CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil diameter and 10 mil finished hole size via; it is cost and time effective. This wiki article shows how to easily route the entire package by first routing one quadrant only and then copying it to the rest of the device. For this purpose, the Allegro® layout tool was used; other tools could be used in a similar way.
Via Channel is a trademark of Texas Instruments, Inc.
Allegro is a registered trademark of Cadence Design Systems, Inc.
All trademarks are property of their respective owners.