Texas Instruments' PowerStack packaging technology is a unique approach that takes co-packaging to the next level, enabling 2D to 3D integration for power supply designers.

PowerStack technology overview

TI's PowerStack technology was developed to address the growing challenges faced among power supply designers of many applications, such as computing and telecommunications, to achieve higher performance and lower power dissipation in a smaller footprint. Used today in several recent TI power management products, the PowerStack approach utilizes copper clip bonding and MOSFET stacking techniques to reduce board space and lower power dissipation by 20% while delivering a performance boost.

How PowerStack technology works

The benefits of PowerStack technology are achieved by stacking TI's NexFET™ power MOSFETs on a grounded lead frame, and connecting them using copper clips. This unique combination of stacking and clip bonding results in a more integrated quad flat no-lead (QFN) solution which delivers a smaller size, better thermal performance, higher switching speed and higher current capabilities over alternative, more traditional solutions that utilize MOSFETs placed side-by-side.

Products using PowerStack

In volume production today with more than 30 million units shipped, PowerStack packages can be found in a number of TI power management devices, including:

Advancing analog through packaging leadership

PowerStack packaging technology is another example of TI's innovative approach to packaging that enables further advancements to applications that demand smaller footprints along with improved efficiency and reliability at a lower cost. The technology is being manufactured at TI's state-of-the-art Clark facility, where many of TI's analog products go through assembly, packaging and test, and where TI has added capacity for qualifying QFN. TI has the broadest packaging portfolio in the analog market, built upon decades of packaging expertise and supporting thousands of diversified products, packaging configurations and technologies. For more information on TI packaging, click here.