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Application Notes

 

Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241, allow for board miniaturization, and hold several advantages over traditional SOIC, SSOP, TSSOP, and TVSOP packages. The packages are physically smaller, have a smaller routing area, improved thermal performance, and improved electrical parasitics, while giving customers a pinout scheme that is consistent with the previously mentioned packages. Additionally, the absence of external leads eliminates bent-lead concerns and issues. These QFN packages have reliable solderability with either SnPb or Pb-free solder paste and are packaged to industry-standard tape-and-reel specifications. Package marking is in accordance with TI standards.