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TI Home > Logic
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With today's market demanding sustained 5-V operation and increased support at 3.3-V and 1.8-V VCC levels, TI's Little Logic product portfolio continues to grow faster and smaller than ever before. Along with this increase in product family technologies, next-generation wafer chip scale packaging (WCSP) has been introduced to meet the space-constrained applications of portable consumer electronics.


For more information, see the Little Logic Overview.

Technical Documents   

  • How to Select Little Logic (scya049.HTM, 8 KB)
    27 Apr 2010 Abstract
  • Semiconductor Packing Methodology (Rev. C) (szza021c.HTM, 8 KB)
    15 Aug 2005 Abstract

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