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X	TEXAS INSTRUMENTS NORWAY LPRF              		            X
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X	Address: Hoffsveien 70C    0377 OSLO	              	            X
X 	web: http://www.ti.com/lsds/ti/wireless-connectivity/overview.page  X
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PCB NAME : CC26x1P1F32EM-7XD24-PA24_10dBm
REVISION: B1
DATE: 2022-04-04

FILE:  PACKED WITH WinZIP 

PCB DESCRIPTION:4 LAYER PCB 
Design Cross Section
TOP,CONDUCTOR,COPPER,0.035mm
DIELECTRIC,FR-4,0.175mm
L2,PLANE,COPPER,0.018mm
DIELECTRIC,FR-4,1.140000mm
L3,PLANE,COPPER,0.018mm
DIELECTRIC,FR-4,0.175mm
BOTTOM,CONDUCTOR,COPPER,0.035mm


Total Thickness: 1.60 MM (Tolerance +/- 0.16MM)


Via L1-L4

Soldermask color: GREEN

  IPC 4101/126 or equivalent substrate
  Dimensions in mm
  DOUBLE SIDE SOLDER MASK,
  DOUBLE SIDE SILKSCREEN,
  0.15 MM MIN TRACE WIDTH AND 0.15 MM MIN ISOLATION.

                 
FILE NAME            		DESCRIPTION                               	FILE TYPE
-------------------------------------------------------------------------------------------
NOTE: "*" is replaced by "CC26x1-P3EM-5XS24-PA24_10dBm_"

***PCB MANUFACTURING FILES: (Folder Gerber)
*Top.art                 	LAYER 1 TOP SIDE/POSITIV              		EXT. GERBER
*Bottom.art                  	LAYER 4 SOLDER SIDE/POSITIV                 	EXT. GERBER
*soldmask_top.art            	SOLDER MASK COMPONENT SIDE/NEGATIVE             EXT. GERBER
*soldmask_bottom.art            SOLDER MASK SOLDER SIDE/NEGATIVE            	EXT. GERBER
*silk_top.art	            	SILKSCREEN COMPONENT SIDE/POSITIVE              EXT. GERBER
*silk_bottom.art		SILKSCREEN SOLDER SIDE/POSITIVE             	EXT. GERBER
*drill.art		        DRILL/MECHANICAL DRAWING                    	EXT. GERBER
*assembly_top.art	        ASSEMBLY DRAWING COMPONENT SIDE/NEGATIVE        EXT. GERBER
*assembly_bottom.art        	ASSEMBLY DRAWING SOLDER SIDE/NEGATIVE   	EXT. GERBER
*paste_top.art	             	SOLDER PAST COMPONENT SIDE/POSITIVE             EXT. GERBER
*paste_bottom.art	        SOLDER PAST SOLDER SIDE/POSITIVE                EXT. GERBER
*art_param.txt                  Gerber report 				        ASCII
*photoplot.log                  Gerber report					ASCII
CC26x1-P3EM-5XS24-PA24_10dBm.ipc 	IPC export ASCII


***PCB DRILL FILES: (Folder Drill)
NCdrill-1-4.drl                 NC DRILL Plated		                       	EXCELLON
NCdrill-1-4-np.drl		NC DRILL non-Plated		 	        EXCELLON
ncdrill.log		        DRILL/NC DRILL REPORT                           ASCII
nc_pararm.txt		        PCB PHOTOPLOTTER DEFINITION FILE	        ASCII
nc_tools_auto.txt               Drill diameters				        ASCII


*** ASSEMBLY FILES: (Folder Assembly)
pick_and_place.txt            	PICK AND PLACE FILE 			        ASCII
*BOM-B1.xlsx 			BOM						Excel


*** Document files: (Folder docs)
*schematic.pdf			Circuit Diagram			PDF
*layout.pdf      		Layout Diagram			PDF
*mechanical.pdf			Mechanical drawing		PDF
*assembly.pdf			Assembly drawing       		PDF


README.TXT           		THIS FILE        		ASCII


Revision history:

R A0
--------------------------------------------------------------------------------------------
-Initial release revision.
-Based on CC1352PEM-XD7793-XD24-PA24_10dBm rev. C1
- Changed C11 C15 C51 C81 C91 from GRM1555C1H120JA01D to GJM1555C1H120JB01D
- Changed C12 C21 from GRM1555C1H1R1BA01D to GJM1555C1H1R1BB01D
- Changed C13 C14 from GRM1555C1H1R0BA01D to GJM1555C1H1R0BB01D
- Changed C16 C32 C36 from GRM1555C1H101JA01D to GRT1555C1H101JA02D
- Changed C31 C53 C61 from GRM1555C1H1R2BA01D to GJM1555C1H1R2BB01D
- Changed C33 C41 from GRM1555C1H3R0CA01D to GJM1555C1H3R0CB01D
- Changed C34 from GRM1555C1H2R7CA01D to GJM1555C1H2R7CB01D
- Changed C35 from GRM1555C1H5R6CA01D to GJM1555C1H5R6CB01D
- Changed C52 from GRM155R71E103KA01D to GRM155R71H103MA88D
- Changed C54 from GRM1555C1HR80BA01D to GJM1555C1HR80BB01D
- Changed C55 C56 from GRM1555C1H1R6BA01D to GJM1555C1H1R6BB01D
- Changed C57 from GRM1555C1H6R8CA01D to GJM1555C1H6R8BB01D
- Changed C231 from GRM155R61E105KA12D to GRM155C81C105KE11D
- Changed C331 C341 from GRM188R60J226MEA0D to GRM188C80J226ME15D
- Changed C461 C471 from GRM1555C1H7R5CA01D to GJM1555C1H7R5CB01D
- Changed U1 from CC1352P1F3RGZR to CC2651P1F32TRGZR
- Changed Y1 from FC-135 32.7680KA-AG0 to TZ1166C
- Changed Y2 from NX2016SA 48.000MHz EXS00A-CS05517 to TZ2365C
- Removed C31,C32,C33,C34,C35,C36,C41,L31,L32,L33,L34,L41 and L42
- Single ended 5dBm network
- 10dBm network moved closer IC pins
---------------------------------------------------------------------------------------------
R A1
--------------------------------------------------------------------------------------------
- Changed C482, C483 from GJM1555C1H1R2BB01D to GJM1555C1H1R4BB01D
- Changed C54 from GJM1555C1H1R2BB01D to GJM1555C1H1R0BB01D
- Changed C55 from GJM1555C1H1R4BB01D to GJM1555C1H1R3WB01D
- Changed C56 from GJM1555C1H1R6BB01D to GJM1555C1H1R2BB01D
- Changed C57 from GJM1555C1H6R8BB01D to GJM1555C1H120JB01D
- Changed L52, L61 from LQG15HS2N0S02D to LQG15HS2N2S02D
- Changed L53 from LQG15HS1N8S02D to LQG15HS3N9S02D
- Changed L54 from LQG15HS1N0S02D to LQG15HS1N5S02D
---------------------------------------------------------------------------------------------
R B0
--------------------------------------------------------------------------------------------
Layout and placement changes for DCDC circuit
Some schematic cleaning
---------------------------------------------------------------------------------------------
R B1
--------------------------------------------------------------------------------------------
- Changed C56 from GJM1555C1H1R2BB01D to GJM1555C1H1R3WB01D
END.
