SBVS277 July   2019 TPS7A02

ADVANCE INFORMATION for pre-production products; subject to change without notice.  

  1. Features
  2. Applications
  3. Description
    1.     Load Transient Response (VIN = VOUT + 1 V, CIN = 0.47 µF, COUT = 1 µF, IOUT = 1 mA to 50 mA in 1 µs)
    2.     Quiescent Current vs Input Voltage (IOUT = 0 A, COUT = 1 µF)
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: DQN, DBV
    2.     Pin Functions: YKA
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Excellent Transient Response
      2. 7.3.2 Active Discharge (P-Version Only)
      3. 7.3.3 Low IQ in Dropout
      4. 7.3.4 Smart Enable
      5. 7.3.5 Dropout Voltage
      6. 7.3.6 Foldback Current Limit
      7. 7.3.7 Undervoltage Lockout (UVLO)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Recommended Capacitor Types
      2. 8.1.2 Input and Output Capacitor Requirements
      3. 8.1.3 Load Transient Response
      4. 8.1.4 Undervoltage Lockout (UVLO) Operation
      5. 8.1.5 Power Dissipation (PD)
        1. 8.1.5.1 Estimating Junction Temperature
        2. 8.1.5.2 Recommended Area for Continuous Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Features

  • Ultra-low IQ: 25 nA (typ), even in dropout
  • Shutdown IQ: 3 nA (typ)
  • Excellent transient response (1 mA to 50 mA)
    • < 10-µs settling time
    • 100-mV undershoot
  • Packages:
    • 1.0-mm × 1.0-mm X2SON
    • SOT23-5 (preview)
    • 0.65-mm x 0.65-mm DSBGA (preview)
  • Input voltage range: 1.5 V to 6.0 V
  • Output voltage range: 0.8 V to 5.0 V (fixed)
  • Output accuracy: 1.5% over temperature
  • Smart enable pulldown
  • Very low dropout:
    • 205 mV (max) at 200 mA (VOUT = 3.3 V)
  • Stable with a 1-µF or larger capacitor