SLVSA75A Data sheet

SLVSA75A July 2010 – August 2015 TPS386596

PRODUCTION DATA.

Package Options

Mechanical Data (Package|Pins)

DGK|8
- MPDS028D

Thermal pad, mechanical data (Package|Pins)

DGK|8
- QFND519

Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted).⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
Voltage	Input, V_DD	–0.3	7	V
Voltage	V_MR, V_SENSE1, V_SENSE2, V_SENSE3, V_SENSE4, V_RESET	–0.3	7	V
Current	RESET pin		5	mA
Power dissipation	Continuous total	See Thermal Information
Temperature	Operating virtual junction, T_J	–40	150	°C
	Operating ambient, T_A	–40	125
	Storage, T_stg	–65	150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) As a result of the low dissipated power in this device, it is assumed that T_J = T_A.

6.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge	Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾	±2000	V
V_(ESD)	Electrostatic discharge	Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾	±500	V

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating junction temperature range (unless otherwise noted).

	MIN	NOM	MAX	UNIT
V_DD	1.8		6.5	V
V_SENSE⁽¹⁾	0		V_DD	V
V_MR	0		V_DD	V
V_RESET	0		6.5	V
R_PULL-UP	6.5	100	10,000	kΩ
T_J	–40	25	125	°C

(1) All sense inputs.

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		TPS386596	UNIT
		DGK (VSSOP)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	174	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	45.5	°C/W
R_θJB	Junction-to-board thermal resistance	94	°C/W
ψ_JT	Junction-to-top characterization parameter	1.9	°C/W
ψ_JB	Junction-to-board characterization parameter	92.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Over the operating temperature range of T_J = –40°C to 125°C. 1.8 V < V_DD < 6.5 V, R_RESET = 100 kΩ to V_DD, C_RESET = 50 pF to GND, unless otherwise noted. Typical values are at T_J = 25°C.

PARAMETER		TEST CONDITIONS	MIN	TYP	MAX	UNIT
V_DD	Input supply		1.8		6.5	V
I_DD	Supply current (current into VDD pin)	V_CC = 3.3 V, RESET not asserted		7	19	µA
I_DD	Supply current (current into VDD pin)	V_CC = 6.5 V, RESET not asserted		7.5	22	µA
	Power-on reset voltage⁽¹⁾⁽²⁾	V_OL(max) = 0.2 V, I_RESET = 15 µA			0.9	V
V_ITn	Negative-going input threshold accuracy	SENSE1	2.87	2.90	2.93	V
V_ITn	Negative-going input threshold accuracy	SENSE2, SENSE3, SENSE4	396	400	404	mV
V_HYS	Hysteresis (positive-going) on V_ITn	SENSE1		25	72	mV
V_HYS	Hysteresis (positive-going) on V_ITn	SENSE2, SENSE3, SENSE4		3.5	10	mV
I_SENSE1	Input current at SENSE1	VSENSE1 = 3.3 V	2.2	2.75	3.3	µA
I_SENSEn	Input current at SENSEn pin, n = 2, 3, 4	VSENSEn = 0.42 V	–25		25	nA
t_d	RESETdelay time		30	50	70	ms
V_IL	MR logic low input		0		0.3V_DD	V
V_IH	MR logic high input		0.7V_DD			V
R_{MR_Pullup}	Internal pullup resistor on MR pin to V_DD			100		kΩ
V_OL	Low-level RESET output voltage	I_OL = 1 mA			0.4	V
V_OL	Low-level RESET output voltage	SENSEn = 0 V, 1.3 V < V_DD < 1.8 V, I_OL = 0.4 mA⁽¹⁾			0.3	V
I_LKG	RESET leakage current	V_RESET = 6.5 V, RESET not asserted	–300		300	nA
C_IN	Input pin capacitance			5		pF

(1) These specifications are out of recommended V_DD range and only define RESET output performance during V_DD ramp up.

(2) The lowest supply voltage (V_DD) at which RESET becomes active. t_RISE(VDD) ≥ 15 µs/V.

6.6 Timing Requirements

Over the operating temperature range of T_J = –40°C to 125°C. 1.8 V < V_DD < 6.5 V, R_RESET = 100 kΩ to V_DD, C_RESET = 50 pF to GND, unless otherwise noted. Typical values are at T_J = 25°C.

			MIN	NOM	MAX	UNIT
t_W	Input pulse width to SENSEn and MR pins	SENSEm: 1.05 V_IT ≥ 0.95 V_IT		4		μs
t_W	Input pulse width to SENSEn and MR pins	MR: 0.7 V_DD ≥ 0.3 V_DD		50		ns

6.7 Switching Characteristics

Over the operating temperature range of T_J = –40°C to 125°C. 1.8 V < V_DD < 6.5 V, R_RESET = 100 kΩ to V_DD, C_RESET = 50 pF to GND, unless otherwise noted. Typical values are at T_J = 25°C.