PowerStack(tm) Packaging Technology Overview
PowerStack(tm) Packaging Technology Overview
TI's PowerStack(tm) packaging technology is a unique stacked clip QFN approach, used in power management products targeted at number of high performance applications such as computing and telecommunications. In this video, learn how PowerStack tec
投稿日: 25-Jan-2011
時間: 04:16
アクセス数: 2872