM Device-Specific Information
        2. 6.9.8.2 ePWM Register Descriptions
        3. 6.9.8.3 ePWM Electrical Data/Timing
          1. Table 6-62 ePWM Timing Requirements
          2. Table 6-63 ePWM Switching Characteristics
          3. 6.9.8.3.1  Trip-Zone Input Timing
            1. Table 6-64 Trip-Zone Input Timing Requirements
      9. 6.9.9  Enhanced Capture Module
        1. 6.9.9.1 eCAP Module Device-Specific Information
        2. 6.9.9.2 eCAP Module Register Descriptions
        3. 6.9.9.3 eCAP Module Electrical Data/Timing
          1. Table 6-66 eCAP Timing Requirement
          2. Table 6-67 eCAP Switching Characteristics
      10. 6.9.10 Enhanced Quadrature Encoder Pulse
        1. 6.9.10.1 eQEP Device-Specific Information
        2. 6.9.10.2 eQEP Register Descriptions
        3. 6.9.10.3 eQEP Electrical Data/Timing
          1. Table 6-69 eQEP Timing Requirements
          2. Table 6-70 eQEP Switching Characteristics
      11. 6.9.11 JTAG Port
        1. 6.9.11.1 JTAG Port Device-Specific Information
      12. 6.9.12 General-Purpose Input/Output
        1. 6.9.12.1 GPIO Device-Specific Information
        2. 6.9.12.2 GPIO Register Descriptions
        3. 6.9.12.3 GPIO Electrical Data/Timing
          1. 6.9.12.3.1 GPIO - Output Timing
            1. Table 6-74 General-Purpose Output Switching Characteristics
          2. 6.9.12.3.2 GPIO - Input Timing
            1. Table 6-75 General-Purpose Input Timing Requirements
          3. 6.9.12.3.3 Sampling Window Width for Input Signals
          4. 6.9.12.3.4 Low-Power Mode Wakeup Timing
            1. Table 6-76 IDLE Mode Timing Requirements
            2. Table 6-77 IDLE Mode Switching Characteristics
            3. Table 6-78 STANDBY Mode Timing Requirements
            4. Table 6-79 STANDBY Mode Switching Characteristics
            5. Table 6-80 HALT Mode Timing Requirements
            6. Table 6-81 HALT Mode Switching Characteristics
  7. 7Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1 Getting Started
    2. 8.2 Device and Development Support Tool Nomenclature
    3. 8.3 Tools and Software
    4. 8.4 Documentation Support
    5. 8.5 Related Links
    6. 8.6 Community Resources
    7. 8.7 Trademarks
    8. 8.8 Electrostatic Discharge Caution
    9. 8.9 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

GPIO Device-Specific Information

The GPIO MUX can multiplex up to three independent peripheral signals on a single GPIO pin in addition to providing individual pin bit-banging I/O capability.

Table 6-71 GPIOA MUX(1)(2)

DEFAULT AT RESET
PRIMARY I/O FUNCTION
PERIPHERAL
SELECTION 1
PERIPHERAL
SELECTION 2
PERIPHERAL
SELECTION 3
GPAMUX1 REGISTER BITS (GPAMUX1 BITS = 00) (GPAMUX1 BITS = 01) (GPAMUX1 BITS = 10) (GPAMUX1 BITS = 11)
1:0 GPIO0 EPWM1A (O) Reserved Reserved
3:2 GPIO1 EPWM1B (O) Reserved CTRIPM1OUT (O)
5:4 GPIO2 EPWM2A (O) Reserved Reserved
7:6 GPIO3 EPWM2B (O) SPISOMIA (I/O) Reserved
9:8 GPIO4 EPWM3A (O) Reserved Reserved
11:10 GPIO5 EPWM3B (O) SPISIMOA (I/O) ECAP1 (I/O)
13:12 GPIO6 EPWM4A (O) EPWMSYNCI (I) EPWMSYNCO (O)
15:14 GPIO7 EPWM4B (O) SCIRXDA (I) Reserved
17:16 GPIO8 EPWM5A (O) Reserved ADCSOCAO (O)
19:18 GPIO9 EPWM5B (O) SCITXDB (O) Reserved
21:20 GPIO10 EPWM6A (O) Reserved ADCSOCBO (O)
23:22 GPIO11 EPWM6B (O) SCIRXDB (I) Reserved
25:24 GPIO12 TZ1 (I)/
CTRIPM1OUT (O)
SCITXDA (O) Reserved
27:26 GPIO13 TZ2 (I) Reserved Reserved
29:28 GPIO14 TZ3 (I)/
CTRIPPFCOUT (O)
SCITXDB (O) Reserved
31:30 GPIO15 TZ1 (I)/
CTRIPM1OUT (O)
SCIRXDB (I) Reserved
GPAMUX2 REGISTER BITS (GPAMUX2 BITS = 00) (GPAMUX2 BITS = 01) (GPAMUX2 BITS = 10) (GPAMUX2 BITS = 11)
1:0 GPIO16 SPISIMOA (I/O) EQEP1S (I/O) TZ2 (I)
3:2 GPIO17 SPISOMIA (I/O) EQEP1I (I/O) TZ3 (I)/
CTRIPPFCOUT (O)
5:4 GPIO18 SPICLKA (I/O) SCITXDB (O) XCLKOUT (O/Z)
7:6 GPIO19/XCLKIN SPISTEA (I/O) SCIRXDB (I) ECAP1 (I/O)
9:8 GPIO20 EQEP1A (I) EPWM7A (O) CTRIPM1OUT (O)
11:10 GPIO21 EQEP1B (I) EPWM7B (O) Reserved
13:12 GPIO22 EQEP1S (I/O) Reserved SCITXDB (O)
15:14 GPIO23 EQEP1I (I/O) Reserved SCIRXDB (I)
17:16 GPIO24 ECAP1 (I/O) EPWM7A (O) Reserved
19:18 GPIO25 Reserved Reserved Reserved
21:20 GPIO26 Reserved SCIRXDC (I) Reserved
23:22 GPIO27 Reserved SCITXDC (O) Reserved
25:24 GPIO28 SCIRXDA (I) SDAA (I/OD) TZ2 (I)
27:26 GPIO29 SCITXDA (O) SCLA (I/OD) TZ3 (I)/
CTRIPPFCOUT (O)
29:28 GPIO30 CANRXA (I) SCIRXDB (I) EPWM7A (O)
31:30 GPIO31 CANTXA (O) SCITXDB (O) EPWM7B (O)
The word reserved means that there is no peripheral assigned to this GPxMUX1/2 register setting. If the Reserved GPxMUX1/2 register setting is selected, the state of the pin will be undefined and the pin may be driven. This selection is a reserved configuration for future expansion.
I = Input, O = Output, Z = High Impedance, OD = Open Drain

Table 6-72 GPIOB MUX(1)

DEFAULT AT RESET
PRIMARY I/O FUNCTION
PERIPHERAL SELECTION 1 PERIPHERAL SELECTION 2 PERIPHERAL SELECTION 3
GPBMUX1 REGISTER BITS (GPBMUX1 BITS = 00) (GPBMUX1 BITS = 01) (GPBMUX1 BITS = 10) (GPBMUX1 BITS = 11)
1:0 GPIO32 SDAA (I/OD) EPWMSYNCI (I) EQEP1S (I/O)
3:2 GPIO33 SCLA (I/OD) EPWMSYNCO (O) EQEP1I (I/O)
5:4 GPIO34 Reserved Reserved CTRIPPFCOUT (O)
7:6 GPIO35 (TDI) Reserved Reserved Reserved
9:8 GPIO36 (TMS) Reserved Reserved Reserved
11:10 GPIO37 (TDO) Reserved Reserved Reserved
13:12 GPIO38/XCLKIN (TCK) Reserved Reserved Reserved
15:14 GPIO39 Reserved SCIRXDC (I) CTRIPPFCOUT (O)
17:16 GPIO40 EPWM7A (O) Reserved Reserved
19:18 Reserved Reserved Reserved Reserved
21:20 GPIO42 EPWM7B (O) SCITXDC (O) CTRIPM1OUT (O)
23:22 Reserved Reserved Reserved Reserved
25:24 Reserved Reserved Reserved Reserved
27:26 Reserved Reserved Reserved Reserved
29:28 Reserved Reserved Reserved Reserved
31:30 Reserved Reserved Reserved Reserved
I = Input, O = Output, OD = Open Drain

The user can select the type of input qualification for each GPIO pin through the GPxQSEL1/2 registers from four choices:

  • Synchronization to SYSCLKOUT Only (GPxQSEL1/2 = 0, 0): This mode is the default mode of all GPIO pins at reset and this mode simply synchronizes the input signal to the system clock (SYSCLKOUT).
  • Qualification Using Sampling Window (GPxQSEL1/2 = 0, 1 and 1, 0): In this mode the input signal, after synchronization to the system clock (SYSCLKOUT), is qualified by a specified number of cycles before the input is allowed to change.
  • The sampling period is specified by the QUALPRD bits in the GPxCTRL register and is configurable in groups of 8 signals. The sampling period specifies a multiple of SYSCLKOUT cycles for sampling the input signal. The sampling window is either 3-samples or 6-samples wide and the output is only changed when ALL samples are the same (all 0s or all 1s) as shown in Figure 6-45 (for 6 sample mode).
  • No Synchronization (GPxQSEL1/2 = 1,1): This mode is used for peripherals where synchronization is not required (synchronization is performed within the peripheral).

Due to the multilevel multiplexing that is required on the device, there may be cases where a peripheral input signal can be mapped to more then one GPIO pin. Also, when an input signal is not selected, the input signal will default to either a 0 or 1 state, depending on the peripheral.

TMS320F28055 TMS320F28054 TMS320F28053 TMS320F28052 TMS320F28051 TMS320F28050 fbd_gpiomux_prs523.gif
The letter x stands for the port, either A or B. For example, GPxDIR refers to either the GPADIR and GPBDIR register depending on the particular GPIO pin selected.
GPxDAT latch/read are accessed at the same memory location.
This diagram is a generic GPIO MUX block diagram. Not all options may be applicable for all GPIO pins. See the Systems Control and Interrupts chapter of the TMS320x2805x Piccolo Technical Reference Manual for pin-specific variations.
Figure 6-43 GPIO Multiplexing