SLVSD45 December   2015 TPS50601-SP

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VIN and Power VIN Pins (VIN and PVIN)
      2. 8.3.2  PVIN vs Frequency
      3. 8.3.3  Voltage Reference
      4. 8.3.4  Adjusting the Output Voltage
      5. 8.3.5  Maximum Duty Cycle Limit
      6. 8.3.6  PVIN vs Frequency
      7. 8.3.7  Safe Start-Up into Prebiased Outputs
      8. 8.3.8  Error Amplifier
      9. 8.3.9  Slope Compensation
      10. 8.3.10 Enable and Adjust UVLO
      11. 8.3.11 Adjustable Switching Frequency and Synchronization (SYNC)
      12. 8.3.12 Slow Start (SS/TR)
      13. 8.3.13 Power Good (PWRGD)
      14. 8.3.14 Bootstrap Voltage (BOOT) and Low Dropout Operation
      15. 8.3.15 Sequencing (SS/TR)
      16. 8.3.16 Output Overvoltage Protection (OVP)
      17. 8.3.17 Overcurrent Protection
        1. 8.3.17.1 High-Side MOSFET Overcurrent Protection
        2. 8.3.17.2 Low-Side MOSFET Overcurrent Protection
      18. 8.3.18 TPS50601-SP Thermal Shutdown
      19. 8.3.19 Turn-On Behavior
      20. 8.3.20 Small Signal Model for Loop Response
      21. 8.3.21 Simple Small Signal Model for Peak Current Mode Control
      22. 8.3.22 Small Signal Model for Frequency Compensation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Fixed-Frequency PWM Control
      2. 8.4.2 Continuous Current Mode (CCM) Operation
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Operating Frequency
        2. 9.2.2.2 Output Inductor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Input Capacitor Selection
        5. 9.2.2.5 Slow Start Capacitor Selection
        6. 9.2.2.6 Bootstrap Capacitor Selection
        7. 9.2.2.7 Undervoltage Lockout (UVLO) Set Point
        8. 9.2.2.8 Output Voltage Feedback Resistor Selection
          1. 9.2.2.8.1 Minimum Output Voltage
        9. 9.2.2.9 Compensation Component Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Device Nomenclature

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

13.1 Device Nomenclature

    KGD Known good die
    RHA Radiation hardness assurance for space systems
    5962R10221 Same device as TPS50601-SP, shown with standard microcircuit drawing (SMD)
    TPS50601-SP Same device as 5962R10221, shown with TI package drawing