Reflow profiles are dependent on numerous factors including package type, number of components, board layers, board size, reflow oven accuracy and process, etc.
Because of the number of variables, it is not possible to provide a single reflow profile that is representative of every board using a specific package type. Typically, manufacturing houses have reflow profiles in place and modify them for specific hardware.
The reflow profiles in this article are provided as a reference to assist customers and manufacturing houses in customizing the reflow profile to specific hardware for the package type indicated. Therefore, the information provided is not considered a final reflow profile.
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