11 Device and Documentation Support
11.1 Device Support
11.1.1 Development Support
184.108.40.206 Custom Design With WEBENCH Tools
Click here to create a custom design using the TPS54620 device with the WEBENCH® Power Designer.
- Start by entering the VIN, VOUT, and IOUT requirements.
- Optimize the design for key parameters like efficiency, footprint, and cost by using the optimizer dial and compare this design with other possible solutions from Texas Instruments.
- WEBENCH Power Designer provides a customized schematic and a list of materials with real-time pricing and component availability.
- In most cases, users will also be able to:
- Run electrical simulations to see important waveforms and circuit performance,
- Run thermal simulations to understand the thermal performance of your board,
- Export your customized schematic and layout into popular CAD formats,
- Print PDF reports for the design, and share the design with colleagues.
- Get more information about WEBENCH tools at www.ti.com/webench.
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
SwitcherPro, E2E are trademarks of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.