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Description

This reference design is a reference platform based on the 66AK2Gx DSP + ARM processor  System-On-Chip (SoC) and companion AIC3106 Audio codec and enables a quick path to audio processing algorithm design and demonstration. This audio solution design includes real time application software (...)

Key Features

  • Programmable three-band equialization with gain controls
  • Simple serial user interface
  • Digital radio input with up to 96KHz sample rate
  • DSP-based audio processing implementation

Products Matched

  • Processors

Description

The TIDEP0084 reference design demonstrates how to connect sensors to the cloud over a long-range Sub-1 GHz wireless network, suitable for industrial settings such as building control and asset tracking.

The solution is based on a Linux® gateway.  There is also a TI-RTOS-based Sensor to (...)

Key Features

  • Large network to cloud connectivity enabling long range, up to 1 km line of sight (LOS)
  • IEEE 802.15.4e/g standards based Sub-1 GHz solution with the TI 15.4-stack SDK
  • Based on proven hardware designs enabling quick time to market with out-of-the-box ready to use demonstration software
  • TI Processor SDK (...)

Products Matched

  • Processors

Description

Based on TI's Jacinto™ DRA71x processor, this automotive reference design focuses on system-level cost savings. The 6 layer design reduces PCB costs through an optimized via breakout scheme, integration of key features and an optimized power distribution network. Functionality can be added or (...)

Key Features

  • TI Jacinto DRA71x processor with integrated features help customers design cost effective, feature rich, entry level (display audio) infotainment and cluster systems
  • ARM Cortex-A15 based processor with 600MHz, 800MHz, and 1GHz speeds, as well as 3D/2D graphics, C66x DSP and Cortex M4 options
  • Processor (...)

Products Matched

  • Processors

Description

This reference design describes system considerations for Dual Data Rate (DDR) memory interface with Error Correcting Code (ECC) support in high-reliability applications, based on the 66AK2Gx Multicore DSP + ARM processor System-on-Chip (SoC).  It enables developers to implement a high (...)

Key Features

  • Optimized high speed signal routing
  • Surface-mount PCIe x1 socket
  • Example of AC coupling capacitor placement
  • Example of recommended differential pair spacing

Products Matched

  • Processors

Description

This reference design uses multiple microphones, a beamforming algorithm, and other processes to extract clear speech and audio amidst noise and other clutter.  The rapid increase in applications that are used in noise-prone environments for voice activated digital assitants creates demand for (...)

Key Features

  • Single digital signal processor (DSP) SoC for audio pre-processing
  • Circular microphone board (CMB) with 360 degree coverage of audio source
  • Audio pre-processing software
  • Hardware/software with modularized components to build an audio pre-processing solution for clear voice triggering and recognition

Products Matched

  • Processors

Description

This reference design is  based on the 66AK2Gx multicore System-on-Chip (SoC) processor and companion TPS65911 power management integrated circuit (PMIC) which includes power supplies and power sequencing for the 66AK2Gx processor in a single device. This power solution design also includes the (...)

Key Features

  • TPS54620 and TPS54429 first stage buck converters
  • TPS65911 companion PMIC supporting power sequencing and power supplies as required by K2G
  • Integrated real time clock (RTC) for time-critical applications via the TPS65911
  • LP2996A DDR3L termination regulator

Products Matched

  • Processors

Description

PCI-Express provides for low pin-count, high reliability, and high-speed with data transfer at rates of up to 5.0 Gbps per lane, per direction, and an PCIe module is included on the TI 66AK2Gx DSP + ARM Processor system on chip (SoC).  This PCIe PCB design considerations reference design  (...)

Key Features

  • Optimized High Speed Signal Routing
  • Surface-Mount PCIe x1 Socket
  • Example of AC Coupling Capacitor Placement
  • Example of Recommended Differential Pair Spacing

Products Matched

  • Processors

Description

System level cost savings tactics are a focus of this board design. Key areas affecting fabrication costs are number of PCB layers and via drill size. The AM570x features a package with via channel arrays. These channels make it possible to build the PCB in only 6-layers while still achieving 100 (...)

Key Features

  • Sitara™ AM570x System on Chip (17 x 17 mm)
  • Reference design files for a 6-layer board
  • 100% signal breakout and routing for all signals
  • SerDes routing for DDR, HDMI, USB3, & CSI-2
  • Reference power design with TPS65916 PMIC

Products Matched

  • Processors

Description

The commonly-accepted existing solution to interface Tamagawa SmartAbs full-absolute or Smart Inc encoders with a drive feedback and control system is to use a Smartceiver AU5561N1. Use of these receivers requires additional components, complexity, and costs to the system. This reference design (...)

Key Features

  • Tamagawa receiver on AM437x using PRU-ICSS
  • Tamagawa smartceiver AU5561N1 compatible
  • Supports 2.5Mbps full-absolute SmartAbs and SmartInc encoders
  • Supports data readout and reset frames

Products Matched

  • Processors

Description

TI provides the system solution for Industrial Communication on Sitara™ processors with Programmable Real-Time Unit and Industrial Communication Subsystem (PRU-ICSS). PRU-ICSS allows custom firmware applications in the field of real-time applications. The I2C peripheral on many application (...)

Key Features

  • Supports I2C and SMbus master interface with PRU-ICSS
  • Dynamic block moe read and write transfer
  • Contains PRU-ICSS source code for customization
  • I2C register interface emulation

Products Matched

  • Processors

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