SBAS451B October 2008 – August 2015 PCM1789
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage | VCC1, VCC2 | –0.3 | 6.5 | V |
VDD | –0.3 | 4.0 | ||
Ground voltage differences | AGND1, AGND2, DGND | ±0.1 | V | |
Supply voltage differences | VCC1, VCC2 | 0.1 | V | |
Digital input voltage | RST, ADR5, MS, MC, MD, SCKI, AMUTEI | –0.3 | 6.5 | V |
BCK, LRCK, DIN, MODE, ZERO1, ZERO2 | –0.3 | (VDD + 0.3) < +4.0 | ||
Analog input voltage | VCOM, VOUTL±, VOUTR± | –0.3 | (VCC + 0.3) < +6.5 | V |
Input current (all pins except supplies) | ±10 | mA | ||
Ambient temperature under bias | –40 | 125 | °C | |
Junction temperature | 150 | °C | ||
Package temperature (IR reflow, peak) | 260 | °C | ||
Storage temperature, Tstg | –55 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±1000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±250 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
Analog supply voltage, VCC | 4.5 | 5.0 | 5.5 | V | |
Digital supply voltage, VDD | 3.0 | 3.3 | 3.6 | V | |
Digital Interface | LVTTL-compatible | ||||
Digital input clock frequency | Sampling frequency, LRCK | 8 | 192 | kHz | |
System clock frequency, SCKI | 2.048 | 36.864 | MHz | ||
Analog output voltage | Differential | 8 | VPP | ||
Analog output load resistance | To ac-coupled GND | 5 | kΩ | ||
To dc-coupled GND | 15 | ||||
Analog output load capacitance | 50 | pF | |||
Digital output load capacitance | 20 | pF | |||
Operating free-air temperature | PCM1789 consumer grade | –40 | 25 | 85 | °C |
THERMAL METRIC(1) | PCM1789 | UNIT | |
---|---|---|---|
PW (TSSOP) | |||
24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 87.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 19.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 42.6 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 42.1 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
DATA FORMAT | ||||||
fS | Sampling frequency | 8 | 48 | 192 | kHz | |
System clock frequency | 128 fS, 192 fS, 256 fS, 384 fS, 512 fS, 768 fS, 1152 fS |
2.048 | 36.864 | MHz | ||
INPUT LOGIC | ||||||
LOGIC FAMILY | ||||||
VIH | Input logic level, high (BCK, LRCK, and DIN) | 2.0 | VDD | VDC | ||
VIL | Input logic level, low (BCK, LRCK, and DIN) | 0.8 | VDC | |||
VIH | Input logic current, high (SCKI, ADR5/ADR1/RSV, MC/SCL/FMT, MD/SDA?DEMP, and AMUTEI) | 2.0 | 5.5 | VDC | ||
VIL | Input logic current, low (SCKI, ADR5/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI) | 0.8 | VDC | |||
IIH | Input logic current, high (DIN, SCKI, ADR5/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI) | VIN = VDD | ±10 | μA | ||
IIL | Input logic current, low (DIN, SCKI, ADR5/ADR1/RSV, MC/SCL/FMT, MD/SDA/DEMP, and AMUTEI) | VIN = 0 V | ±10 | μA | ||
IIH | Input logic current, high (BCK, LRCK, RST, MS/ADR0/RSV) | VIN = VDD | +65 | +100 | μA | |
Input logic current, low (BCK, LRCK, RST, MS/ADR0/RSV) | VIN = 0 V | ±10 | μA | |||
OUTPUT LOGIC | ||||||
VOH | Output logic level, high (ZERO1 and ZERO2) | IOUT = –4 mA | 2.4 | VDC | ||
VOL | Output logic level, high (ZERO1 and ZERO2) | IOUT = +4 mA | 0.4 | VDC | ||
REFERENCE OUTPUT | ||||||
VCOM output voltage | 0.5 × VCC1 | V | ||||
VCOM output impedance | 7.5 | kΩ | ||||
Allowable VCOM output source/sink current | 1 | μA |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
RESOLUTION | 16 | 24 | Bits | ||||
DC ACCURACY | |||||||
Gain mismatch channel-to-channel | x | ±2.0 | ±6.0 | % of FSR | |||
Gain error | ±2.0 | ±6.0 | % of FSR | ||||
Bipolar zero error | ±1.0 | % of FSR | |||||
DYNAMIC PERFORMANCE(1)(2) | |||||||
THD+N | Total harmonic distortion + noise | VOUT = 0 dB | fS = 48 kHz | –94 | –88 | dB | |
fS = 96 kHz | –94 | dB | |||||
fS = 192 kHz | –94 | dB | |||||
Dynamic range | fS = 48 kHz, EIAJ, A-weighted | 106 | 113 | dB | |||
fS = 96 kHz, EIAJ, A-weighted | 113 | dB | |||||
fS = 192 kHz, EIAJ, A-weighted | 113 | dB | |||||
SNR | Signal-to-noise ratio | fS = 48 kHz, EIAJ, A-weighted | 106 | 113 | dB | ||
fS = 96 kHz, EIAJ, A-weighted | 113 | dB | |||||
fS = 192 kHz, EIAJ, A-weighted | 113 | dB | |||||
Channel separation | fS = 48 kHz | 103 | 109 | dB | |||
fS = 96 kHz | 109 | dB | |||||
fS = 192 kHz | 108 | dB | |||||
ANALOG OUTPUT | |||||||
Output voltage | Differential | 1.6 × VCC1 | VPP | ||||
Center voltage | 0.5 × VCC1 | V | |||||
Load impedance | To ac-coupled GND(3) | 5 | kΩ | ||||
To dc-coupled GND(3) | 15 | kΩ | |||||
LPF frequency response | f = 20 kHz | –0.04 | dB | ||||
f = 44 kHz | –0.18 | dB | |||||
DIGITAL FILTER PERFORMANCE WITH SHARP ROLL-OFF | |||||||
Passband (single, dual) | Except SCKI = 128 fS and 192 fS | 0.454 × fS | Hz | ||||
SCKI = 128 fS and 192 fS | 0.432 × fS | Hz | |||||
Passband (quad) | 0.432 × fS | Hz | |||||
Stop band (single, dual) | Except SCKI = 128 fS and 192 fS | 0.546 × fS | Hz | ||||
SCKI = 128 fS and 192 fS | 0.569 × fS | Hz | |||||
Stop band (quad) | 0.569 × fS | Hz | |||||
Passband ripple | < 0.454 × fS, 0.432 × fS | ±0.0018 | dB | ||||
Stop band attenuation | > 0.546 × fS, 0.569 × fS | –75 | dB | ||||
DIGITAL FILTER PERFORMANCE WITH SLOW ROLL-OFF | |||||||
Passband | 0.328 × fS | Hz | |||||
Stop band | 0.673 × fS | Hz | |||||
Passband ripple | < 0.328 × fS | ±0.0013 | dB | ||||
Stop band attenuation | > 0.673 × fS | –75 | dB | ||||
DIGITAL FILTER PERFORMANCE | |||||||
Group delay time (single, dual) | Except SCKI = 128 fS and 192 fS | 28/fS | sec | ||||
SCKI = 128 fS and 192 fS | 19/fS | sec | |||||
Group delay time (quad) | 19/fS | sec | |||||
De-emphasis error | ±0.1 | dB |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
POWER-SUPPLY REQUIREMENTS | ||||||
VCC1/2 | Voltage range | 4.5 | 5.0 | 5.5 | VDC | |
VDD | 3.0 | 3.3 | 3.6 | VDC | ||
ICC | Supply current | fS = 48 kHz | 19 | 28 | mA | |
fS = 192 kHz | 19 | mA | ||||
Full power-down(1) | 170 | μA | ||||
IDD | fS = 48 kHz | 18 | 30 | mA | ||
fS = 192 kHz | 22 | mA | ||||
Full power-down(1) | 60 | μA | ||||
Power dissipation | fS = 48 kHz | 154 | 239 | mW | ||
fS = 192 kHz | 168 | mW | ||||
Full power-down(1) | 1.05 | mW | ||||
TEMPERATURE RANGE | ||||||
Operating temperature | PCM1789 consumer grade | –40 | +85 | °C | ||
θJA | Thermal resistance | TSSOP-24 | 115 | °C/W |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
tSCY | System clock cycle tiime | 27 | ns | ||
tSCH | Syst4em clock width high | 10 | ns | ||
tSCL | System clock width low | 10 | ns | ||
— | System clock duty cycle | 40% | 60% |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
tBCY | BCK cycle time | 75 | ns | ||
tBCH | BCK pulse width high | 35 | ns | ||
tBCL | BCK pulse width low | 35 | ns | ||
tLRW | LRCK pulse width high (LJ, RJ and I2S formats) | 1/(2 × fS) | 1/(2 × fS) | s | |
LRCK pulse width high (DSP format) | tBCY | tBCY | s | ||
tLRS | LRCK setup time to BCK rising edge | 10 | ns | ||
tLRH | LRCK hold time to BCK rising edge | 10 | ns | ||
tDIS | DIN setup time to BCK rising edge | 10 | ns | ||
tDIH | DIN hold time to BCK rising edge | 10 | ns |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
tMCY | MC pulse cycle time | 100 | ns | ||
tMCL | MC low-level time | 40 | ns | ||
tMCH | MC high-level time | 40 | ns | ||
tHCH | MS high-level time | tMCY | ns | ||
tMSS | MS falling edge to MC rising edge | 30 | ns | ||
tMHS | MS rising edge from MC rising edge for LSB | 15 | ns | ||
tMDH | MS hold time | 15 | ns | ||
tMDS | MD setup time | 15 | ns |
STANDARD MODE | FAST MODE | UNIT | ||||
---|---|---|---|---|---|---|
MIN | MAX | MIN | MAX | |||
fSCL | SCL clock frequency | 100 | 400 | kHz | ||
tBUF | Bus free time between STOP and START condition | 4.7 | 1.3 | μs | ||
tLOW | Low period of the SCL clock | 4.7 | 1.3 | μs | ||
tHI | High period of the SCL clock | 4.0 | 0.6 | μs | ||
tS-SU | Setup time for START/Repeated START condition | 4.7 | 0.6 | μs | ||
tS-HD | Hold time for START/Repeated START condition | 4.0 | 0.6 | μs | ||
tD-SU | Data setup time | 250 | 100 | ns | ||
tD-HD | Data hold time | 0 | 3450 | 0 | 900 | ns |
tSCL-R | Rise time of SCL signal | 1000 | 20 + 0.1 CB | 300 | ns | |
tSCL-F | Fall time of SCL signal | 1000 | 20 + 0.1 CB | 300 | ns | |
tSDA-R | Rise time of SDA signal | 1000 | 20 + 0.1 CB | 300 | ns | |
tSDA-F | Fall time of SDA signal | 1000 | 20 + 0.1 CB | 300 | ns | |
tP-SU | Setup time for STOP condition | 4.0 | 0.6 | μs | ||
tGW | Allowable glitch width | N/A | 50 | ns | ||
CB | Capacitive load for SDA and SCL line | 400 | 100 | pF | ||
VNH | Noise margin at high level for each connected device(including hysteresis) | 0.2 × VDD | 0.2 × VDD | V | ||
VNL | Noise margin at low level for each connected device (including hysteresis) | 0.1 × VDD | 0.1 × VDD | V | ||
VHYS | Hysteresis of Schmitt trigger input | N/A | 0.05 × VDD | V |
fS = 48 kHz |
fS = 32 kHz |
fS = 44.1 kHz |
0 dB, N = 32768 |
BPZ, N = 32768 |
–60 dB, N = 32768 |