eTech Embedded Processing e-Newsletter
March 2012
  • Subscribe
  • my.ti.com
  • Texas Instruments
    In this issue  
    FEATURES
    VIDEOS
    TOOLS AND SOFTWARE
    LITERATURE
    TRAINING AND EVENTS
    SHARE THIS EMAIL   Facebook   Twitter   LinkedIn   Delicious

    FEATURED BLOCK DIAGRAM
    Featured System Block Diagram
    Refrigerator

    FEATURED VIDEO
    Click to play
    Mission possible: Exploring the Sitara™ AM335x ARM processor

    FEATURES
    Design West 2012
    Stop by TI’s booth (No. 1320) at Design West 2012 (formerly Embedded Systems Conference – Silicon Valley) March 26-29 to see demonstrations of our latest embedded processing products, including multicore DSPs, C5000™ ultra-low-power DSPs, C6000™ high-performance DSPs and Sitara™ ARM MPUs. Learn more about Design West now.
    Get your hands on a BeagleBone
    You have two opportunities to experience the new BeagleBone development board from BeagleBoard.org during Design West, March 26-29. The Android Certification program is a hands-on workshop using the BeagleBone to walk you through the Android development process. All participants will receive a BeagleBone to take home. But if you are unable to attend the training, bring in a competitor’s ARM9 or Cortex-A series development tool to TI’s booth (No. 1320) and swap it for a BeagleBone. Quantities will be limited, so stop by the Sitara™ ARM processor station early to get yours.
    Back to top
    VIDEOS
    Thank an Engineer for antilock brakes
    In the latest episode of “Thank an Engineer,” Fern explores antilock braking systems, a technology that when used correctly can save countless lives. Watch it now.
    MityDSP-L138F SDR with uPP data transfer
    Watch this video overview of the prototype system used to implement a software-defined radio (SDR) featuring the MityDSP-L138F system-on-module from Critical Link; the OMAP-L138 DSP+ARM processor from Texas Instruments; and digital-to-analog and analog-to-digital evaluation modules, also from Texas Instruments.
    Back to top
    TOOLS AND SOFTWARE
    Industrial software development tools now available
    Start your industrial development today on the AM335x Sitara™ ARM Cortex-A8 microprocessor with TI’s industrial software development kit (SDK). The AM335x SYSBIOS industrial SDK 01.00.00.02 release is now available, supporting the AM335x industrial development kit evaluation module (also known as the IA EVM) and the AM335x industrial communications engine.
    QNX support for the AM335x ARM processor and BeagleBone
    Neutrino with graphics software from QNX Software Systems is optimized for AM335x ARM Cortex-A8 microprocessor units to ease programming and enable applications with advanced user interfaces. QNX’s board-support package for the BeagleBone, using the Sitara™ AM335x processor, is now available for download.
    Back to top
    LITERATURE
    Navigate your embedded software design
    Read TI’s latest white paper, “Embedded Software Development is a Multidimensional Effort,” to learn how to navigate your embedded software design. This paper discusses many topics to help software development teams set goals for each project.
    Natural user interface design considerations
    User interfaces have come a long way in recent years. This white paper explores design considerations for delivering an intuitive, engaging and captivating user interface.
    Power management unit for TI’s C674x floating-point DSPs
    This application note details the design considerations of a power solution for TMS320C742, TMS320C6746 and TMS320C6748 low-power application processors with a TPS650061 three-rail power management unit (PMU) or power management integrated circuit. Portable application solution size demands a high level of integration, and the C6742, C6746 and C6748 processors require at least three different voltage rails with specific sequencing and reset requirements. The TPS650061 is a highly integrated power solution that can provide 1.2-V, 1.8-V and 3.3-V rails and the RESET signal required. The TPS650061 has a single step-down converter, two low-dropout regulators and a voltage supervisor. The application note includes a power solution, power requirements, an illustrated schematic, operation waveforms, performance data and bill-of-materials cost.
    Back to top
    TRAINING AND EVENTS
    Electronic point-of-sale solutions overview
    Are you evaluating a point-of-sale solution? TI’s offerings support the development of a wide range of retail point-of-sale solutions, including bar-code scanners, point-of-sale devices and portable data terminals. In this 15-minute online training session, you will learn about TI’s solutions for the retail automation market, including features, a roadmap and product schedule. Learn more today.
    Register to attend TI’s workshop at ICASSP 2012
    Join today’s leading signal-processing industry professionals and academia at IEEE’s International Conference on Acoustics, Speech and Signal Processing (ICASSP) in Kyoto, Japan, March 25-30. Visit TI’s booth and attend their workshop, “Hands-On DSP Teaching with the TI OMAP-L138 eXperimenter,” presented by Donald Reay (from Heriot-Watt University, U.K.) and Jacob Fainguelernt (from Tel-Aviv University, Israel). The workshop is Monday, March 26, from 9:30 a.m. to 5 p.m., including lunch. Space is limited, so please register early. TI will work to accommodate all registrants, with preference given to academic instructors. Confirmed attendees for the full workshop will receive the eXperimenter board, a full version of Code Composer Studio™ software and copies of the teaching materials for free.
    Webinar: TI’s AM335x processor with QNX platform support
    Join TI and QNX as they discuss how developers will benefit from the advanced capabilities of the AM335x Sitara™ ARM Cortex-A8 processor when combined with the QNX platform. On Wednesday, April 18, at 11 a.m. Central time, webinar participants will learn about new opportunities to reduce design complexity and bill-of-materials cost for smaller-sized applications, ranging from portable communications and telematics, industrial computing, medical diagnostics and more. Register today.
    Low-power DSP uses in connected audio applications
    Come to Design West 2012 and check out this session, which addresses how a low-power DSP can address the challenge for more features in connected audio systems to improve sound quality. The session will also cover how certain algorithms and software can improve the user experience with better audio and voice quality. Come to this session on Tuesday, March 27, in ESC-203.
    Back to top


    SHARE THIS EMAIL   Facebook   Twitter   LinkedIn   Delicious