Digital Signal Processors

Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

Fine-pitch PCB design is a team effort and may require more than a common list of design rules. Close coordination and communication between component supplier, PCB designer, PCB fabricator, and PCB assembly vendor is mandatory.

The following factors have a major effect on the quality and reliability of PCB assembly: pad design, via-in-pad (VIP) guidelines, via finishing, stencil design, solder paste requirements, solder paste deposition, and reflow profile. This application report provides a starting point for estblishing a set of design guidelines. It is strongly recommended that you perform actual studies in conjunction with your PCB assembly vendor and PCB fabricator to optimize the process.