SLUSC60B December   2017  – October 2019 UCC28064A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Application
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Principles of Operation
      2. 8.3.2  Natural Interleaving
      3. 8.3.3  On-Time Control, Maximum Frequency Limiting, Restart Timer and Input Voltage Feed-Forward compensation
      4. 8.3.4  Distortion Reduction
      5. 8.3.5  Zero-Current Detection and Valley Switching
      6. 8.3.6  Phase Management and Light-Load Operation
      7. 8.3.7  Burst Mode Operation
      8. 8.3.8  External Disable
      9. 8.3.9  Improved Error Amplifier
      10. 8.3.10 Soft Start
      11. 8.3.11 Brownout Protection
      12. 8.3.12 Line Dropout Detection
      13. 8.3.13 VREF
      14. 8.3.14 VCC
      15. 8.3.15 System Level Protections
        1. 8.3.15.1 Failsafe OVP - Output Over-voltage Protection
        2. 8.3.15.2 Overcurrent Protection
        3. 8.3.15.3 Open-Loop Protection
        4. 8.3.15.4 VCC Undervoltage Lock-Out (UVLO) Protection
        5. 8.3.15.5 Phase-Fail Protection
        6. 8.3.15.6 CS - Open, TSET - Open and Short Protection
        7. 8.3.15.7 Thermal Shutdown Protection
        8. 8.3.15.8 Fault Logic Diagram
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Inductor Selection
        3. 9.2.2.3  ZCD Resistor Selection RZA, RZB
        4. 9.2.2.4  HVSEN
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Selecting RS For Peak Current Limiting
        7. 9.2.2.7  Power Semiconductor Selection (Q1, Q2, D1, D2)
        8. 9.2.2.8  Brownout Protection
        9. 9.2.2.9  Converter Timing
        10. 9.2.2.10 Programming VOUT
        11. 9.2.2.11 Voltage Loop Compensation
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Input Ripple Current Cancellation with Natural Interleaving
        2. 9.2.3.2 Brownout Protection
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Package Option Addendum
    1. 12.1 Packaging Information
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 Custom Design With WEBENCH® Tools
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

Interleaved transition-mode PFC system architecture dramatically reduces input and output ripple current, allowing the circuit to use smaller and less expensive filters. To maximize the benefits of interleaving, the input and output filter capacitors should be located after the two phase currents are combined together. Similar to other power management devices, when laying out the printed circuit board (PCB) it is important to use star grounding techniques and keep filter capacitors as close to device ground as possible. To minimize the interference caused by capacitive coupling from the boost inductor, the device should be located at least 1 in (25.4 mm) away from the boost inductor. It is also recommended that the device not be placed underneath magnetic elements. Because of the precise timing requirement, timing-setting resistor RT should be placed as close as possible to the TSET pin and returned to the analog ground pin with the shortest possible path. Figure 36 shows a recommended component placement and layout.