SLOS474E August   2005  – March 2016 TPA2005D1-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Differential Amplifier
        1. 9.3.1.1 Advantages Of Fully Differential Amplifiers
      2. 9.3.2 Efficiency and Thermal Information
      3. 9.3.3 Eliminating the Output Filter With the TPA2005D1-Q1
        1. 9.3.3.1 Effect On Audio
        2. 9.3.3.2 Traditional Class-D Modulation Scheme
        3. 9.3.3.3 TPA2005D1-Q1 Modulation Scheme
        4. 9.3.3.4 Efficiency: Why You Must Use a Filter With The Traditional Class-D Modulation Scheme
        5. 9.3.3.5 Effects Of Applying a Square Wave Into a Speaker
        6. 9.3.3.6 When to Use an Output Filter
    4. 9.4 Device Functional Modes
      1. 9.4.1 Summing Input Signals With the TPA2005D1-Q1
        1. 9.4.1.1 Summing Two Differential Input Signals
        2. 9.4.1.2 Summing A Differential Input Signal And A Single-Ended Input Signal
        3. 9.4.1.3 Summing Two Single-Ended Input Signals
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPA2005D1-Q1 With Differential Input
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Component Selection
          2. 10.2.1.2.2 Input Resistors (RI)
          3. 10.2.1.2.3 Decoupling Capacitor (CS)
        3. 10.2.1.3 Application Curve
      2. 10.2.2 TPA2005D1-Q1 With Differential Input and Input Capacitors
        1. 10.2.2.1 Detailed Design Requirements
          1. 10.2.2.1.1 Input Capacitors (CI)
      3. 10.2.3 TPA2005D1-Q1 With Single-Ended Input
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Location
      2. 12.1.2 Trace Width
      3. 12.1.3 8-Pin QFN (DRB) Layout
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resource
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Supply voltage(2) In active mode –0.3 6 V
In SHUTDOWN mode –0.3 7 V
VI Input voltage –0.3 VDD + 0.3 V V
RL Load resistance 2.5 ≤ VDD ≤ 4.2 V 3.2 Ω
4.2 < VDD ≤ 6 V 6.4 Ω
TA Operating free-air temperature Non T-suffix –40 85 °C
T-suffix –40 105
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) For the MSOP (DGN) package option, the maximum VDD should be limited to 5 V if short-circuit protection is desired.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

MIN MAX UNIT
VDD Supply voltage 2.5 5.5 V
VIH High-level input voltage SHUTDOWN 2 VDD V
VIL Low-level input voltage SHUTDOWN 0 0.7 V
RI Input resistor Gain ≤ 20 V/V (26 dB) 15 kΩ
VIC Common-mode input voltage VDD = 2.5 V, 5.5 V, CMRR ≤ –49 dB 0.5 VDD – 0.8 V
TA Operating free-air temperature Non T-suffix –40 85 °C
T-suffix –40 105

7.4 Thermal Information

THERMAL METRIC(1) TPA2005D1-Q1 UNIT
DRB (SON) DGN
(MSOP PowerPAD)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 49.5 57 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62.1 53.8 °C/W
RθJB Junction-to-board thermal resistance 24.8 33.7 °C/W
ψJT Junction-to-top characterization parameter 1.3 1.9 °C/W
ψJB Junction-to-board characterization parameter 24.9 33.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.9 6.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOS| Output offset voltage (measured differentially) VI = 0 V, AV = 2 V/V, VDD = 2.5 V to 5.5 V 25 mV
PSRR Power-supply rejection ratio VDD = 2.5 V to 5.5 V –75 –55 dB
CMRR Common-mode rejection ratio VDD = 2.5 V to 5.5 V,
VIC = VDD / 2 to 0.5 V,
VIC = VDD / 2 to VDD – 0.8 V		 TA = 25°C –68 –49 dB
TA = –40°C to 85°C –35
|IIH| High-level input current VDD = 5.5 V, VI = 5.8 V 50 μA
|IIL| Low-level input current VDD = 5.5 V, VI = 0.3 V TA = –40°C to 85°C 4 μA
TA = –40°C to 105°C 12
I(Q) Quiescent current VDD = 5.5 V, no load 3.4 4.5 mA
VDD = 3.6 V, no load 2.8
VDD = 2.5 V, no load 2.2 3.2
I(SD) Shutdown current V (SHUTDOWN) = 0.8 V,
VDD = 2.5 V to 5.5 V		 TA = –40°C to 85°C 0.5 2 μA
TA = –40°C to 105°C 2.5
rDS(on) Static drain-source on-state resistance VDD = 2.5 V 770 mΩ
VDD = 3.6 V 590
VDD = 5.5 V 500
Output impedance in SHUTDOWN V (SHUTDOWN) = 0.8 V >1 kΩ
f(sw) Switching frequency VDD = 2.5 V to 5.5 V 200 250 300 kHz
Gain
TPA2005D1-Q1 Qmin_los474.gif
TPA2005D1-Q1 Qtyp_los474.gif
TPA2005D1-Q1 Qmax_los474.gif
TPA2005D1-Q1 Qunit_los474.gif

7.6 Operating Characteristics

TA = 25°C, Gain = 2 V/V, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PO Output power THD + N= 1%, f = 1 kHz,
RL = 8 Ω		 VDD = 5 V 1.18 W
VDD = 3.6 V 0.58
VDD = 2.5 V 0.26
THD + N= 10%, f = 1 kHz,
RL = 8 Ω		 VDD = 5 V 1.45
VDD = 3.6 V 0.75
VDD = 2.5 V 0.35
THD+N Total harmonic distortion plus noise PO = 1 W, f = 1 kHz, RL = 8 Ω VDD = 5 V 0.18%
PO = 0.5 W, f = 1 kHz, RL = 8 Ω VDD = 3.6 V 0.19%
PO = 200 mW, f = 1 kHz, RL = 8 Ω VDD = 2.5 V 0.20%
kSVR Supply ripple rejection ratio f = 217 Hz, V(RIPPLE) = 200 mVpp,
Inputs ac-grounded with Ci = 2 μF		 VDD = 3.6 V –71 dB
SNR Signal-to-noise ratio PO= 1 W, RL = 8 Ω VDD = 5 V 97 dB
Vn Output voltage noise VDD = 3.6 V, f = 20 Hz to 20 kHz,
Inputs ac-grounded with Ci = 2 μF		 No weighting 48 μVRMS
A weighting 36
CMRR Common-mode rejection ratio VIC = 1 Vpp , f = 217 Hz VDD = 3.6 V –63 dB
ZI Input impedance 142 150 158 kΩ
Start-up time from shutdown VDD = 3.6 V 9 ms

7.7 Typical Characteristics

TPA2005D1-Q1 tc_eff_op_los369.gif
Figure 1. Efficiency vs Output Power
TPA2005D1-Q1 effa_po_los369.gif
Figure 3. Efficiency vs Output Power
TPA2005D1-Q1 tc_supcurr_los369.gif
Figure 5. Supply Current vs Output Power
TPA2005D1-Q1 tc_Qcurr_los369.gif
Figure 7. Quiescent Current vs Supply Voltage
TPA2005D1-Q1 tc_OutpwrSV_los369.gif
Figure 9. Output Power vs Supply Voltage
TPA2005D1-Q1 poa_rl_los369.gif
Figure 11. Output Power vs Load Resistance
TPA2005D1-Q1 thdn_po_los369.gif Figure 13. Total Harmonic Distortion + Noise vs Output Power
TPA2005D1-Q1 tc_totHDN1_los369.gif Figure 15. Total Harmonic Distortion + Noise vs Output Power
TPA2005D1-Q1 tc_totHNDF1_los369.gif Figure 17. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 tc_totHDNF3_los369.gif
Figure 19. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 thdnb_f_los369.gif
Figure 21. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 tc_totHarm_los369.gif
Figure 23. Total Harmonic Distortion + Noise vs
Common Mode Input Voltage
TPA2005D1-Q1 tc_SupVRR1_los369.gif
Figure 25. Supply Voltage Rejection Ratio vs Frequency 25
TPA2005D1-Q1 tc_SupVCM_los369.gif
Figure 27. Supply Voltage Rejection Ratio vs
Common-Mode Input Voltage
TPA2005D1-Q1 tc_CMRR_CM_los369.gif Figure 29. Common-Mode Rejection Ratio vs
Common-Mode Input Voltage
TPA2005D1-Q1 tc_eff_op1_los369.gif
Figure 2. Efficiency vs Output Power
TPA2005D1-Q1 tc_powdissp_los369.gif
Figure 4. Power Dissipation vs Output Power
TPA2005D1-Q1 tc_supcurr1_los369.gif
Figure 6. Supply Current vs Output Power
TPA2005D1-Q1 tc_shutcurr_los369.gif
Figure 8. Shutdown Current vs Shutdown Voltage
TPA2005D1-Q1 poa_vdd_los369.gif
Figure 10. Output Power vs Supply Voltage
TPA2005D1-Q1 po2a_rl_los369.gif
Figure 12. Output Power vs Load Resistance
TPA2005D1-Q1 tc_totHDN_los369.gif Figure 14. Total Harmonic Distortion + Noise vs Output Power
TPA2005D1-Q1 tc_totHNDF_los369.gif Figure 16. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 tc_totHDNF2_los369.gif Figure 18. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 thdna_f_los369.gif
Figure 20. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 thdnc_f_los369.gif
Figure 22. Total Harmonic Distortion + Noise vs Frequency
TPA2005D1-Q1 tc_SupVRR_los369.gif
Figure 24. Supply Voltage Rejection Ratio vs Frequency
TPA2005D1-Q1 tc_SupVRR2_los369.gif
Figure 26. Supply Voltage Rejection Ratio vs Frequency
TPA2005D1-Q1 tc_CMRR_F_los369.gif
Figure 28. Common-Mode Rejection Ratio vs Frequency