OMAP™ Mobile Processors : OMAP™ 4 Platform

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Product Bulletin

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  • OMAP™ 5 mobile applications platform
    14 Nov 2012  Download


Chip Block Diagram | OMAP™ 5 Key Benefits | White Papers | System Block Diagrams | Videos | News Releases

 

Chip Block Diagram

OMAP5430 Chip Block Diagram - Thumbnail
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OMAP5430 Key Benefits

  • Designed to drive multimedia-rich devices
  • Multi-core ARM® Cortex™ processors
    • Two ARM Cortex-A15 MPCore processors capable of speeds up to 1.7 GHz each
    • Two ARM Cortex-M4 processors for low-power offload and real-time responsiveness
  • Multi-core POWERVR™ SGX544-MPx graphics accelerators drive 3D gaming and 3D user interfaces
  • Dedicated TI 2D BitBlt graphics accelerator
  • IVA-HD hardware accelerators enable full HD 1080p60, multi-standard video encode/decode as well as 1080p30 stereoscopic 3D (S3D)
  • Faster, higher-quality image and video capture with up to 24 megapixels (or 12 megapixels S3D) imaging and 1080p60 (or 1080p30S3D) video
  • Supports four cameras and four displays simultaneously 
  • Packaging and memory: 14mm x 14mm, 0.4mm pitch PoP dual-channel LPDDR2 memory
Feature Allows
28 nanometer CMOS low-power process The highest levels of processor performance and lowest power consumption

Multi-core ARM architecture with Symmetric Multiprocessing (SMP) including 2 ARM Cortex-A15 MPCore processors and 2 ARM Cortex-M4 processors

  • Higher mobile computing performance
  • 2-3x higher performance versus previous generation
  • Faster user interfaces and less power consumption
  • SMP's scalable performance activates only the cores that are needed for that particular process
  • Hardware virtualization through Hypervisor allows power and performance-efficient, multiple guest operating system (OS) support
IVA 3 HD multimedia accelerator
  • Full HD 1080p60 multi-standard video encode/decode
  • Hardwired codecs deliver high performance at low power levels
  • Programmable DSP provides flexibility for future codecs
  • Provides support for high definition stereoscopic 3D encode/decode at 1080p30
Multi-Imagination Technologies' POWERVR™ SGX544-MPx graphics core
  • Greater than 5x performance increase versus previous generation
  • Compelling 3D graphics interfaces
  • Supports large screen sizes at higher frames per second while still consuming less power than previous cores
    Supports all the major APIs, including: OpenGL® ES v2.0, OpenGL® ES v1.1, OpenCL v1.1, OpenVG v1.1 and EGL v1.3
Multi-core imaging and vision processing unit
  • Enhanced image quality, up to 24-megapixel 2D or 12-megapixel S3D
  • Faster system performance
  • Reduced external components
  • Lower system cost
  • Lower system power
M-Shield™ mobile security technology enhanced with ARM TrustZone® support and based on open APIs
  • Content protection
  • Transaction security
  • Secure network access
  • Secure flashing and booting
  • Terminal identity protection
  • Network lock protection
SmartReflex™ 3 technology
  • Advanced power reduction
  • Dynamically controlled voltage, frequency and power based on device activity, modes of operation and temperature
  • Ultra low voltage retention support
TI power management/audio codec companion devices support
  • Maximized battery life
  • Boosted system performance
  • Significantly reduced board space and system cost
  • Efficiently managed energy and audio functionality
Low Power Audio
  • Provides up to 140+ hours of CD-quality audio playback
Comprehensive Software Suite
  • Faster time to market
  • Lower R&D costs
  • Ensures highest performance possible in customer’s handsets

Support Features

  • Up to three simultaneous, high-resolution, color-rich LCD display support
  • HDMI 1.4a output to drive HD displays, including S3D
  • MIPI serial camera and serial display interfaces
  • MIPI® SLIMbusSM
  • MMC/SD
  • USB 3.0 On-The-Go (OTG) Super Speed with integrated PHY interface
  • Comprehensive software suite supporting all major mobile OSes that is fully integrated and tested for real-world use cases to reduce development time and costs
  • OMAP Developer Network provides programs and media components for manufacturers to create distinctive products delivered to market quickly
  OMAP5430 OMAP5432
Target Markets Area-sensitive Cost-sensitive
Process node 28 nanometer low-power process
ARM® Cortex™-A15 Clock Speed (two) Up to 2 GHz
2D & 3D Graphics Multi-core, hardware accelerated
Video performance (2D) 1080p60 multi-standard
Video Performance (3D) 1080p30 multi-standard
Imaging Performance Up to 24 MP
(MIPI® CSI-3+ 3x MIPI® CSI-2+ CPI interfaces)
Up to 20MP
(3x CSI-2+ CPI interfaces)
Memory Support 2xLPDDR2 2xDDR3/DDR3L
Peripheral Support UART (6x), HSIC (3x), SPI (4x), MIPI® UniPortSM-M, MIPI® LLI, HSI (2x)

UART (5x), HSIC (2x), SPI (3x)
MIPI® UniPortSM-M, MIPI® LLI, HSI

Package 14mm x 14mm PoP
980 balls
0.4mm pitch (240-ball, 0.5mm PoP) I/F)
17mm x 17mm BGA
754 balls
0.5mm pitch (w/depop)

 

White Papers

Download Datasheets Going "beyond a faster horse" to transform mobile devices
05 May 11 Download

 

System Block Diagrams

OMAP5430 Chip Block Diagram - Thumbnail
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Videos

video platform video management video solutions video player {SEO}

 

News Releases

Date Headline
7 Feb 2011 Not just a faster horse: TI's OMAP™ 5 platform transforms the concept of 'mobile'

 

Availability Disclaimer

OMAP™ processors feature multicore ARM Cortex-A series designs and are intended for high-volume manufacturers, and are available by contacting TI sales offices. OMAP processor-based modules and design support for other customers may be available through authorized TI Design Network members.

OMAP is a trademark of Texas Instruments. Other product or service names mentioned herein are the trademarks of their respective owners.