The TI EP solution is comprised of catalog devices in industry standard packaging that have the benefits of a controlled baseline, extended product change notification (PCN), extended temperature performance, and a qualification pedigree.
The TI EP solution is comprised of catalog devices in industry standard packaging that have the benefits of a controlled baseline (one assembly/test site, one fabrication site), extended product change notification (PCN), extended temperature performance, and a qualification pedigree. These products also come with assurance from TI, not a third party, that they will perform to the datasheet specifications in environments that require extended temperatures such as -55°C to 125°C.
TI's EP line is certified to the Aerospace Qualified Electronic Component (AQEC) Standard (ANSI/GEIA STD-0002-1). The AQEC Standard was jointly developed by the aerospace and semiconductor industries to define the minimum requirements for commercial-off-the-shelf (COTS) components used in military, avionic, aerospace, medical and other rugged operating environments where high-reliability and long service life are required.
The TI EP Qualification Pedigree
To ensure a device exhibits the highest quality and reliability possible for the targeted applications, TI performs the following qualification before the device is released:
All EP devices undergo a rigorous re-qualification to defense and aerospace standards
Qualification data is reviewed and audited for accuracy and compliance
Reliability and electromigration checks are done at maximum recommended operating conditions in the targeted package
Certified programs and test hardware
Electrical characterization is performed over temperature
Package performance is confirmed over extended temperatures (some mold compounds are not suitable for extended temperature)
Nickel-Paladium-Gold lead finish eliminates “Tin Whisker” reliability issue.
Reliability Concerns Associated with Upscreening:
Yield loss and damage due to electrical overstress and handling
Mechanical damage which causes moisture issues
Burn-in which can cause lead finish degradation
Lack of support by IC manufacturers
Few upscreening test facilities have the ability to test complex parts
No access to TI wafer processing history by third parties
TI's EP portfolio offers an alternative to upscreening for customers who believe that an enhanced product is suitable for their particular application. Although the EP products receive additional testing and process verification over and above their commercial counterparts, they may still not be suitable for all environments, so TI strongly suggests that OEMS qualify devices for their applications. For designers with applications that require a ceramic/hermetic packaged integrated circuit, TI has an expansive product line to meet their needs.
What to Expect from TI EP Products
Many of the problems associated with the purchase of COTS devices are alleviated by the EP products from TI. Customers get a cost-effective device with the added benefits of:
Enhanced process change notification
Qualification summary report available
Access to leading edge commercial technology
Commitment to the defense market
Enhanced obsolescence management
In addition to the active EP products listed on this website, TI will evaluate the release of other EP devices based on customer needs. Please contact TI's Product Information Center for your needs.
Please make a selection on the left hand side to view specific product information.