The world isn't flat, and mobile technologies don't have to be either, thanks to TI's OMAP™ platform.
Me-D experiences are interactions in which consumers are no longer limited to the
physical confines of a mobile device, but rather set free by the ability to make
any physical environment the center of their mobile universe. Initial Me-D experiences
fit into three dimensions:
touchless gesturing in the "natural" dimension
stereoscopic 3D (S3D) in the "third" dimension
interactive projection in the "projected" dimension.
The natural dimension: Gesturing
Everyday conversations not only include speech, but natural body gestures. TI's OMAP
platform brings these common, intuitive gestures to the mobile environment as a new
means to interact with devices.
TI is partnering with leading software and hardware developers to create a touchless
gesturing engine for the OMAP platform. Leveraging the OMAP platform's imaging and
vision hardware accelerators, programmable DSP and embedded programmable CPU, along
with a single, simple low-resolution and low-power camera geared for mobile devices,
our solution will come with a complete application framework supported and set of
tools. When combined, these things will, enable application developers and OEMs to
easily access our gesturing library, and connect gesture features to existing and
future applications. The solution is expected to be available in the second quarter
of 2011.
The third dimension: Stereoscopic-3D (S3D)
Glasses are not a requirement for 3D vision in the real-world, nor are they needed
to lift mobile experiences to the third dimension.
Unlike other mobile processor offerings, TI's OMAP platform is an unequaled enabler
of the third dimension, with the optimal hardware resources, processing performance
and flexibility to support "glasses-free" visuals in up to HD quality. These resources
include a powerful image signal processor that can support two cameras and provides
a crystal-clear S3D images. A programmable display controller supports local auto-stereoscopic
displays and external 3D TVs connected using HDMI cables. The programmable IVA-HD
also provides support for S3D record and playback up to HD quality.
TI is partnering with software developers to design solutions that will enable a variety
of 3D experiences including S3D, HD video and image capture, processing and rendering,
and 2D-to-S3D conversion.
The projected dimension: Interactive projection
Consumers constantly demand new ways to enjoy and share content. Today, it's not just
about the ability to project a video or presentation on a wall - it's about interacting
with those projected images in the same way possible with a touchscreen. Imagine projecting
slides on a wall and moving objects around with a simple touch and drag, or projecting
a virtual keyboard on a café table to type a note to a friend.
The unmatched combination of TI's powerful OMAP platform and DLP® Pico™ projection
technologies will expand mobile devices' interface area to include tables, walls,
desks or virtually any surface via interactive projection. The OMAP platform is equipped
with highly optimized hardware accelerators and software, which together allow high-performance,
interactive projection at low power levels. OMAP processors' gesture recognition
software is able to identify the projected image, the finger position and the "click."
Support for this interactive projection technology will be available in the second
half of 2011.
Videos
Availability Disclaimer
This product is intended for high-volume mobile OEMs and ODMs and is not available
through distributors. If your company meets this description, please contact your
TI sales office.