SLUSBO6C JANUARY   2014  – October 2018 TPS40425

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1. 3.1 Simplified Application Diagram (Dual Output)
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Asynchronous Pulse Injection (API)
      2. 7.3.2  Adaptive Voltage Scaling (AVS)
      3. 7.3.3  Switching Frequency and Synchronization
      4. 7.3.4  Voltage Reference
      5. 7.3.5  Output Voltage and Remote Sensing Amplifier
      6. 7.3.6  Current Sensing and Temperature Sensing Modes
        1. 7.3.6.1 Non Smart-Power Operation
        2. 7.3.6.2 Smart-Power Operation.
      7. 7.3.7  Current Sensing
      8. 7.3.8  Temperature Sensing
      9. 7.3.9  Current Sharing
      10. 7.3.10 Linear Regulators
      11. 7.3.11 Power Sequence Between TPS40425 Device and Power Stage
      12. 7.3.12 PWM Signal
        1. 7.3.12.1 PWM Behavior During Soft-start Operation
      13. 7.3.13 Startup and Shutdown
      14. 7.3.14 Pre-Biased Output Start-up
      15. 7.3.15 PGOOD Indication
      16. 7.3.16 Overcurrent Protection
      17. 7.3.17 Overvoltage/Undervoltage Protection
      18. 7.3.18 Overtemperature Fault Protection
      19. 7.3.19 Input Undervoltage Lockout (UVLO)
      20. 7.3.20 Fault Communication
      21. 7.3.21 Fault Protection Summary
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Multi-Phase Applications
    6. 7.6 Register Maps
      1. 7.6.1 PMBus General Description
      2. 7.6.2 PMBus Functionality
        1. 7.6.2.1 PMBus Address
        2. 7.6.2.2 PMBus Connections
        3. 7.6.2.3 PMBus Data Format
        4. 7.6.2.4 PMBus Output Voltage Adjustment
          1. 7.6.2.4.1 No Margin Voltage
          2. 7.6.2.4.2 Margin High Voltage State
          3. 7.6.2.4.3 Margin Low State
      3. 7.6.3 Reading the Output Current
      4. 7.6.4 Soft-Start Time
      5. 7.6.5 Turn-On/Turn-Off Delay and Sequencing
    7. 7.7 Supported PMBus Commands
      1. 7.7.1  PAGE (00h)
      2. 7.7.2  OPERATION (01h)
      3. 7.7.3  ON_OFF_CONFIG (02h)
      4. 7.7.4  CLEAR_FAULTS (03h)
      5. 7.7.5  WRITE_PROTECT (10h)
      6. 7.7.6  STORE_USER_ALL (15h)
      7. 7.7.7  RESTORE_USER_ALL (16h)
      8. 7.7.8  CAPABILITY (19h)
      9. 7.7.9  VOUT_MODE (20h)
      10. 7.7.10 VIN_ON (35h)
      11. 7.7.11 VIN_OFF (36h)
      12. 7.7.12 IOUT_CAL_GAIN (38h)
      13. 7.7.13 IOUT_CAL_OFFSET (39h)
      14. 7.7.14 IOUT_OC_FAULT_LIMIT (46h)
      15. 7.7.15 IOUT_OC_FAULT_RESPONSE (47h)
      16. 7.7.16 IOUT_OC_WARN_LIMIT (4Ah)
      17. 7.7.17 OT_FAULT_LIMIT (4Fh)
      18. 7.7.18 OT_WARN_LIMIT (51h)
      19. 7.7.19 TON_RISE (61h)
      20. 7.7.20 STATUS_BYTE (78h)
      21. 7.7.21 STATUS_WORD (79h)
      22. 7.7.22 STATUS_VOUT (7Ah)
      23. 7.7.23 STATUS_IOUT (7Bh)
      24. 7.7.24 STATUS_TEMPERATURE (7Dh)
      25. 7.7.25 STATUS_CML (7Eh)
      26. 7.7.26 STATUS_MFR_SPECIFIC (80h)
      27. 7.7.27 READ_VOUT (8Bh)
      28. 7.7.28 READ_IOUT (8Ch)
      29. 7.7.29 READ_TEMPERATURE_2 (8Eh)
      30. 7.7.30 PMBus_REVISION (98h)
      31. 7.7.31 MFR_SPECIFIC_00 (D0h)
      32. 7.7.32 MFR_SPECIFIC_04 (VREF_TRIM) (D4h)
      33. 7.7.33 MFR_SPECIFIC_05 (STEP_VREF_MARGIN_HIGH) (D5h)
      34. 7.7.34 MFR_SPECIFIC_06 (STEP_VREF_MARGIN_LOW) (D6h)
      35. 7.7.35 MFR_SPECIFIC_07 (PCT_VOUT_FAULT_PG_LIMIT) (D7h)
      36. 7.7.36 MFR_SPECIFIC_08 (SEQUENCE_TON_TOFF_DELAY) (D8h)
      37. 7.7.37 MFR_SPECIFIC_16 (COMM_EEPROM_SPARE) (E0h)
      38. 7.7.38 MFR_SPECIFIC_21 (OPTIONS) (E5h)
      39. 7.7.39 MFR_SPECIFIC_22 (PWM_OSC_SELECT) (E6h)
      40. 7.7.40 MFR_SPECIFIC_23 (MASK SMBALERT) (E7h)
      41. 7.7.41 MFR_SPECIFIC_25 (AVS_CONFIG) (E9h)
      42. 7.7.42 MFR_SPECIFIC_26 (AVS_ADDRESS) (EAh)
      43. 7.7.43 MFR_SPECIFIC_27 (AVS_DAC_DEFAULT) (EBh)
      44. 7.7.44 MFR_SPECIFIC_28 (AVS_CLAMP_HI) (ECh)
      45. 7.7.45 MFR_SPECIFIC_29 (AVS_CLAMP_LO) (EDh)
      46. 7.7.46 MFR_SPECIFIC_30 (TEMP_OFFSET) (EEh)
      47. 7.7.47 MFR_SPECIFIC_32 (API_OPTIONS) (F0h)
      48. 7.7.48 MFR_SPECIFIC_44 (DEVICE_CODE) (FCh)
  8. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Dual-Output Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Design Procedure
        1. 8.2.3.1  Switching Frequency Selection
        2. 8.2.3.2  Inductor Selection
        3. 8.2.3.3  Output Capacitor Selection
          1. 8.2.3.3.1 Output Voltage Deviation During Load Transient
          2. 8.2.3.3.2 Output Voltage Ripple
        4. 8.2.3.4  Input Capacitor Selection
        5. 8.2.3.5  VDD, BP5, BP3 Bypass Capacitor
        6. 8.2.3.6  R-C Snubber
        7. 8.2.3.7  Current and Temperature Sensor
        8. 8.2.3.8  Power Sequence Between the TPS40425 Device and Power Stage
        9. 8.2.3.9  Output Voltage Setting and Frequency Compensation Selection
        10. 8.2.3.10 Key PMBus Parameter Selection
          1. 8.2.3.10.1 MFR_SPECIFIC_21 (OPTIONS)
            1. 8.2.3.10.1.1 IOUT_CAL_GAIN
            2. 8.2.3.10.1.2 Enable and UVLO
            3. 8.2.3.10.1.3 Soft-Start Time
            4. 8.2.3.10.1.4 Overcurrent Threshold and Response
      4. 8.2.4 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Guidelines for TPS40425 Device
      2. 10.1.2 Layout Guidelines for Power Stage Device
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Texas Instruments Fusion Digital Power Designer
        2. 11.1.1.2 TPS40k Loop Compensation Tool
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines for TPS40425 Device

  • If the analog ground (AGND) and power ground (PGND) pins are separated on the board, the power stage and related components should be terminated or bypassed to the power ground. Signal components of TPS40425 device should be terminated or bypassed to the analog ground. Connect the thermal pad of the device to power ground plane through sufficient vias. Connect AGND and PGND pins of the device to the thermal pad directly. The connection between AGND pin and thermal pad serves as the only connection between analog ground and power ground.
  • If one common ground is used on the board, the TPS40425 device and related components must be placed on a noise quiet area which is isolated from fast switching voltage and current paths.
  • Maintain placement of signal components and regulator bypass capacitors local to the TPS40425 device. Place them as close as possible to the terminals to which they are connected. These components include the feedback resistors, frequency compensation, the RT resistor, ADDR0 and ADDR1 resistors, as well as bypass capacitors for BP3, BP5, and VDD.
  • The VSNSx and GSNSx must be routed as a differential pair on noise quiet area.
  • The CSxP and CSxN must be routed as a differential pair on noise quiet area. Place a capacitor with a value or 0.22-uF or larger between CSxP and CSxN. Placed that capacitor as close to the TPS40425 device and as possible. Place a 0.1-uF capacitor between CSxN and ground, and place it close to the TPS40425 device.
  • Place the thermal transistor close to the inductor. Place a bypass capacitor with a value of 1 nF or larger close to the transistor. Use a separate ground trace for the transistor. Place another 1-nF bypass capacitor close to TSNSx terminal.