SPNS253A May   2018  – September 2019 TMS570LC4357-EP

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Terminal Configuration and Functions
    1. 3.1 GWT BGA Package Ball-Map (337 Terminal Grid Array)
    2. 3.2 Terminal Functions
      1. 3.2.1 GWT Package
        1. 3.2.1.1  Multibuffered Analog-to-Digital Converters (MibADC)
        2. 3.2.1.2  Enhanced High-End Timer Modules (N2HET)
        3. 3.2.1.3  RAM Trace Port (RTP)
        4. 3.2.1.4  Enhanced Capture Modules (eCAP)
        5. 3.2.1.5  Enhanced Quadrature Encoder Pulse Modules (eQEP)
        6. 3.2.1.6  Enhanced Pulse-Width Modulator Modules (ePWM)
        7. 3.2.1.7  Data Modification Module (DMM)
        8. 3.2.1.8  General-Purpose Input / Output (GIO)
        9. 3.2.1.9  FlexRay Interface Controller (FlexRay)
        10. 3.2.1.10 Controller Area Network Controllers (DCAN)
        11. 3.2.1.11 Local Interconnect Network Interface Module (LIN)
        12. 3.2.1.12 Standard Serial Communication Interface (SCI)
        13. 3.2.1.13 Inter-Integrated Circuit Interface Module (I2C)
        14. 3.2.1.14 Multibuffered Serial Peripheral Interface Modules (MibSPI)
        15. 3.2.1.15 Ethernet Controller
        16. 3.2.1.16 External Memory Interface (EMIF)
        17. 3.2.1.17 Embedded Trace Macrocell Interface for Cortex-R5F (ETM-R5)
        18. 3.2.1.18 System Module Interface
        19. 3.2.1.19 Clock Inputs and Outputs
        20. 3.2.1.20 Test and Debug Modules Interface
        21. 3.2.1.21 Flash Supply and Test Pads
        22. 3.2.1.22 Supply for Core Logic: 1.2-V Nominal
        23. 3.2.1.23 Supply for I/O Cells: 3.3-V Nominal
        24. 3.2.1.24 Ground Reference for All Supplies Except VCCAD
        25. 3.2.1.25 Other Supplies
      2. 3.2.2 Multiplexing
        1. 3.2.2.1 Output Multiplexing
          1. 3.2.2.1.1 Notes on Output Multiplexing
        2. 3.2.2.2 Input Multiplexing
          1. 3.2.2.2.1 Notes on Input Multiplexing
          2. 3.2.2.2.2 General Rules for Multiplexing Control Registers
  4. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Power-On Hours (POH)
    4. 4.4  Recommended Operating Conditions
    5. 4.5  Switching Characteristics Over Recommended Operating Conditions for Clock Domains
    6. 4.6  Wait States Required - L2 Memories
    7. 4.7  Power Consumption Summary
    8. 4.8  Input/Output Electrical Characteristics Over Recommended Operating Conditions
    9. 4.9  Thermal Resistance Characteristics for the BGA Package (GWT)
    10. 4.10 Timing and Switching Characteristics
      1. 4.10.1 Input Timings
      2. 4.10.2 Output Timings
  5. 5 System Information and Electrical Specifications
    1. 5.1  Device Power Domains
    2. 5.2  Voltage Monitor Characteristics
      1. 5.2.1 Important Considerations
      2. 5.2.2 Voltage Monitor Operation
      3. 5.2.3 Supply Filtering
    3. 5.3  Power Sequencing and Power-On Reset
      1. 5.3.1 Power-Up Sequence
      2. 5.3.2 Power-Down Sequence
      3. 5.3.3 Power-On Reset: nPORRST
        1. 5.3.3.1 nPORRST Electrical and Timing Requirements
    4. 5.4  Warm Reset (nRST)
      1. 5.4.1 Causes of Warm Reset
      2. 5.4.2 nRST Timing Requirements
    5. 5.5  ARM Cortex-R5F CPU Information
      1. 5.5.1 Summary of ARM Cortex-R5F CPU Features
      2. 5.5.2 Dual Core Implementation
      3. 5.5.3 Duplicate Clock Tree After GCLK
      4. 5.5.4 ARM Cortex-R5F CPU Compare Module (CCM) for Safety
        1. 5.5.4.1 Signal Compare Operating Modes
          1. 5.5.4.1.1 Active Compare Lockstep Mode
          2. 5.5.4.1.2 Self-Test Mode
          3. 5.5.4.1.3 Error Forcing Mode
          4. 5.5.4.1.4 Self-Test Error Forcing Mode
        2. 5.5.4.2 Bus Inactivity Monitor
        3. 5.5.4.3 CPU Registers Initialization
      5. 5.5.5 CPU Self-Test
        1. 5.5.5.1 Application Sequence for CPU Self-Test
        2. 5.5.5.2 CPU Self-Test Clock Configuration
        3. 5.5.5.3 CPU Self-Test Coverage
      6. 5.5.6 N2HET STC / LBIST Self-Test Coverage
    6. 5.6  Clocks
      1. 5.6.1 Clock Sources
        1. 5.6.1.1 Main Oscillator
          1. 5.6.1.1.1 Timing Requirements for Main Oscillator
        2. 5.6.1.2 Low-Power Oscillator
          1. 5.6.1.2.1 Features
          2. 5.6.1.2.2 LPO Electrical and Timing Specifications
        3. 5.6.1.3 Phase-Locked Loop (PLL) Clock Modules
          1. 5.6.1.3.1 Block Diagram
          2. 5.6.1.3.2 PLL Timing Specifications
        4. 5.6.1.4 External Clock Inputs
      2. 5.6.2 Clock Domains
        1. 5.6.2.1 Clock Domain Descriptions
        2. 5.6.2.2 Mapping of Clock Domains to Device Modules
      3. 5.6.3 Special Clock Source Selection Scheme for VCLKA4_DIVR_EMAC
      4. 5.6.4 Clock Test Mode
    7. 5.7  Clock Monitoring
      1. 5.7.1 Clock Monitor Timings
      2. 5.7.2 External Clock (ECLK) Output Functionality
      3. 5.7.3 Dual Clock Comparators
        1. 5.7.3.1 Features
        2. 5.7.3.2 Mapping of DCC Clock Source Inputs
    8. 5.8  Glitch Filters
    9. 5.9  Device Memory Map
      1. 5.9.1 Memory Map Diagram
      2. 5.9.2 Memory Map Table
      3. 5.9.3 Special Consideration for CPU Access Errors Resulting in Imprecise Aborts
      4. 5.9.4 Master/Slave Access Privileges
        1. 5.9.4.1 Special Notes on Accesses to Certain Slaves
      5. 5.9.5 MasterID to PCRx
      6. 5.9.6 CPU Interconnect Subsystem SDC MMR Port
      7. 5.9.7 Parameter Overlay Module (POM) Considerations
    10. 5.10 Flash Memory
      1. 5.10.1 Flash Memory Configuration
      2. 5.10.2 Main Features of Flash Module
      3. 5.10.3 ECC Protection for Flash Accesses
      4. 5.10.4 Flash Access Speeds
      5. 5.10.5 Flash Program and Erase Timings
        1. 5.10.5.1 Flash Program and Erase Timings for Program Flash
        2. 5.10.5.2 Flash Program and Erase Timings for Data Flash
    11. 5.11 L2RAMW (Level 2 RAM Interface Module)
      1. 5.11.1 L2 SRAM Initialization
    12. 5.12 ECC / Parity Protection for Accesses to Peripheral RAMs
    13. 5.13 On-Chip SRAM Initialization and Testing
      1. 5.13.1 On-Chip SRAM Self-Test Using PBIST
        1. 5.13.1.1 Features
        2. 5.13.1.2 PBIST RAM Groups
      2. 5.13.2 On-Chip SRAM Auto Initialization
    14. 5.14 External Memory Interface (EMIF)
      1. 5.14.1 Features
      2. 5.14.2 Electrical and Timing Specifications
        1. 5.14.2.1 Read Timing (Asynchronous RAM)
        2. 5.14.2.2 Write Timing (Asynchronous RAM)
        3. 5.14.2.3 EMIF Asynchronous Memory Timing
        4. 5.14.2.4 Read Timing (Synchronous RAM)
        5. 5.14.2.5 Write Timing (Synchronous RAM)
        6. 5.14.2.6 EMIF Synchronous Memory Timing
    15. 5.15 Vectored Interrupt Manager
      1. 5.15.1 VIM Features
      2. 5.15.2 Interrupt Generation
      3. 5.15.3 Interrupt Request Assignments
    16. 5.16 ECC Error Event Monitoring and Profiling
      1. 5.16.1 EPC Module Operation
        1. 5.16.1.1 Correctable Error Handling
        2. 5.16.1.2 Uncorrectable Error Handling
    17. 5.17 DMA Controller
      1. 5.17.1 DMA Features
      2. 5.17.2 DMA Transfer Port Assignment
      3. 5.17.3 Default DMA Request Map
      4. 5.17.4 Using a GIO terminal as a DMA Request Input
    18. 5.18 Real-Time Interrupt Module
      1. 5.18.1 Features
      2. 5.18.2 Block Diagrams
      3. 5.18.3 Clock Source Options
      4. 5.18.4 Network Time Synchronization Inputs
    19. 5.19 Error Signaling Module
      1. 5.19.1 ESM Features
      2. 5.19.2 ESM Channel Assignments
    20. 5.20 Reset / Abort / Error Sources
    21. 5.21 Digital Windowed Watchdog
    22. 5.22 Debug Subsystem
      1. 5.22.1  Block Diagram
      2. 5.22.2  Debug Components Memory Map
      3. 5.22.3  Embedded Cross Trigger
      4. 5.22.4  JTAG Identification Code
      5. 5.22.5  Debug ROM
      6. 5.22.6  JTAG Scan Interface Timings
      7. 5.22.7  Advanced JTAG Security Module
      8. 5.22.8  Embedded Trace Macrocell (ETM-R5)
        1. 5.22.8.1 ETM TRACECLKIN Selection
        2. 5.22.8.2 Timing Specifications
      9. 5.22.9  RAM Trace Port (RTP)
        1. 5.22.9.1 RTP Features
        2. 5.22.9.2 Timing Specifications
      10. 5.22.10 Data Modification Module (DMM)
        1. 5.22.10.1 DMM Features
        2. 5.22.10.2 Timing Specifications
      11. 5.22.11 Boundary Scan Chain
  6. 6 Peripheral Information and Electrical Specifications
    1. 6.1  Enhanced Translator PWM Modules (ePWM)
      1. 6.1.1 ePWM Clocking and Reset
      2. 6.1.2 Synchronization of ePWMx Time-Base Counters
      3. 6.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
      4. 6.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
      5. 6.1.5 ePWM Synchronization with External Devices
      6. 6.1.6 ePWM Trip Zones
        1. 6.1.6.1 Trip Zones TZ1n, TZ2n, TZ3n
        2. 6.1.6.2 Trip Zone TZ4n
        3. 6.1.6.3 Trip Zone TZ5n
        4. 6.1.6.4 Trip Zone TZ6n
      7. 6.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
      8. 6.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Electrical Data/Timing
    2. 6.2  Enhanced Capture Modules (eCAP)
      1. 6.2.1 Clock Enable Control for eCAPx Modules
      2. 6.2.2 PWM Output Capability of eCAPx
      3. 6.2.3 Input Connection to eCAPx Modules
      4. 6.2.4 Enhanced Capture Module (eCAP) Electrical Data/Timing
    3. 6.3  Enhanced Quadrature Encoder (eQEP)
      1. 6.3.1 Clock Enable Control for eQEPx Modules
      2. 6.3.2 Using eQEPx Phase Error to Trip ePWMx Outputs
      3. 6.3.3 Input Connection to eQEPx Modules
      4. 6.3.4 Enhanced Quadrature Encoder Pulse (eQEPx) Timing
    4. 6.4  12-bit Multibuffered Analog-to-Digital Converter (MibADC)
      1. 6.4.1 MibADC Features
      2. 6.4.2 Event Trigger Options
        1. 6.4.2.1 MibADC1 Event Trigger Hookup
        2. 6.4.2.2 MibADC2 Event Trigger Hookup
        3. 6.4.2.3 Controlling ADC1 and ADC2 Event Trigger Options Using SOC Output from ePWM Modules
      3. 6.4.3 ADC Electrical and Timing Specifications
      4. 6.4.4 Performance (Accuracy) Specifications
        1. 6.4.4.1 MibADC Nonlinearity Errors
        2. 6.4.4.2 MibADC Total Error
    5. 6.5  General-Purpose Input/Output
      1. 6.5.1 Features
    6. 6.6  Enhanced High-End Timer (N2HET)
      1. 6.6.1 Features
      2. 6.6.2 N2HET RAM Organization
      3. 6.6.3 Input Timing Specifications
      4. 6.6.4 N2HET1-N2HET2 Interconnections
      5. 6.6.5 N2HET Checking
        1. 6.6.5.1 Internal Monitoring
        2. 6.6.5.2 Output Monitoring using Dual Clock Comparator (DCC)
      6. 6.6.6 Disabling N2HET Outputs
      7. 6.6.7 High-End Timer Transfer Unit (HET-TU)
        1. 6.6.7.1 Features
        2. 6.6.7.2 Trigger Connections
    7. 6.7  FlexRay Interface
      1. 6.7.1 Features
      2. 6.7.2 Electrical and Timing Specifications
      3. 6.7.3 FlexRay Transfer Unit
    8. 6.8  Controller Area Network (DCAN)
      1. 6.8.1 Features
      2. 6.8.2 Electrical and Timing Specifications
    9. 6.9  Local Interconnect Network Interface (LIN)
      1. 6.9.1 LIN Features
    10. 6.10 Serial Communication Interface (SCI)
      1. 6.10.1 Features
    11. 6.11 Inter-Integrated Circuit (I2C)
      1. 6.11.1 Features
      2. 6.11.2 I2C I/O Timing Specifications
    12. 6.12 Multibuffered / Standard Serial Peripheral Interface
      1. 6.12.1 Features
      2. 6.12.2 MibSPI Transmit and Receive RAM Organization
      3. 6.12.3 MibSPI Transmit Trigger Events
        1. 6.12.3.1 MIBSPI1 Event Trigger Hookup
        2. 6.12.3.2 MIBSPI2 Event Trigger Hookup
        3. 6.12.3.3 MIBSPI3 Event Trigger Hookup
        4. 6.12.3.4 MIBSPI4 Event Trigger Hookup
        5. 6.12.3.5 MIBSPI5 Event Trigger Hookup
      4. 6.12.4 MibSPI/SPI Master Mode I/O Timing Specifications
      5. 6.12.5 SPI Slave Mode I/O Timings
    13. 6.13 Ethernet Media Access Controller
      1. 6.13.1 Ethernet MII Electrical and Timing Specifications
      2. 6.13.2 Ethernet RMII Electrical and Timing Specifications
      3. 6.13.3 Management Data Input/Output (MDIO)
  7. 7 Applications, Implementation, and Layout
    1. 7.1 TI Design or Reference Design
  8. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device and Development-Support Tool Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation from Texas Instruments
      2. 8.2.2 Receiving Notification of Documentation Updates
      3. 8.2.3 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
    6. 8.6 Device Identification
      1. 8.6.1 Device Identification Code Register
        1. Table 8-1 Device ID Bit Allocation Register Field Descriptions
      2. 8.6.2 Die Identification Registers
    7. 8.7 Module Certifications
      1. 8.7.1 FlexRay Certifications
      2. 8.7.2 DCAN Certification
      3. 8.7.3 LIN Certification
        1. 8.7.3.1 LIN Master Mode
        2. 8.7.3.2 LIN Slave Mode - Fixed Baud Rate
        3. 8.7.3.3 LIN Slave Mode - Adaptive Baud Rate
  9. 9 Mechanical Data
    1. 9.1 Packaging Information
  10. 10Package Option Addendum
    1. 10.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.19.2 ESM Channel Assignments

The ESM integrates all the device error conditions and groups them in the order of severity. Group1 is used for errors of the lowest severity while Group3 is used for errors of the highest severity. The device response to each error is determined by the severity group to which the error is connected. Table 5-45 lists the channel assignment for each group.

Table 5-44 ESM Groups

ERROR GROUP INTERRUPT CHARACTERISTICS INFLUENCE ON ERROR
TERMINAL
Group1 Maskable, low or high priority Configurable
Group2 Nonmaskable, high priority Fixed
Group3 No interrupt generated Fixed

Table 5-45 ESM Channel Assignments

ESM ERROR SOURCES GROUP CHANNELS
Group1
Reserved Group1 0
MibADC2 - parity Group1 1
DMA - MPU error for CPU (DMAOCP_MPVINT(0)) Group1 2
DMA - ECC uncorrectable error Group1 3
EPC - Correctable Error Group1 4
Reserved Group1 5
L2FMC - correctable error (implicit OTP read). Group1 6
NHET1 - parity Group1 7
HET TU1/HET TU2 - parity Group1 8
HET TU1/HET TU2 - MPU Group1 9
PLL1 - slip Group1 10
LPO Clock Monitor - interrupt Group1 11
FlexRay RAM - ECC uncorrectable error Group1 12
Reserved Group1 13
FlexRay TU RAM - ECC uncorrectable error (TU_UCT_err) Group1 14
VIM RAM - ECC uncorrectable error Group1 15
FlexRay TU - MPU violation (TU_MPV_err) Group1 16
MibSPI1 - ECC uncorrectable error Group1 17
MibSPI3 - ECC uncorrectable error Group1 18
MibADC1 - parity Group1 19
DMA - Bus Error Group1 20
DCAN1 - ECC uncorrectable error Group1 21
DCAN3 - ECC uncorrectable error Group1 22
DCAN2 - ECC uncorrectable error Group1 23
MibSPI5 - ECC uncorrectable error Group1 24
Reserved Group1 25
L2RAMW - correctable error Group1 26
Cortex-R5F CPU - self-test Group1 27
Reserved Group1 28
Reserved Group1 29
DCC1 - error Group1 30
CCM-R5F - self-test Group1 31
Reserved Group1 32
Reserved Group1 33
NHET2 - parity Group1 34
Reserved Group1 35
Reserved Group1 36
IOMM - Mux configuration error Group1 37
Power domain compare error Group1 38
Power domain self-test error Group1 39
eFuse farm – EFC error Group1 40
eFuse farm - self-test error Group1 41
PLL2 - slip Group1 42
Ethernet Controller master interface Group1 43
Reserved Group1 44
Reserved Group1 45
Cortex-R5F Core - cache correctable error event Group1 46
ACP d-cache invalidate Group1 47
Reserved Group1 48
MibSPI2 - ECC uncorrectable error Group1 49
MibSPI4 - ECC uncorrectable error Group1 50
DCAN4 - ECC uncorrectable error Group1 51
CPU Interconnect Subsystem - Global error Group1 52
CPU Interconnect Subsystem - Global Parity Error Group1 53
NHET1/2 - self-test error Group1 54
NMPU - EMAC MPU Error Group1 55
Reserved Group1 56
Reserved Group1 57
Reserved Group1 58
Reserved Group1 59
Reserved Group1 60
NMPU - PS_SCR_S MPU Error Group1 61
DCC2 - error Group1 62
Reserved Group1 63
Reserved Group1 64
Reserved Group1 65
Reserved Group1 66
Reserved Group1 67
Reserved Group1 68
NMPU - DMA Port A MPU Error Group1 69
DMA - Transaction Bus Parity Error Group1 70
FlexRay TU RAM- ECC single bit error (TU_SBE_err) Group1 71
FlexRay - ECC single bit error Group1 72
DCAN1 - ECC single bit error Group1 73
DCAN2 - ECC single bit error Group1 74
DCAN3 - ECC single bit error Group1 75
DCAN4 - ECC single bit error Group1 76
MIBSPI1 - ECC single bit error Group1 77
MIBSPI2 - ECC single bit error Group1 78
MIBSPI3 - ECC single bit error Group1 79
MIBSPI4 - ECC single bit error Group1 80
MIBSPI5 - ECC single bit error Group1 81
DMA - ECC single bit error Group1 82
VIM - ECC single bit error Group1 83
EMIF 64-bit Bridge I/F ECC uncorrectable error Group1 84
EMIF 64-bit Bridge I/F ECC single bit error Group1 85
Reserved Group1 86
Reserved Group1 87
DMA - Register Soft Error Group1 88
L2FMC - Register Soft Error Group1 89
SYS - Register Soft Error Group1 90
SCM - Time-out Error Group1 91
CCM-R5F - Operating status Group1 92
Reserved Group1 93-95
Group2
Reserved Group2 0
Reserved Group2 1
CCM-R5F - CPU compare error Group2 2
Cortex-R5F Core - All fatal bus error events. [Commonly caused by improper or incomplete ECC values in Flash.] Group2 3
Event Reference Event Description EVNTBUSm bit
0x71 Bus ECC 48
Reserved Group2 4
Reserved Group2 5
Reserved Group2 6
L2RAMW - Uncorrectable error type B Group2 7
Reserved Group2 8
Reserved Group2 9
Reserved Group2 10
Reserved Group2 11
Reserved Group2 12
Reserved Group2 13
Reserved Group2 14
Reserved Group2 15
Reserved Group2 16
L2FMC - parity error

  • Mcmd parity error on Idle command
  • POM idle state parity error
  • Port A/B Idle state parity error

 Group2 17
Reserved Group2 18
L2FMC - double bit ECC error-error due to implicit OTP reads Group2 19
Reserved Group2 20
EPC - Uncorrectable Error Group2 21
Reserved Group2 22
Reserved Group2 23
RTI_WWD_NMI Group2 24
CCM-R5F VIM compare error Group2 25
CPU1 AXIM Bus Monitor failure Group2 26
Reserved Group2 27
CCM-R5F - Power Domain monitor error Group2 28
Reserved Group2 29
Reserved Group2 30
Reserved Group2 31
Group3
Reserved Group3 0
eFuse Farm - autoload error Group3 1
Reserved Group3 2
L2RAMW - double bit ECC uncorrectable error Group3 3
Reserved Group3 4
Reserved Group3 5
Reserved Group3 6
Reserved Group3 7
Reserved Group3 8
Cortex-R5F Core - All fatal events (OR of: Group3 9
Event Reference Value Event Description EVNTBUSm Bit
0x60 Data Cache 33
0x61 Data Cache tag/dirty 34
Reserved Group3 10
Reserved Group3 11
CPU Interconnect Subsystem - Diagnostic Error Group3 12
L2FMC - uncorrectable error due to:
  • address parity/internal parity error
  • address tag
  • internal switch time-out
 Group3 13
L2RAMW - Uncorrectable error Type A Group3 14
L2RAMW - Address/Control parity error Group3 15
Reserved Group3 16
Reserved Group3 17
Reserved Group3 18
Reserved Group3 19
Reserved Group3 20
Reserved Group3 21
Reserved Group3 22
Reserved Group3 23
Reserved Group3 24