SBVS134F January   2012  – April 2017 TPS7A7001

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable (EN)
      2. 7.3.2 Internal Current Limit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Capacitor (IN)
      2. 8.1.2 Output Capacitor (OUT)
      3. 8.1.3 Feedback Resistors (FB)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendation to Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Thermal Protection
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

10.1.1 Board Layout Recommendation to Improve PSRR and Noise Performance

To improve ac measurements like PSRR, output noise, and transient response, use the board design shown in the layout example of Figure 8.

10.2 Layout Example

TPS7A7001 TPS7A7001Layout.gif Figure 8. Layout Example

10.3 Thermal Protection

Thermal protection disables the output when the junction temperature rises to approximately 160°C, allowing the device to cool. When the junction temperature cools to approximately 140°C, the output circuitry is re-enabled.

The internal protection circuitry of the TPS7A7001 is designed to protect against overload conditions. The protection circuitry is not intended to replace proper heat sinking. Continuously running the TPS7A7001 into thermal shutdown degrades device reliability.

10.4 Power Dissipation

Power dissipation (PD) of the device depends on the input voltage and load conditions and is calculated using Equation 2:

Equation 2. TPS7A7001 q_pd_bvs064.gif

In order to minimize power dissipation and achieve greater efficiency, use the lowest possible input voltage necessary to achieve the required output voltage regulation

On the SO (DDA) package, the primary conduction path for heat is through the exposed pad to the printed circuit board (PCB). The pad can be connected to ground or left floating; however, attach the pad to an appropriate amount of copper PCB area to prevent the device from overheating. The maximum junction-to-ambient thermal resistance depends on the maximum ambient temperature, maximum device junction temperature, and power dissipation of the device, and is calculated using Equation 3:

Equation 3. TPS7A7001 q_rth__bvs136.gif