Wireless Solutions
TI's first ARM Cortex-A15 mobile applications chip
OMAP™ 5 Platform
TI's first ARM® Cortex™-A15 mobile applications processor
more

CC2567, the first dual-mode single-chip solution
TI introduces the CC2567,
the first dual-mode single-chip solution delivering ANT+ and Bluetooth® connectivity
more
clear gif

WiLink™ 4.0 mWLAN Solutions (WL1251/WL1253) - Availability Disclaimer

Texas Instruments (TI's) WiLink™ mobile Wireless LAN (mWLAN) platform includes single-chip solutions to drive Voice over WLAN (VoWLAN) into mainstream mobile phones. Based on TI's DRP™ technology, the WiLink 4.0 mWLAN platform is comprised of hardware and software optimized for handsets, and provides consumers with on-the-go voice access over any WLAN network.

The included WiLink Software Development Kit (SDK) 4.X is optimized for embedded applications. This includes support for Linux®, Windows® WinCE™, Symbian™ operating systems, as well as lab testing and manufacturing software. It is partitioned to minimize host CPU loading and power consumption in mobile applications.

TI's WiLink 4.0 mWLAN platform offers two different hardware single-chip implementations to provide flexibility for OEMs to offer IEEE 802.11b/g or IEEE 802.11a/b/g operation.

WiLink 4.0 mWLAN Platform Solutions
Solution Supported Standards
WL1251 802.11 b / g
802.11 e / i / d / k
WL1253 802.11 a / b / g
802.11 e / i / d / k / h / j

Get Started Now: Download the following documents for more information:

  • WiLink 4.0 mWLAN Product Bulletin (WL1251/WL1253) (wl1251_1253_prod_bulletin.pdf, 140 KB)
    2005 Download

WiLink 4.0 mWLAN (WL1251 and WL1253) Single-Chip Solutions

  • Complete WLAN hardware and software solutions optimized for mobile IEEE 802.11b/g and IEEE 802.11a/b/g applications
  • The integrated Media Access Controller/Baseband/RF transceiver) reduces BOM costs, saves PCB space and extends standby and talk times
  • Market-leading physical size (6 mm x 6 mm BGA)
  • Support for Voice over WLAN (VoWLAN)
    • UMA (Unlicensed Mobile Access) technology
    • VoIP over WLAN
    • Quality of service, WPA, WPA2, CCX2.0, 3.0 and 4.0 for application specific devices
    • Advanced roaming support enabling rapid migration between access points and between WLAN and cellular subsystems
  • Industry's lowest power consumption with TI's Enhanced Low Power (ELP™) technology
  • Bluetooth® coexistence technology ensures high quality of service during simultaneous voice and data WLAN and Bluetooth operations


Availability Disclaimer

This product is intended for high-volume wireless OEMs and ODMs and is not available through distributors. If your company meets this description, please contact your TI sales office.

Back to Top