Design Support


Texas Instruments (TI™) Flip Chip Ball Grid Array (BGA) packages provide the design flexibility to incorporate higher signal density and overall IC functionality into a smaller die and package footprint.

Flip chip BGA packages can be mounted using standard printed circuit board (PCB) assembly techniques, and can be removed and replaced using standard repair procedures.

This document provides application guidelines for effective flip chip BGA device handling and management, including board design rules, board assembly parameters, rework process, thermal management, troubleshooting, and other critical factors.