SBVS228B July   2013  – March 2015 TPS7A3501

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Filter Operation
      2. 7.3.2 Minimum Load
      3. 7.3.3 Shutdown
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Adjustable Voltage Drop
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Output Noise
        4. 8.2.2.4 Power-Supply Rejection Ratio (PSRR)
        5. 8.2.2.5 Start-up
        6. 8.2.2.6 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Estimating Junction Temperature
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted).(1)
MIN MAX UNIT
Voltage IN, NR, EN –0.3 7 V
OUT, SENSE –0.3 VIN + 0.3(2)
Current OUT Internally limited
Temperature Operating junction, TJ –40 125 °C
Storage, Tstg –55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Absolute maximum rating is VIN + 0.3 V or + 7 V, whichever is smaller.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±1000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted).
MIN NOM MAX UNIT
VIN Input voltage 1.71 5 V
IOUT Output current 0 1 A
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) DRV (WSON) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 66.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 86.5
RθJB Junction-to-board thermal resistance 36.4
ψJT Junction-to-top characterization parameter 1.8
ψJB Junction-to-board characterization parameter 36.6
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

At TJ = –40°C to 125°C, VIN = 3.6 V, RNR = ∞ (not connected), IOUT = 10 mA, VEN = VIN, and CIN = COUT = 10 µF, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 1.71 5 V
VUVLO(in) Input supply UVLO VIN increasing 1.5 1.7 V
VIN hysteresis 200 mV
VOUT Output voltage range 1.21 4.5 V
VIN – VOUT voltage range 200 500 mV
VOUT(nom) = VIN – 330 mV, IOUT ≤ 1 A,
1.71 V ≤ VIN ≤ 4.83 V		 297 330 363 mV
RNR_INTERNAL(1) 110 170 210 kΩ
INR_INTERNAL(2) 1.4 1.8 2.4 µA
∆VOUT(∆IOUT) Load regulation 10 mA ≤ IOUT ≤ 1 A 10 µV/mA
ICL Output current limit VOUT = 0.85 × VOUT(nom) 1.1 A
IGND GND pin current 2.25 5 mA
IEN EN pin input current VEN = VIN 1 50 nA
ISHUTDOWN Shutdown current (IGND) VEN ≤ 0.3 V 0.01 3 µA
PSRR Power-supply rejection ratio f = 10 kHz, CNR = 1 µF, IOUT = 0.5 A 55 dB
f = 100 kHz, CNR = 1 µF, IOUT = 0.5 A 40
f = 1 MHz, CNR = 1 µF, IOUT = 0.5 A 42
Vn Output noise voltage BW = 10 Hz to 100 kHz, CNR = 1 µF, IOUT = 1 A 3.8 µVRMS
BW = 100 Hz to 100 kHz, CNR = 1 µF,
IOUT = 1 A		 3.62
BW = 10 Hz to 1 MHz, CNR = 1 µF, IOUT = 1 A 12.1
VEN(LO) EN pin input low (disable) 0.4 V
VEN(HI) EN pin input high (enable) 1.1 V
Tsd Thermal shutdown junction temperature Shutdown, temperature increasing 165 °C
Shutdown, temperature hysteresis 20
(1) RNR_INTERNAL refers to the internal resistor used to set (VIN – VOUT) for the device when no external RNR is used. See Adjustable Voltage Drop and Typical Application Circuitfor details.
(2) INR_INTERNAL refers to the internal current source used to set (VIN – VOUT) for the device when no external RNR is used. See Adjustable Voltage Drop and Typical Application Circuit for details.

6.6 Typical Characteristics

At VIN = 3.6 V, RNR = ∞ (not connected), IOUT = 10 mA, VEN = VIN, COUT = 10 µF, CIN = 10 µF, and CNR = 0.1 µF, unless otherwise noted.
TPS7A3501 C001_SBVS228.png
Figure 1. Line Regulation
TPS7A3501 C003_SBVS228.png
Figure 3. Load Regulation
TPS7A3501 C005_SBVS228.png
Figure 5. Ground Current vs Input Voltage
TPS7A3501 C007_SBVS228.png
Figure 7. Shutdown Current vs Input Voltage
TPS7A3501 C009_SBVS228.png
Figure 9. Foldback Current Limit
TPS7A3501 C011_SBVS228.png
Figure 11. Power-Supply Rejection Ratio vs Frequency
TPS7A3501 C013_SBVS228.png
Figure 13. Spectral Noise Density vs Frequency
TPS7A3501 load_tran_resp_2_SBVS228.gif
Figure 15. Load Transient Response
TPS7A3501 line_tran_resp_2_SBVS228.gif
Figure 17. Line Transient Response
TPS7A3501 start_up_2_SBVS228.gif
Figure 19. Start-up
TPS7A3501 C002_SBVS228.png
Figure 2. Line Regulation
TPS7A3501 C004_SBVS228.png
Figure 4. VDELTA vs Temperature
TPS7A3501 C006_SBVS228.png
Figure 6. Ground Current vs Output Current
TPS7A3501 C008_SBVS228.png
Figure 8. Current Limit vs Input Voltage
TPS7A3501 C010_SBVS228.png
Figure 10. Power-Supply Rejection Ratio vs Frequency
TPS7A3501 C012_SBVS228.png
Figure 12. Power-Supply Rejection Ratio vs Frequency
TPS7A3501 load_tran_resp_1_SBVS228.gif
Figure 14. Load Transient Response
TPS7A3501 line_tran_resp_1_SBVS228.gif
Figure 16. Line Transient Response
TPS7A3501 start_up_1_SBVS228.gif
Figure 18. Start-up