SLUUCZ9A January   2024  – May 2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
      1. 1.4.1 U1 Component Selection
      2. 1.4.2 UCC33420-Q1 Pin Definition
  7. 2Hardware
    1. 2.1 EVM Setup and Operation
      1. 2.1.1 Recommended Test Equipment
      2. 2.1.2 External Connections for Easy Evaluation
      3. 2.1.3 Powering the EVM
      4. 2.1.4 EVM Test Points
      5. 2.1.5 Oscilloscope Probes: Probing the EVM
  8. 3Implementation Results
    1. 3.1 Performance Data
      1. 3.1.1 Efficiency Data
      2. 3.1.2 Regulation Data
      3. 3.1.3 Startup Waveforms
      4. 3.1.4 Inrush Current
      5. 3.1.5 AC Ripple Voltage
      6. 3.1.6 Load Transient
      7. 3.1.7 VCC Short-Circuit
      8. 3.1.8 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 Assembly and Printed Circuit Board (PCB)
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Revision History

4.2 Assembly and Printed Circuit Board (PCB)

The UCC33420EVM-080 is designed using a four-layer, FR4, PCB, fabricated with 1-ounce copper on all four layers. The EVM PCB demonstrates the important use of ground planes and tented stitching vias for shielding and providing low impedance connection between GND layers. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology can be applied as best as possible.

UCC33420Q1-EVM Fully Assembled 3D (Top View)Figure 4-2 Fully Assembled 3D (Top View)
UCC33420Q1-EVM PCB Top Layer, AssemblyFigure 4-4 PCB Top Layer, Assembly
UCC33420Q1-EVM Ground Layer 3 Figure 4-6 Ground Layer 3
UCC33420Q1-EVM Fully Assembled 3D (Bottom View)Figure 4-3 Fully Assembled 3D (Bottom View)
UCC33420Q1-EVM Ground Layer 2 Figure 4-5 Ground Layer 2
UCC33420Q1-EVM PCB Bottom Layer, Assembly (Mirrored View)Figure 4-7 PCB Bottom Layer, Assembly (Mirrored View)