Featured applications

TI DLP® chipsets have enabled powerful, flexible, and programmable light control solutions. The DLP advanced light control product portfolio extends this industry-leading MEMS display technology into ultra-violet and infrared wavelengths, while also enabling faster pattern rates and more advanced pixel control. Through complete reference designs and easy-to-use development tools, TI is accelerating innovative new product development into industrial light control applications.

Learn about advanced light control applications in the following areas:

3D Machine Vision

DLP systems can produce non-contact, highly accurate 3D data in real-time using programmable structured light patterns. By projecting a series of patterns onto an object and capturing the light distortion with a camera or sensor, one can generate a 3D point cloud. The point cloud can be used directly for analysis of the object’s surface area, volume, or feature sizes. It can also be exported to a variety of CAD modeling formats.

3D Machine Vision

Why DLP technology for 3D Machine Vision

DLP feature Design benefit
Optical MEMS device (up to 4M pixels) Enables non-invasive, non-contact 3D scans reliable over time and temperature
Programmable, high speed pattern generation (up to 32 kHz) Real-time scan data, optimized for multiple objects and environments using adaptive pattern sets
External Triggers Synchronize to external cameras and sensors
High bit depth Higher accuracy and resolution
Extended wavelength support (up to 2500 nm) Supports wide range of light sources for best scans of varying materials and colored objects
Small Form Factor Portable, lower cost solutions when combined with TI's embedded processors

Use 3D Machine Vision for:

Automated Optical Inspection
Automated Optical Inspection

3D Metrology
3D Metrology

Laser Scanning Alternative
Factory Automation

Medical Imaging
Medical Imaging

Biometrics
Biometrics

3D Machine Vision products and development kits

DLP chipsets differ in Digital Micromirror specifications and controller features. The best choice for a DLP chipset may depend on the desired object feature size, patterning speed and system form factor.

Portability High resolution High speed
Digital Micromirror Device (DMD) DLP3000 DLP4500 DLP4500NIR DLP6500FYE / DLP6500FLQ DLP9000 DLP7000 DLP9500
Resolution 608 x 684 912 x 1140 912 x 1140 1920 x 1080 2560 x 1600 1024 x 768 1920 x 1080
Controller DLPC300 DLPC350 DLPC350 DLPC900 DLPC900 (qty 2) DLPC410 DLPC410
Max Pattern Rate 4 kHz 4.2 kHz 4.2 kHz 9.5 kHz 15 kHz 32.5 kHz 23.1 kHz
Optimized Wavelength 420 - 700 nm 420 - 700 nm 700 - 2500 nm 420 - 700 nm 400 - 700 nm 400 - 700 nm 400 - 700 nm
Evaluation Module DLP LightCrafter™ DLP LightCrafter 4500 DLP NIRscan™ DLP6500FYE: DLP LightCrafter 6500 DLP LightCrafter 9000 DLP Discovery™ 4100 DLP Discovery 4100

3D Printing

3D printing builds an object by depositing material one layer at a time and allows designers and manufacturers to speed up development cycles, make quick adjustments to molds and prototypes, and create highly detailed and customizable parts. Stereolithography 3D printers build objects one layer at a time by curing photosensitive material such as of liquid photopolymer resins. A Computer Aided Design (CAD) model of the object is first converted into a series of cross-sectional slices, representing individual print layers. DLP technology allows an entire cross-sectional slice to be exposed in a single shot by generating a 2D light pattern. This provides faster build times than systems using point-by-point exposure and allows build speeds to be independent of layer complexity.

3D Printing

Why DLP technology for 3D Printing

DLP feature Design benefit
2D light pattern generation Exposes entire print layer on a single shot for fast build times independent of layer complexity
High resolution micromirror array Enables sub 50μm resolution on the image plane.
Extended wavelength support (down to 363 nm) Compatible with a wide range of polymers, resins, and other build materials.
Reliable MEMS technology No expensive parts to replace

Use 3D Printing for:

Rapid Prototyping
Rapid Prototyping

Direct Manufacturing
Direct Manufacturing

Tooling & Casting
Tooling & Casting

Tooling & Casting
Custom Fit Products

3D Printing products and development kits

DLP chipsets are available with different DMD sizes, pixel pitches, resolutions, and other specifications. DLP products also offer devices targeted for use with UV exposure. The best choice for a DLP chipset may depend on the desired object feature size, patterning speed and necessary wavelengths to cure the resin.

Portability High resolution High speed
Digital Micromirror Device (DMD) DLP3000 DLP4500 DLP6500FYE /
DLP6500FLQ
DLP9000 DLP7000 /
DLP7000UV
DLP9500 /
DLP9500UV
DLP9000X
Resolution 608 x 684 912 x 1140 1920 x 1080 2560 x 1600 1024 x 768 1920 x 1080 2560 x 1600
Controller DLPC300 DLPC350 DLPC900 DLPC900 (qty 2) DLPC410 DLPC410 DLPC910
Max Pattern Rate 4 kHz 4.2 kHz 9.5 kHz 9.5 kHz 32.5 kHz 23.1 kHz 15.0 kHz
Max Pixel Data Rate 1.7 Gbps 4.4 Gbps 19.7 Gbps 39 Gbps 25.2 Gbps 48.0 Gbps 61.1 Gbps
Optimized Wavelength 420 - 700 nm 420 - 700 nm DLP6500FYE: 420 - 700 nm,
DLP6500FLQ: 400 - 700 nm
400 - 700 nm DLP7000: 420 - 700 nm,
DLP7000UV: 363 - 420 nm
DLP9500: 400 - 700 nm,
DLP9500UV: 363 - 420 nm
400 - 700 nm
Evaluation Module DLP LightCrafter DLP LightCrafter 4500 DLP6500FYE: DLP LightCrafter 6500 DLP LightCrafter 9000 DLP Discovery 4100 DLP Discovery 4100 -

Digital Lithography

Digital lithography is used for PCB manufacturing, flat panel display repair, laser marking, and other light exposure systems. In digital lithography, DLP technology provides high speed and high resolution light patterns to expose photoresist films and other photosensitive materials without using contact masks. This reduces material cost, improves production rates, and allows for rapid pattern changes, especially ideal for use cases where fine feature sizes require double patterning.

Digital Lithography

Why DLP technology for Digital Lithography

DLP feature Design benefit
High speed digital pattern generation (up to 32 kHz) Improve manufacturing throughput and eliminate physical masks or print plates
Multiple micromirror sizes available (7,10,13 µm) Achieve micron-level feature sizes
Extended wavelength support (down to 363 nm) Cure a variety of photosensitive materials

Use Digital Lithography for:

Printed Circuit Boards
Printed Circuit Boards

Flat Panels
Flat Panels

Computer-to-Plate Printing
Computer-to-Plate Printing

Laser Marking
Laser Marking

Digital Lithography products and development kits

DLP chipsets are available with different DMD sizes, pixel pitches, resolutions, and other specifications. DLP Products also offers devices targeted for use with UV exposure. The best choice for a DLP chipset may depend on the desired feature size, patterning speed, system form factor, and wavelength range.

High resolution High speed
Digital Micromirror Device (DMD) DLP6500FYE /
DLP6500FLQ
DLP9000 DLP7000 /
DLP7000UV
DLP9500 /
DLP9500UV
DLP9000X
Resolution 1920 x 1080 2560 x 1600 1024 x 768 1920 x 1080 2560 x 1600
Controller DLPC900 DLPC900 (qty 2) DLPC410 DLPC410 DLPC910
Max Pattern Rate 9.5 kHz 9.5 kHz 32.5 kHz 23.1 kHz 15.0 kHz
Max Pixel Data Rate 19.7 Gbps 39 Gbps 25.2 Gbps 48.0 Gbps 61.1 Gbps
Optimized Wavelength DLP6500FYE: 420 - 700 nm
DLP6500FLQ: 400 - 700 nm
400 - 700 nm DLP7000: 420 - 700 nm
DLP7000UV: 363 - 420 nm
DLP9500: 400 - 700 nm
DLP9500UV: 363 - 420 nm
400 - 700 nm
Evaluation Module DLP6500FYE: DLP LightCrafter 6500 DLP LightCrafter 9000 DLP Discovery 4100 DLP Discovery 4100 -

Digital Lithography reference designs

End Equipment Featured TI Design Key Product
  High speed, high resolution lithography subsystem DLP9000X

Spectroscopy

All molecules have unique responses to different wavelengths of light. Spectroscopy is an analysis technique that uses these unique responses to identify and characterize materials. In a spectrometer design, the TI DLP Digital Micromirror Device (DMD) can be used as a programmable wavelength selector. Broadband light goes through an optical slit. Then the individual wavelengths of light are dispersed onto the micromirror array using a diffraction grating or prism, allowing subsets of the micromirror array to be mapped to specific wavelengths. Specific wavelengths of light can then be switched to a single-element detector. This powerful design architecture eliminates the need for linear array detectors or motors to generate a spectral scan over a wavelength range, enabling chemical analysis with higher performance and smaller form factors at lower costs.

Spectroscopy

Why DLP technology for Spectroscopy

DLP feature Design benefit
High resolution, programmable optical MEMS array Use a large single element detector to capture more light than with linear array detects without sacrificing wavelength resolution
Extended wavelength support (up to 2500 nm) Enables a single spectral engine customizable for a variety of solids and liquids and multiple light sources
High speed switching Generate fast spectral scans for real-time material analysis with adjustable scan parameters
Reliable MEMS technology Stable over temperature and lifetime and enables compact, robust designs

Use Spectroscopy for:

Agriculture
Agriculture

Oil & Gas Analysis
Oil & Gas Analysis

Food & Drug Inspection
Food & Drug Inspection

Water & Air Quality
Water & Air Quality

Chemical & Material Identification
Chemical & Material Identification

Spectroscopy products and development kits

DLP solutions offer high performance and system programmability to optimize various spectroscopy designs. The best choice for a DLP chipset will depend on the spectroscopy system’s requirements for wavelength range, desired wavelength resolution, and spectrum measurement acquisition speed. TI provides free software and firmware downloads allowing developers to easily create, store, and display high-speed pattern sequences through USB-based application programming interface (API) and easy-to-use graphical user interface (GUI).

Small form factor High resolution
Digital Micromirror Device (DMD) DLP2010NIR DLP4500NIR
Resolution 854 x 480 912 x 1140
Digital Controller DLPC150 DLPC350
Max Pattern Rate 2,880 Hz 4,225 Hz
Optimized Wavelength 700 - 2500 nm 700 - 2500 nm
Evaluation Module (EVM) DLP NIRscan Nano DLP NIRscan
EVM Features
  • 900 - 1700 nm wavelength range
  • 10 nm spectral resolution
  • Up to 6000:1 signal-to-noise ratio with included reflective head
  • Bluetooth® and Bluetooth low energy for wireless connectivity with battery charging option
  • 1350 - 2450 nm wavelength range
  • 12 nm spectral resolution
  • More than 30,000:1 signal to noise ratio with included transmissive head