Waived DRC Error Report
C:/srf04/Agama/Agama_Lite_EM_Designs/CC26x1-P3EM-7XD24-PA24/Cadence/allegro/CC26x1-P3EM-7XD24-PA24.brd
Thu Dec 17 14:38:31 2020

DRC Error Count Summary
DRC Error Type,DRC Error Count
Package to Package,12
Miscellaneous,25
Total DRC Errors,37

Detailed DRC Errors
Constraint Name,DRC Marker Location,Required Value,Actual Value,Constraint Source,Constraint Source Type,Element 1,Element 2,Comment
Package to Package Spacing,(113.873 102.673),1.77 MM,4.88 MM,PACKAGE_HEIGHT_MIN,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.482 102.473),1.77 MM,4.88 MM,PACKAGE_HEIGHT_MIN,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.482 102.473),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.482 128.943),1.77 MM,4.88 MM,PACKAGE_HEIGHT_MIN,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.252 102.673),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.482 102.673),1.77 MM,4.88 MM,PACKAGE_HEIGHT_MIN,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(113.873 102.665),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(114.042 102.673),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(113.873 128.875),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.482 128.943),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.343 128.875),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Package to Package Spacing,(140.482 102.673),0 MM,1.77 MM,NONE,DESIGN,Shape "Sc2  Package Geometry/Place_Bound_Top",Shape "Sc1  Package Geometry/Place_Bound_Top",Shield lid over shield frame
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 110.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 114.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 112.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 114.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 110.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 113.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 113.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 113.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 114.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 114.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 113.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 112.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 112.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 111.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 110.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (126.175 111.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (127.175 111.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 113.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 110.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 111.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 114.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 110.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (124.175 112.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (125.175 111.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground
Via at SMD thru,(125.140 112.565),FALSE,TRUE,NONE,DESIGN,Via "Via_Chip  (123.175 112.525) (Gnd)",Pin "U3.49 (Gnd)",Via placed for better connection to ground

