SLLSER2A October   2015  – May 2017 TUSB321AI

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Cables, Adapters, and Direct Connect Devices
        1. 7.1.1.1 USB Type-C Receptacles and Plugs
        2. 7.1.1.2 USB Type-C Cables
        3. 7.1.1.3 Legacy Cables and Adapters
        4. 7.1.1.4 Direct Connect Devices
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Port Role Configuration
        1. 7.3.1.1 Downstream Facing Port (DFP) - Source
        2. 7.3.1.2 Upstream Facing Port (UFP) - Sink
        3. 7.3.1.3 Dual Role Port (DRP)
      2. 7.3.2 Type-C Current Mode
      3. 7.3.3 VBUS Detection
      4. 7.3.4 Cable Orientation and External MUX Control
      5. 7.3.5 VCONN Support for Active Cables
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unattached Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Dead Battery Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 DFP Mode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage VDD –0.3 6.0 V
Control pins CC1, CC2, PORT, CURRENT_MODE, ID, DIR, VCONN_FAULT –0.3 VDD + 0.3 V
OUT1, OUT2 –0.3 VDD + 0.3
VBUS_DET –0.3 4
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±3000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage range,VDD 4.5 5.5 V
System VBUS voltage 4 5 28 V
DC Voltage range for VBUS_DET VBUS_DET 0 4 V
DC Voltage range for control pins ID, DIR, VCONN_FAULT, OUT1, OUT2, CURRENT_MODE, CC1, CC2, PORT 0 5.5 V
Supply for active cable (With VDD at 5 V) VCONN 4.75 5.5 V
Operating free air temperature, TA –40 25 85 °C

6.4 Thermal Information

THERMAL METRIC(1) TUSB321AI UNIT
RWB (X2QFN)
12 PINS
RθJA Junction-to-ambient thermal resistance 169.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.1 °C/W
RθJB Junction-to-board thermal resistance 83.4 °C/W
ψJT Junction-to-top characterization parameter 2.2 °C/W
ψJB Junction-to-board characterization parameter 83.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A —
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power Consumption
I(UNATTACHED_UFP) Current consumption in unattached mode when port is unconnected and waiting for connection. (VDD = 5 V, PORT = L) 70 µA
I(ACTIVE_UFP) Current consumption in active mode. (VDD = 5 V, PORT = L) 70 µA
CC1 and CC2 Pins
R(CC_D) Pulldown resistor when in UFP or DRP mode. 4.6 5.1 5.6 kΩ
RCC_DB Pulldown resistor when in dead-battery mode VDD = 0V. 4.1 5.1 6.1 kΩ
VUFP_CC_USB Voltage level range for detecting a DFP attach when configured as a UFP and DFP is advertising default current source capability. 0.25 0.61 V
VUFP_CC_MED Voltage level range for detecting a DFP attach when configured as a UFP and DFP is advertising medium (1.5 A) current source capability. 0.70 1.16 V
VUFP_CC_HIGH Voltage level range for detecting a DFP attach when configured as a UFP and DFP is advertising high (3 A) current source capability. 1.31 2.04 V
VTH(DFP_CC_USB) Voltage threshold for detecting a UFP attach when configured as a DFP and advertising default current source capability. 1.51 1.6 1.64 V
VTH(DFP_CC_MED) Voltage threshold for detecting a UFP attach when configured as a DFP and advertising medium current (1.5 A) source capability. 1.51 1.6 1.64 V
VTH(DFP_CC_HIGH) Voltage threshold for detecting a UFP attach when configured as a DFP and advertising high current (3.0 A) source capability. 2.46 2.6 2.74 V
VTH(AC_CC_USB) Voltage threshold for detecting a active cable attach when configured as a DFP and advertising default current source. 0.15 0.20 0.25 V
VTH(AC_CC_MED) Voltage threshold for detecting a active cable attach when configured as a DFP and advertising medium current (1.5 A) source. 0.35 0.40 0.45 V
VTH(AC_CC_HIGH) Voltage threshold for detecting a active cable attach when configured as a DFP and advertising high current (3 A) source. 0.76 0.80 0.84 V
ICC(DEFAULT_P) Default mode pullup current source when operating in DFP or DRP mode. 64 80 96 µA
ICC(MED_P) Medium (1.5 A) mode pullup current source when operating in DFP or DRP mode. 166 180 194 µA
ICC(HIGH_P) High (3 A) mode pullup current source when operating in DFP or DRP mode.(1) 304 330 356 µA
Control Pins: PORT, CURRENT_MODE, VCONN_FAULT, DIR, ID, OUT1, OUT2
VIL Low-level control signal input voltage, (PORT, CURRENT_MODE) 0.4 V
VIM Mid-level control signal input voltage (PORT, CURRENT_MODE) 0.28 × VDD 0.56 × VDD V
VIH High-level control signal input voltage (PORT, CURRENT_MODE) VDD - 0.3 V
IIH High-level input current –20 20 µA
IIL Low-level input current –10 10 µA
IID_LEAKAGE Current leakage for ID pin. VDD = 0V; ID = 5V 10 µA
RPU Internal pullup resistance (PORT) 588 kΩ
RPD Internal pulldown resistance (PORT) 1.1 MΩ
RPD(CUR) Internal pulldown resistance for CURRENT_MODE pin 275 kΩ
VOL Low-level signal output voltage (open-drain) (VCONN_FAULT, ID, OUT1, OUT2, DIR) IOL = –1.6 mA 0.4 V
RP(ODext) External pullup resistor on open drain IOs (VCONN_FAULT, ID, OUT1, OUT2, DIR) 200 kΩ
RP(TLext) Tri-level input external pull-up resistor (PORT) 4.7 kΩ
RP(cm_med) External pull-up resistor on CURRENT_MODE pin to advertise 1.5-A current 500 kΩ
RP(cm_high) External pull-up resistor on CURRENT_MODE pin to advertise 3.0-A current 10 kΩ
VBUS_DET IO Pins (Connected to System VBUS signal through external resistor)
VBUS(THR) VBUS threshold range 2.95 3.30 3.80 V
RVBUS External resistor between VBUS and VBUS_DET pin 855 887 920 KΩ
R(VBUS_PD) Internal pulldown resistance for VBUS_DET 95 KΩ
VCONN
RON On resistance of the VCONN power FET 1.25 Ω
V(TOL) Voltage tolerance on VCONN power FET 5.5 V
V(PASS) Voltage to pass through VCONN power FET 5.5 V
I(VCONN) VCONN current limit; VCONN is disconnected above this value 225 300 375 mA
CBULK Bulk capacitance on VCONN; placed on VDD supply 10 200 µF
(1) VDD must be 3.5 V or greater to advertise 3 A current.

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
tCCCB_DEFAULT Power on default of CC1 and CC2 voltage debounce time 168 ms
tVBUS_DB Debounce of VBUS_DET pin after valid V(BUS_THR) (See Figure 1.) 2 ms
tDRP_DUTY_CYCLE Power-on default of percentage of time DRP advertises DFP during a TDRP 30%
tDRP The period TUSB321AI in DRP mode completes a DFP to UFP and back advertisement. 50 75 100 ms
TUSB321AI tvbus_db_sllseo6.gif Figure 1. VBUS Detect and Debounce