SLVS757D March   2007  – December 2014 TPS5450

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator Frequency
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Enable (ENA) and Internal Slow-Start
      4. 7.3.4  Undervoltage Lockout (UVLO)
      5. 7.3.5  Boost Capacitor (BOOT)
      6. 7.3.6  Output Feedback (VSENSE) and Internal Compensation
      7. 7.3.7  Voltage Feed-Forward
      8. 7.3.8  Pulse-Width-Modulation (PWM) Control
      9. 7.3.9  Overcurrent Limiting
      10. 7.3.10 Overvoltage Protection
      11. 7.3.11 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation near Minimum Input Voltage
      2. 7.4.2 Operation With ENA Control
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Switching Frequency
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitors
        4. 8.2.2.4 Output Filter Components
        5. 8.2.2.5 Inductor Selection
        6. 8.2.2.6 Capacitor Selection
        7. 8.2.2.7 Boot Capacitor
        8. 8.2.2.8 Catch Diode
        9. 8.2.2.9 Advanced Information
          1. 8.2.2.9.1 Output Voltage Limitations
          2. 8.2.2.9.2 Internal Compensation Network
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Calculations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Wide Input Voltage Range: 5.5 V to 36 V
  • Up to 5-A Continuous (6-A Peak) Output Current
  • High Efficiency Greater Than 90% Enabled by 110-mΩ Integrated MOSFET Switch
  • Wide Output Voltage Range: Adjustable Down to 1.22 V With 1.5% Initial Accuracy
  • Internal Compensation Minimizes External Part Count
  • Fixed 500-kHz Switching Frequency for Small Filter Size
  • 18-μA Shutdown Supply Current
  • Improved Line Regulation and Transient Response by Input Voltage Feed Forward
  • System Protected by Overcurrent Limiting, Overvoltage Protection and Thermal Shutdown
  • –40°C to 125°C Operating Junction Temperature Range
  • Available in Small Thermally Enhanced 8-Pin SOIC PowerPAD™ Package

2 Applications

  • High Density Point-of-Load Regulators
  • LCD Displays, Plasma Displays
  • Battery Chargers
  • 12-V and 24-V Distributed Power Systems

3 Description

The TPS5450 is a high-output-current PWM converter that integrates a low-resistance, high-side N-channel MOSFET. Included on the substrate with the listed features are a high-performance voltage error amplifier that provides tight voltage regulation accuracy under transient conditions; an undervoltage-lockout circuit to prevent start-up until the input voltage reaches 5.5 V; an internally set slow-start circuit to limit inrush currents; and a voltage feed-forward circuit to improve the transient response. Using the ENA pin, shutdown supply current is reduced to 18 μA typically. Other features include an active-high enable, overcurrent limiting, overvoltage protection and thermal shutdown. To reduce design complexity and external component count, the TPS5450 feedback loop is internally compensated.

The TPS5450 device is available in a thermally-enhanced, 8-pin SOIC PowerPAD package. TI provides evaluation modules and software tool to aid in achieving high-performance power supply designs to meet aggressive equipment development cycles.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPS5450 HSOP (8) 4.89 mm × 3.90 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.
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