SCDS348C September   2013  – March 2017 TS3USB3031

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 IOFF Protection
      2. 8.3.2 1.8-V Compatible Logic
      3. 8.3.3 Overvoltage Tolerant (OVT)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 MHL Eye Pattern
        2. 9.2.3.2 USB EYE Pattern
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VCC Supply voltage(3) –0.3 5.5 V
VI/O Input/Output DC voltage(3) –0.3 5.5 V
IK Input/Output port diode current (VI/O < 0) –50 mA
VI Digital input voltage (SEL0, SEL1) –0.3 5.5
IIK Digital logic input clamp current (VI < 0)(3) –50 mA
II/O Continuous switch DC output current (USB and MHL) 60 mA
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1000 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 2.5 4.3 V
VI/O (USB),
VI/O (MHL)		 Analog voltage 0 3.6 V
VI Digital input voltage (SEL0, SEL1) 0 VCC V
TRAMP (VCC) Power supply ramp time requirement (VCC) 100 1000 µs/V
II/O, PEAK Peak switch DC output current (1-ms duration pulse at <10% duty cycle) 150 mA
TA Operating free-air temperature –40 85 ºC

6.4 Thermal Information

THERMAL METRIC(1) TS3USB3031 UNIT
RMG (VQFN)
12 PINS
RθJA Junction-to-ambient thermal resistance 160.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 95.5 °C/W
RθJB Junction-to-board thermal resistance 91.2 °C/W
ψJT Junction-to-top characterization parameter 7.4 °C/W
ψJB Junction-to-board characterization parameter 91.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

TA = –40°C to 85°C, typical values are at VCC = 3.3 V and TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MHL SWITCH
RON ON-state resistance VCC = 2.5 V, VI/O = 1.5V, ION = –8 mA (see Figure 9) 5.5 7 Ω
ΔRON ON-state resistance match
between + and – paths		 VCC = 2.5 V, VI/O = 1.5 V, ION = –8 mA 0.1 Ω
RON (FLAT)  ON-state resistance flatness  VCC = 2.5 V, VI/O = 1.5 V to 3.3 V, ION = –8 mA 1 Ω
IOZ OFF leakage current VCC = 4.3 V, Switch OFF, VMHL+/MHL– = 1.5 V to 3.3 V, VD+/D–= 0 V (see Figure 10) –2 2 µA
IOFF Power-off leakage current VCC = 0 V, Power off, VMHL+/MHL– = 1.5 V to 3.3 V, VD+/D–= NC –10 10 µA
ION ON leakage current VCC = 4.3 V, Switch ON, VMHL+/MHL– = 1.5 V to 3.3 V, VD+/D–= NC –2 2 µA
USB SWITCH (USB1 and USB2)
RON ON-state resistance VCC = 2.5 V, VI/O = 0.4 V, ION = –8 mA (see Figure 9)    4.5 6 Ω
ΔRON ON-state resistance match
between + and – paths		 VCC = 2.5 V, VI/O = 0.4 V, ION = –8 mA 0.1 Ω
RON (FLAT)  ON-state resistance flatness  VCC = 2.5 V, VI/O = 0 V to 0.4 V, ION = –8 mA 1 Ω
IOZ OFF leakage current VCC = 4.3 V, Switch OFF, VUSB+/USB– = 0 V to 0.4 V, VD+/D–= 0 V (see Figure 10) –2 2 µA
IOFF Power-off leakage current VCC = 0 V, Switch ON or OFF,
VUSB+/USB– = 0 V to 0.4 V, VD+/D–= NC		 –10 10 µA
ION ON leakage current VCC = 4.3 V, Switch ON, VUSB+/USB– = 0 V to 0.4 V, VD+/D–= NC –2 2 µA
DIGITAL CONTROL INPUTS (SEL)
VIH Input logic high VCC = 2.5 V to 4.3 V 1.3 V
VIL Input logic low VCC = 2.5 V to 4.3 V 0.6 V
IIN Input leakage current VCC = 4.3 V, VI/O = 0 V to 3.6 V, VIN = 0 V to 4.3 V –10 10 µA

6.6 Dynamic Characteristics

TA = –40°C to 85°C, Typical values are at VCC = 3.3 V, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tpd Propagation delay RL = 50 Ω, CL = 5 pF, VCC = 2.5 V to 4.3 V,
VI/O(USB) = 0.4 V, VI/O(MHL) = 3.3 V		 50 ps
tswitch Switching time between USB/MHL channels in active modes RL = 50 Ω, CL = 5 pF, VCC = 2.5 V to 4.3 V,
VI/O(USB) = 0.4 V, VI/O(MHL) = 3.3 V		 400 ns
tON Switch turnon time (from disabled to active mode) RL = 50 Ω, CL = 5 pF, VCC = 2.5 V to 4.3 V,
VI/O(USB) = 0.4 V, VI/O(MHL) = 3.3 V		 100 µs
tOFF Switch turnoff time (from active to disabled mode) RL = 50 Ω, CL = 5 pF, VCC = 2.5 V to 4.3 V,
VI/O(USB) = 0.4 V, VI/O(MHL) = 3.3 V		 100 µs
CON(MHL) MHL path, ON capacitance VCC = 3.3 V, VI/O = 0 V or 3.3 V, f = 240 MHz, Switch ON 1.3 pF
CON(USB) USB1 and USB2 paths, ON capacitance VCC = 3.3 V, VI/O = 0 V or 3.3 V, f = 240 MHz, Switch ON 1 pF
COFF(MHL) MHL path, OFF capacitance VCC = 3.3 V, VI/O = 0 V or 3.3 V, f = 240 MHz, Switch OFF 1 pF
COFF(USB) USB1 and USB2 paths, OFF capacitance VCC = 3.3 V, VI/O = 0 V or 3.3 V, f = 240 MHz, Switch OFF 0.8 pF
CI Digital input capacitance VCC = 3.3 V, VI = 0 V or 2 V 2.2 pF
OISO (MHL) MHL path, OFF isolation VS = –10 dBm, VDC_BIAS = 2.4 V, RT = 50 Ω, f = 240 MHz (see Figure 11), Switch OFF –38 dB
OISO (USB) USB path, OFF isolation VS = –10 dBm, VDC_BIAS = 0.2 V RT = 50 Ω, f = 240 MHz (see Figure 11), Switch OFF –38 dB
XTALK (MHL) MHL channel crosstalk VS = –10 dBm, VDC_BIAS = 2.4 V, RT = 50 Ω, f = 240 MHz (see Figure 12), Switch ON –41 dB
XTALK (USB) USB channel crosstalk VS = –10 dBm, VDC_BIAS = 0.2 V, RT = 50 Ω, f = 240 MHz (see Figure 12), Switch ON –38 dB
BW(MHL) MHL path, –3-dB bandwidth VCC = 2.5 V to 4.3 V, RL = 50 Ω (see Figure 13), Switch ON 6.5 GHz
BW(USB) USB path, –3-dB bandwidth VCC = 2.5 V to 4.3 V, RL = 50Ω (See Figure 13), Switch ON 6.5 GHz
SUPPLY
VCC Power supply voltage 2.5 4.3 V
ICC Positive supply current VCC = 4.3 V, VIN = VCC or GND, VI/O = 0 V,
Switch ON or OFF		 28 40 µA

6.7 Typical Characteristics

TS3USB3031 C001_SCDS348.png Figure 1. ON-Resistance vs VI/O for MHL Switch
TS3USB3031 Diff_S21_MHL_Switch_SCDS348.gif Figure 3. Bandwidth for MHL Switch
TS3USB3031 C002_SCDS348.png Figure 2. ON-Resistance vs VI/O for USB Switch
TS3USB3031 Diff_S21_USB_Switch_SCDS348.gif Figure 4. Bandwidth for USB Switch
TS3USB3031 Off_Isol_MHL_Path_SCDS348.gif Figure 5. OFF Isolation vs Frequency for MHL Path
TS3USB3031 Cross_Freq_MHL_SCDS348.gif Figure 7. Cross Talk vs Frequency for MHL Path
TS3USB3031 Off_Isol_USB_Path_SCDS348.gif Figure 6. OFF Isolation vs Frequency for USB Path
TS3USB3031 Cross_Freq_USB_SCDS348.gif Figure 8. Cross Talk vs Frequency for USB Path