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Description

This small and simple, low-noise inverting power module design (voltage inverter) cleanly supports a –5-V output voltage at up to 1.5 A of current from a 3- to 11.5-V input. Featuring TI’s TPS82130 MicroSiP™ power module step-down converter in an inverting buck-boost topology, the (...)

Key Features

  • Simple Power Module Design
  • Total Solution Size Less Than 50mm2
  • High Output Current of 1.5A (VIN ≥ 7.5V)
  • Wide Input Voltage Range of 3V to 11.5V
  • Low Noise (Less Than 10mV Output Ripple)
  • 125°C Rated Solution

Applications Matched

  • Communications Equipment

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
Isolated/Non-Isolated
Isolated/Non-Isolated
Input Type
Input Type
Topology
Topology
Designed for
Designed for
TIDA-01457.1
(Output
Voltage1)
3 11.5 -5 1.5 7.5 Non-Isolated DC Buck Boost- Inverting

Description

The RF sampling architecture offers an alternative to the traditional super-heterodyne architecture. An RF sampling analog-to-digital converter (ADC) operates at a high sampling rate and converts signals directly from radio frequencies (RF) to digital. Because of the high sampling rate, the RF (...)

Key Features

  • 3-GSPS RF sampling ADC solution
  • 1 -GHz and larger signal bandwidth capability
  • Low noise, high dynamic range RF sampling receiver solution
  • Low-phase noise clocking solution for RF sampling ADC

Applications Matched

  • Communications Equipment

Description

The RF sampling receiver captures signals directly in the radio frequency (RF) band. In a multi-band application the desired signals are not very wide band but they are spaced far apart within the spectrum. The reference design captures signals in different RF bands and digitally down-converts them (...)

Key Features

  • Digital down converter with decimation solution
  • Interference avoidance configuration
  • Low noise, high dynamic range RF sampling receiver solution
  • Low-phase noise clocking solution for RF sampling ADC

Applications Matched

  • Communications Equipment

Description

This design is a digitally controlled, two phase interleaved, 700W power factor correction converter with added power metering functionality. A C2000™ Piccolo™ microcontroller is the controller for the two 180° phase shifted boost power stages that comprise the power factor (...)

Key Features

  • Full digital control of dual interleaved PFC power converter topology
  • Universal input of 95 VAC to 265 VAC
  • 400 VDC bus output operating up to 700 W
  • Power Factor of 0.99 at 200 KHz switching frequency and 1.5% THD at full load
  • Supports power monitoring of rectified input voltage, RMS input voltage, RMS (...)

Applications Matched

  • Communications Equipment

Description

A 4 phase buck regulator design fully complaint to power the core rail of Intel Arria 10 GX FPGAs, specifically the 10AX115U145IVG  variant. Integrated PMBus allows for easy output voltage setting and telemetry of key design parameters. The design enables programming, configuration, Smart VID (...)

Key Features

  • 4-phase power supply 0.9V/150A Arria 10 GX (10AX115U145IVG)
  • PMBus programming of Vout, and Voltage Margining for Arria Smart VID, 10mV per step
  • PMBus monitoring of Input/Output Voltage, Current, Power, and Temperature
  • 90% efficiency at 12VIN, 0.9V/100A

Applications Matched

  • Communications Equipment

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
Isolated/Non-Isolated
Isolated/Non-Isolated
Input Type
Input Type
Topology
Topology
Designed for
Designed for
TIDA-01419.1
(Output
Voltage1)
10.8 13.2 .9 150 135 Non-Isolated DC Buck- Multiphase
Buck- Synchronous

Description

Resonant converters are popular DC-DC converters frequently used in server, telecom, automotive, industrial and other power supply applications. Their high performance (efficiency, power density, etc.), improving requirements of the various industry standards, and the ever increasing power density (...)

Key Features

  • Digitally controlled two phase interleaved LLC resonant DC-to-DC converter
  • Excellent current sharing between phases without any additional hardware
  • Peak efficiency: 94.5%. Efficiency > 90% for all loads above 10% of rated load
  • powerSUITE support for easy adaptation of software for a customized power (...)

Applications Matched

  • Communications Equipment

Description

The TIDA-01405 design demonstrates an inverting power module (voltage inverter) to generate a –1.8V rail at up to 2A of current from a 3V to 15.2V input voltage. Such a negative voltage is required for many communications equipment systems as well as industrial equipment, such as test and (...)

Key Features

  • Simple Power Module Design
  • Total Solution Size Less Than 50mm2
  • High Output Current of 2A (VIN ≥ 5V)
  • Wide Input Voltage Range of 3V to 15.2V
  • Low Noise (Less Than 10mV Output Ripple)
  • 125°C Rated Solution

Applications Matched

  • Communications Equipment

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
Isolated/Non-Isolated
Isolated/Non-Isolated
Input Type
Input Type
Topology
Topology
Designed for
Designed for
TIDA-01405.1
(Output
Voltage1)
3 15.2 -1.8 2 3.6 Non-Isolated DC Buck Boost- Inverting

Description

The TIDA-00783.1 reference design is a triple output wide Vin power module design. It provides 3.3V, 1.8V and 1.2V output, at 6W total power. The layout is optimized for space constrained applications.

Key Features

  • LMZ36002 wide Vin power module with integrated inductor, 4.5V to 60V input, 2A output
  • LMZ20502 nano module with integrated inductor
  • 4.5V to 40V wide input range
  • Power module design with minimum external components
  • 400 sq. mm compact solution size
  • This circuit board is tested, and the design files and (...)

Applications Matched

  • Communications Equipment

Design Parameters

 
 
Vin (V) (Min)
Vin (V) (Min)
Vin (V) (Max)
Vin (V) (Max)
Vout (V) (Nom)
Vout (V) (Nom)
Iout (A) (Max)
Iout (A) (Max)
Output Power (W)
Output Power (W)
Isolated/Non-Isolated
Isolated/Non-Isolated
Input Type
Input Type
Topology
Topology
Designed for
Designed for
TIDA-00783.1
(Output Voltage 1)
4.5 40 3.3 .9 2.97 Non-Isolated DC Buck- Synchronous
TIDA-00783.2
(Output Voltage 2)
4.5 40 1.8 1 1.8 Non-Isolated DC Buck- Synchronous
TIDA-00783.3
(Output Voltage 3)
4.5 40 1.2 1 1.2 Non-Isolated DC Buck- Synchronous

Description

The TSW38J84 EVM reference design provides a platform to demonstrate a wideband dual transmit solution that incorporates an integrated LO.  The reference design utilizes the 2.5 GSPS DAC38J84 device with the high performance modulators: TRF3722 (including integrated PLL/VCO) and TRF3705. The (...)

Key Features

  • Complete bits-to-RF dual transmit signal chain soultion utilizing the JESD204B interface
  • Provides a platform to test 2.4 GSPS DAC38J84 with two high performance modulators
  • Output frequency of TRF3722 and TRF3705 is up to 4 GHz
  • The solution can support up to 1 GHz of bandwidth
  • Dual transmit solution for (...)

Applications Matched

  • Communications Equipment

Description

This reference design demonstrates how to interface an MSP430 MCU featuring CapTIvate™ technology with an MSP432 MCU host microcontroller using the CapTIvate Software Library communications module. The design integrates capacitive touch technology with haptics, an MSP432 MCU as host, driving a (...)

Key Features

  • Ultra-low-power MSP430 microcontroller featuring CapTIvate touch technology and FRAM
  • Mutual capacitance HMI with 17 buttons, 2 sliders, 1 wheel, a proximity/guard channel and haptics
  • MSP432 MCU, a low-power, high-performance 32-bit ARM® Cortex®-M4F host 
  • 320 x 240 pixel SPI controlled TFT QVGA display  
  • (...)

Applications Matched

  • Communications Equipment

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