SBVS228B July   2013  – March 2015 TPS7A3501

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Filter Operation
      2. 7.3.2 Minimum Load
      3. 7.3.3 Shutdown
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Adjustable Voltage Drop
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Output Noise
        4. 8.2.2.4 Power-Supply Rejection Ratio (PSRR)
        5. 8.2.2.5 Start-up
        6. 8.2.2.6 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Estimating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (October 2013) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement Go
  • Changed Figure 14 to Figure 18: collected new dataGo

Changes from * Revision (July 2013) to A Revision

  • Changed document status to Production DataGo
  • Changed document titleGo
  • Deleted second sub-bullet from first Features bulletGo
  • Changed sub-bullets in Power-Supply Rejection Ratio and Low-Noise Output Features bulletsGo
  • Changed Output Current, Transient Response, Ceramic Capacitors, and Package Features bulletsGo
  • Deleted Input Voltage Range Features bulletGo
  • Added Output Voltage Range Features bulletGo
  • Added 4th to 7th Applications bulletsGo
  • Changed 1st and 3rd paragraphs of Description sectionGo
  • Changed voltage regulation value in second Description paragraphGo
  • Added changes to Typical Application CircuitGo
  • Changed descriptions of IN, NR, OUT, and PowerPAD pins in Pin Functions tableGo
  • Added PowerPAD row to Pin Functions tableGo
  • Changed associated pins of Voltage parameter in Absolute Maximum Ratings tableGo
  • Changed TJTemperature range parameter minimum specification in Absolute Maximum Ratings tableGo
  • Changed conditions of Electrical Characteristics tableGo
  • Changed VIN and VOUT parameter maximum specifications in Electrical Characteristics tableGo
  • Added VUVLO(in) parameter to Electrical Characteristics tableGo
  • Changed VIN – VOUT voltage range, Vn, and Tsd parameters in Electrical Characteristics tableGo
  • Changed ICL and IEN parameter specifications in Electrical Characteristics tableGo
  • Changed IGND parameter typical specification in Electrical Characteristics tableGo
  • Changed ISHDN test conditions and parameter specifications in Electrical Characteristics tableGo
  • Changed VEN(HI) parameter minimum specification in Electrical Characteristics tableGo
  • Changed Typical Characteristics sectionGo
  • Added Functional Block DiagramGo
  • Changed Application Information sectionGo
  • Changed Board Layout Recommendations sectionGo