A proper layout is critical for the operation of a switched mode power supply, even more at high switching frequencies. Therefore the PCB layout of the TPS6215xA-Q1 demands careful attention to ensure operation and to get the performance specified. A poor layout can lead to issues like poor regulation (both line and load), stability and accuracy weaknesses, increased EMI radiation and noise sensitivity. The layout also influences the thermal performance of the solution by its power dissipation capabilities.
See Figure 50 for the recommended layout of the TPS62150A-Q1, which is designed for common external ground connections. Therefore both AGND and PGND pins are directly connected to the Exposed Thermal Pad. On the PCB, the direct common ground connection of AGND and PGND to the Exposed Thermal Pad and the system ground (ground plane) is mandatory. Also connect the VOS pin in the shortest way to the VOUT potential at the output capacitor.
Provide low inductive and resistive paths for loops with high di/dt. Therefore paths conducting the switched load current should be as short and wide as possible. Provide low capacitive paths (with respect to all other nodes) for wires with high dv/dt. Therefore the input and output capacitance should be placed as close as possible to the IC pins and parallel wiring over long distances as well as narrow traces should be avoided. Loops which conduct an alternating current should outline an area as small as possible, as this area is proportional to the energy radiated.
Sensitive nodes like FB and VOS need to be connected with short wires and not nearby high dv/dt signals (e.g. SW). As they carry information about the output voltage, they should be connected as close as possible to the actual output voltage (at the output capacitor). The capacitor on the SS/TR pin and on AVIN as well as the FB resistors, R1 and R2, should be kept close to the IC and connect directly to those pins and the AGND pin.
The Exposed Thermal Pad must be soldered to the circuit board for mechanical reliability and to achieve appropriate power dissipation.