SLVSDG2G July   2016  – December  2019 TPS2660

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Simplified Schematic
  3. 3 Description
    1.     Reverse Input Polarity Protection at –60-V Supply
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Lockout (UVLO)
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Reverse Input Supply Protection
      4. 9.3.4 Hot Plug-In and In-Rush Current Control
      5. 9.3.5 Overload and Short Circuit Protection
        1. 9.3.5.1 Overload Protection
          1. 9.3.5.1.1 Active Current Limiting
          2. 9.3.5.1.2 Electronic Circuit Breaker with Overload Timeout, MODE = OPEN
        2. 9.3.5.2 Short Circuit Protection
          1. 9.3.5.2.1 Start-Up With Short-Circuit On Output
        3. 9.3.5.3 FAULT Response
          1. 9.3.5.3.1 Look Ahead Overload Current Fault Indicator
        4. 9.3.5.4 Current Monitoring
        5. 9.3.5.5 IN, OUT, RTN, and GND Pins
        6. 9.3.5.6 Thermal Shutdown
        7. 9.3.5.7 Low Current Shutdown Control (SHDN)
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step by Step Design Procedure
        2. 10.2.2.2 Programming the Current-Limit Threshold—R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Programming Current Monitoring Resistor—RIMON
        5. 10.2.2.5 Setting Output Voltage Ramp Time—(tdVdT)
          1. 10.2.2.5.1 Case 1: Start-Up Without Load—Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.5.2 Case 2: Start-Up With Load—Output Capacitance C(OUT) and Load Draws Current During Start-Up
          3. 10.2.2.5.3 Support Component Selections—RFLTb and C(IN)
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Acive ORing Operation
      2. 10.3.2 Field Supply Protection in PLC, DCS I/O Modules
      3. 10.3.3 Simple 24-V Power Supply Path Protection
    4. 10.4 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHF|24
  • PWP|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.1 Layout Guidelines

  • For all the applications, a 0.1 µF or higher value ceramic decoupling capacitor is recommended between IN terminal and GND.
  • The optimum placement of decoupling capacitor is closest to the IN and GND terminals of the device. Care must be taken to minimize the loop area formed by the bypass-capacitor connection, the IN terminal, and the GND terminal of the IC. See Figure 71 and Figure 72 for PCB layout examples with HTSSOP and VQFN packages respectively.
  • High current carrying power path connections must be as short as possible and must be sized to carry atleast twice the full-load current.
  • RTN, which is the reference ground for the device must be a copper plane or island.
  • Locate all the TPS2660x support components R(ILIM), C(dVdT), R(IMON), and MODE, UVLO, OVP resistors close to their connection pin. Connect the other end of the component to the RTN with shortest trace length.
  • The trace routing for the RILIM and R(IMON) components to the device must be as short as possible to reduce parasitic effects on the current limit and current monitoring accuracy. These traces must not have any coupling to switching signals on the board.
  • Protection devices such as TVS, snubbers, capacitors, or diodes must be placed physically close to the device they are intended to protect, and routed with short traces to reduce inductance. For example, a protection Schottky diode is recommended to address negative transients due to switching of inductive loads, and it must be physically close to the OUT and GND pins.
  • Thermal Considerations: When properly mounted, the PowerPAD package provides significantly greater

    • cooling ability. To operate at rated power, the PowerPAD must be soldered directly to the board RTN plane directly under the device. Other planes, such as the bottom side of the circuit board can be used to increase heat sinking in higher current applications. Designs that do not need reverse input polarity protection can have RTN, GND and PowerPAD connected together. PowerPAD in these designs can be connected to the PCB ground plane.