SLVSDD4C September   2016  – March 2020 UCD90160A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail Configuration
      2. 7.3.2 TI Fusion GUI
      3. 7.3.3 PMBus Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power Supply Sequencing
        1. 7.4.1.1 Turn-on Sequencing
        2. 7.4.1.2 Turn-off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Voltage Monitoring
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. 7.4.8.1 GPO Delays
        2. 7.4.8.2 State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
        1. 7.4.9.1 Fault Shutdown Rails
        2. 7.4.9.2 Configured as Sequencing Debug Pin
        3. 7.4.9.3 Configured as Fault Pin
        4. 7.4.9.4 Cold Boot Mode Enable
      10. 7.4.10 Power Supply Enables
      11. 7.4.11 Cascading Multiple Devices
      12. 7.4.12 PWM Outputs
        1. 7.4.12.1 FPWM1-8
        2. 7.4.12.2 PWM1-4
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. 7.4.14.1 Open-Loop Margining
        2. 7.4.14.2 Closed-Loop Margining
      15. 7.4.15 System Reset Signal
      16. 7.4.16 Watch Dog Timer
      17. 7.4.17 Run Time Clock
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
      21. 7.4.21 Device Reset
    5. 7.5 Programming
      1. 7.5.1 Device Configuration and Programming
        1. 7.5.1.1 Full Configuration Update While in Normal Mode
      2. 7.5.2 JTAG Interface
      3. 7.5.3 Internal Fault Management and Memory Error Correction (ECC)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Estimating ADC Reporting Accuracy
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The thermal pad provides a thermal and mechanical interface between the device and the printed circuit board (PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a 4 × 4 pattern of PCB vias to connect the thermal pad and VSS pins to the circuit ground on other PCB layers.

For supply-voltage decoupling, provide power supply pin bypass to the device as follows:

  • 1-μF, X7R ceramic in parallel with 0.01-μF, X7R ceramic at pin 47 (BPCAP)
  • 0.1-μF, X7R ceramic in parallel with 4.7-μF, X5R ceramic at pins 44 (V33DIO2) and 45 (V33D)
  • 0.1-μF, X7R ceramic at pin 7 (V33DIO1)
  • 0.1-μF, X7R ceramic in parallel with 4.7-μF, X5R ceramic at pin 46 (V33A)
  • Connect V33D (pin 45), V33DIO1 (pin 7) and V33DIO2 (pin 44) to 3.3-V supply directly. Connect V33A (pin 46) to V33D through a 4.99-Ω resistor. This resistor and V33A decoupling capacitors form a low-pass filter to reduce noise on V33A.
Depending on use and application of the various GPIO signals used as digital outputs, some impedance control may be desired to quiet fast signal edges. For example, when using the FPWM pins for fan control or voltage margining, the pin is configured as a digital clock signal. Route these signals away from sensitive analog signals. It is also good design practice to provide a series impedance of 20 Ω to 33 Ω at the signal source to slow fast digital edges.