As modern process control systems become increasingly more complex, so does the requirement for embedded processing within individual sensor units. Whether it be for localized data analysis or to support the growing need for digital communication protocols, many sensor manufacturers are now including an MCU within the sensor to enable these new features.

Many existing wired sensors are being retrofitted with a digital communication channel capable of providing more information about the sensors current operating status. This can help to reduce cost of ownership by enabling preventative maintenance schemes which helps to identify failing sensors prior to total failure avoiding costly system breakdowns. Recent innovations in the wireless communication arena are helping to drive growth within the field of wireless sensor networks, when coupled with new energy harvesting techniques, wireless sensor networks are becoming an everyday reality in many remote monitoring situations.

Bringing together high performance analog peripherals, innovative FRAM memory technology combined with the world's lowest power consumption combine to make the MSP430 family of microcontrollers the ideal solution at the heart of new ultra-low-power industrial sensors.

Block Diagrams | Devices | Development Resources | Other Resources

Block Diagrams

• Temperature sensor: Thermocouple
• Temperature sensor: Thermistor
• Temperature sensor: RTD
• Pressure sensor
• Weigh Scale
• Flowmeter
• Gas Sensor
• pH Sensor

MSP430 Devices

Introducing the Wolverine Technology Platform

Imagine a world without wires or batteries! This is where our Wolverine technology is striving to take you. Advances in energy harvesting techniques coupled with this new ultra-low-power technology can make your wireless and batteryless system a reality.

TI achieves the "Wolverine" platform's impressive power gains through its new 130-nm ultra-low-leakage (ULL) process technology, integrated low-power non-volatile memory and enhanced MSP430 DNA with advanced power management and precision low-power analog.

• Active power as low as 100 μA/MHz
• < 400 nA standby with RTC and brown-out protection
• 250× less energy per bit with FRAM
• < 7 μs to wake to active from standby

Technical Documents and Development Resources

Useful Development Tools

MSP430 Experimenter Boards
Part Number	Featured Devices	Image	Features	Price
EM430F6137RF900	CC430F6137		Complete wireless development kit for the CC430 sub 1GHz RF system on chip. Including 2 CC430F6137 target boards, SMA mounting antennas, push buttons, LED's and AAA battery boxes.	$149
MSP-EXP430FR5739	MSP430FR5739		FRAM-based experimenter's board, accelerometer, thermistor, LEDs, switches, connections for RF modules, integrated Flash Emulation Tool.	$29
MSP-EXP430F5529	MSP430F5529		Complete USB development board, Dot Matrix LCD, microSD card, 3-axis accelerometer, 5-pad capacitive touch slider, RF Module connectors, LEDs, Integrated Flash Emulation Tool	$149

Other Resources

• View Ultra-Low Power MSP430™ MCU brochure
• View MSP430 Contributed Articles specific to Industrial Measurement & Sensing
• Visit TI's Sensor's portal to learn more about all TI Automation and Process Control Solutions
• Third Party Tools and Active User Discussion Groups provide additional resources