SCDS383E August   2018  – December 2019 TMUX6111 , TMUX6112 , TMUX6113

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Electrical Characteristics (Dual Supplies: ±15 V)
    6. 7.6 Switching Characteristics (Dual Supplies: ±15 V)
    7. 7.7 Electrical Characteristics (Single Supply: 12 V)
    8. 7.8 Switching Characteristics (Single Supply: 12 V)
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Truth Tables
  9. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1  On-Resistance
      2. 9.1.2  Off-Leakage Current
      3. 9.1.3  On-Leakage Current
      4. 9.1.4  Break-Before-Make Delay
      5. 9.1.5  Turn-On and Turn-Off Time
      6. 9.1.6  Charge Injection
      7. 9.1.7  Off Isolation
      8. 9.1.8  Channel-to-Channel Crosstalk
      9. 9.1.9  Bandwidth
      10. 9.1.10 THD + Noise
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Ultra-low Leakage Current
      2. 9.3.2 Ultra-low Charge Injection
      3. 9.3.3 Bidirectional and Rail-to-Rail Operation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
    3. 10.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

PW Package
16-Pin TSSOP
Top View
RTE Package
16-Pin WQFN
Top View

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME TSSOP WQFN
SEL1 1 15 I Logic control input 1.
D1 2 16 I/O Drain pin 1. Can be an input or output.
S1 3 1 I/O Source pin 1. Can be an input or output.
VSS 4 2 P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VSS and GND.
GND 5 3 P Ground (0 V) reference
S4 6 4 I/O Source pin 4. Can be an input or output.
D4 7 5 I/O Drain pin 4. Can be an input or output.
SEL4 8 6 I Logic control input 4.
SEL3 9 7 I Logic control input 3.
D3 10 8 I/O Drain pin 3. Can be an input or output.
S3 11 9 I/O Source pin 3. Can be an input or output.
NC 12 10 – No internal connection.
VDD 13 11 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
S2 14 12 I/O Source pin 2. Can be an input or output.
D2 15 13 I/O Drain pin 2. Can be an input or output.
SEL2 16 14 I Logic control input 2.
– - EP – Exposed Pad. The exposed pad is electrically connected to VSS internally. Connect EP to VSS to achieve rated thermal and ESD performance.
(1) I = input, O = output, I/O = input and output, P = power