Ferroelectric Random Access Memory (FRAM) is a memory technology that combines the best features of Flash and SRAM. It is non-volatile like Flash, but offers fast and low power writes, write endurance of 10^15 cycles and unmatched flexibility. While new to microcontrollers, FRAM has been used in the industry for over a decade.
The MSP low-power microcontroller portfolio offers 16-bit and 32-bit multiplication modules on select devices. These peripherals can be used while the microcontroller is in low-power modes. Combined with optimized fixed and floating-point math libraries, MSP MCU performance can be increased dramatically.
The MSP low-power, advanced microcontroller portfolio provides embedded security systems that allow our customers to prevent, detect and respond to unintended or malicious behavior, including MCU reverse engineering. These secure microcontroller features include Advanced Encryption Standard (AES) hardware accelerators, IP encapsulation memory protection, anti-tampering, the FRAM advantage, among other features listed below. Learn more about how to protect your devices, solutions and services through the links below.
|Feature||Benefit||MSP Families||Learn more|
|FRAM||Fast writes log data quickly, and generate PRNG keys faster for cryptography. Also resistant to glitch-attacks||MSP430FR57x/59x/69x||Closing the security gap with TI’s MSP430™ FRAM-based microcontrollers|
|Debug Lockout||Prevent unauthorized access to the device through the debug interface. JTAG security fuse or FRAM password||All MSP families||MSP430™ Programming Via the JTAG Interface User’s Guide|
|BSL Password Protection||Use a BSL password to prohibit every command that potentially allows unauthorized direct or indirect data access||All MSP families||MSP430 Programming Via the Bootstrap Loader (BSL) User’s Guide
Configuring BSL and Security Features on MSP432 Microcontrollers, MSP432P401R Bootstrap Loader (BSL) User’s Guide
|Crypto-Bootloader||Counter the most important threats to in-field update mechanisms with authentication and encryption of firmware updates||MSP430FR59x,MSP430FR69x||Crypto-Bootloader – Secure in-field firmware updates for ultra-low-power MCUs|
|IP Encapsulation||Safely segregate your IPs from the rest of the application||MSP430FR59x/69x||MSP430FRxx User’s Guide (See 7.2.2 IP Encapsulation Segment(|
|IP Protection||Regional security to enable multiple parties with software IP protection needs to be involved in product development||MSP432P4x||Software IP Protection on MSP432P4xx Microcontrollers|
|256-bit AES Hardware Accelerator||Secure data transfers via the integrated hardware security accelerator while saving power by drastically reducing the cycles required for serial encryption/decryption||MSP430F5x/F6x, CC430, MSP430FR59x/69x, MSP432P4x||MSP430F5xx/6xx, CC430, and MSP430FRxx User’s Guide (See AES Accelerator Chapter)
MSP432P401x Technical Reference Manual (See AES Accelerator Chapter)
|True Random Number seed||Generate random AES keys, and do so more often with FRAM-based devices||MSP430FR59x/69x||MSP430FRxx User’s Guide (See 18.104.22.168 Random Number Seed)|
|Tamper Detection||Two pins can be used as an event or tamper detection input of an external switch (mechanical or electronic), with an RTC time stamp||MSP430F677x||MSP430F5xx/6xx User’s Guide (see 24.3.2 Real-Time Clock Event/Tamper Detection With Time Stamp)|
The power management module (PMM) manages all functions related to the power supply and its supervision for the device. Its primary functions are first to generate a supply voltage for the core logic, and second, provide several mechanisms
for the supervision and monitoring of both the voltage applied to the device (DVCC) and the voltage generated for the core (VCORE).
The PMM uses an integrated low-dropout voltage regulator (LDO) to produce a secondary core voltage (VCORE) from the primary one applied to the device (DVCC).
In general, VCORE supplies the CPU, memories (flash and RAM), and the digital modules, while DVCC supplies the I/Os and all analog modules (including the oscillators). The VCORE output is maintained using a dedicated voltage reference.
VCORE is programmable up to four steps, to provide only as much power as is needed for the speed that has been selected for the CPU. This enhances power efficiency of the system. The input or primary side of the regulator is referred to as its high side. The output or secondary side is referred to as its low side.
MSP MCUs with FRAM and CapTIvate™ technology are the most noise immune capacitive touch MCUs, with IEC61000-4-6 certified solutions and the most configurable combination of capacitive buttons, sliders, wheels, and proximity sensors, all at the world’s lowest power.
CapTIvate Design Center is a one-stop shop for CapTIvate technology tools, documentation, design guides and code examples. Captivate Design Center allows developers of all programming skill levels to create capacitive touch solutions with minimal effort; configure and tune your sensors in five minutes or less. The program is available for Microsoft® Windows®, Apple® OS X® and Linux®.
|# Buttons||Self-capacitance: up to 8 Mutual capacitance: up to 8||Self-capacitance: up to 8 Mutual capacitance: up to 16||Self-capacitance: up to 16 Mutual capacitance: up to 16||Self-capacitance: up to 16 Mutual capacitance: up to 64|
|Package||24-RGE (QFN)||24-RGE (QFN)||32-DA (TSSOP)
The ADC10 module supports fast 10-bit analog-to-digital conversions. The module implements a 10-bit SAR core with sample select control, reference generator, window comparator and data transfer controller (DTC). The DTC allows ADC10
samples to be converted and stored anywhere in memory without CPU intervention. The module can be configured with user software to support a variety of applications. The ADC also has a built in temperature sensor and supports a conversion rate of greater than 200ksps.
The ADC12 module supports fast 12-bit analog-to-digital conversions. The module implements a 12-bit SAR core, sample select control, reference generator, window comparator and data transfer controller (DTC). The DTC allows ADC12 samples to be converted and stored anywhere in memory without CPU intervention. The module can be configured with user software to support a variety of applications.
The ADC also has a built in temperature sensor and supports a conversion rate of greater than 200ksps.
The CTSD16 module consists of up to seven independent sigma-delta analog-to-digital converters, referred to as channels. The converters are based on second-order oversampling sigma-delta modulators and digital decimation filters. The decimation filters are comb-type filters with selectable oversampling ratios of up to 256. Additional filtering can be done in software.
The SD24 module consists of up to eight independent sigma-delta analog-to-digital converters. The converters are based on second-order oversampling sigma-delta modulators and digital decimation filters. The decimation filters are comb type filters with selectable oversampling ratios of up to 1024. Additional filtering can be done in software.
The DAC12 module is a 12-bit, voltage output DAC. The DAC12 can be configured in 8-bit or 12-bit mode and may be used in conjunction with the DMA controller. When multiple DAC12 modules are present, they may be grouped together for synchronous update operation.
The Comparator module supports precision slope analog-to-digital conversions, supply voltage supervision, and monitoring of external analog signals.
Features of the Comparator includes: inverting and non-inverting terminal input multiplexer, software selectable RC- filter for the comparator output, output provided to Timer capture input, software control of the port input buffer, interrupt capability, selectable reference voltage generator, comparator and reference generator can be powered down.
Analog-to-digital converters (ADCs) and digital-to-analog converters (DACs) are complex analog functions that consists of analog and digital components, some types use compensation methods and auto-zero (AZ) mechanisms to eliminate error sources. Modern converters provide automatic range control and other advanced features. A-POOL has none of those complex functions as ready modules; instead, it provides analog and analog-oriented digital elementary functions that can be used to build complex analog functions like DACs, ADCs, and SVMs of different kinds when combined through software.
A transimpedance amplifier (TIA) is a high-performance and low-power amplifier with rail-to-rail output. It has programmable power modes to suit different application needs. MSP430FR231x MCUs support a dedicated low-leakage pad for TIA negative input to reduce system current consumption.
The operational amplifiers (OA) support front-end analog signal conditioning prior to analog-to-digital conversion. The OA is a configurable low-current rail-to-rail operational amplifier. It can be configured as an inverting amplifier or a non-inverting amplifier, or it can be combined with other OA modules to form differential amplifiers. The output slew rate of the OA can be configured for optimized settling time vs power consumption.
The MSP low-power microcontroller portfolio features a broad set of devices with integrated segmented Liquid Crystal Display (LCD) controllers. These controllers include a proven core that has been optimized for low power. Combined with code examples and collateral, these MCUs are ideal for developers new to segmented displays as well as experienced engineers.
|Number of segments supported||128/4-MUX||160/4-MUX||160/4-MUX||320/8-MUX||448/8-mux|
|Segment functionality against port pin selection||Minimum is group of 16||Selection done in groups of 4 segments||Individual selection can be done||Individual selection can be done||Individual selection can be done|
|LCD Clock selection||ACLK||ACLK||ACLK, VLO||ACLK, VLO||ACLK, VLO|
|LCD Clock divider availability||NO|| 32 to 512
(8 settings with 32 counts apart)
| 1 to 1024
(192 settings with 111 unique dividers)
| 1 to 1024
(192 settings with 111 unique dividers)
| 1 to 1024
(192 settings with 111 unique dividers)
|Interrupt capabilities||NO||NO||YES (4 sources)||YES (4 sources)||YES (4 sources)|
|Individual segment blinking capabilities with separate memory||NO||NO||YES||YES||YES|
|Programmable blinking frequency||N/A||N/A||YES (64 settings)||YES (64 settings)||YES (64 settings)|
|Dual memory display||NO||NO||YES||YES||YES|
|Damage prevention due to no capacitance during charge pump selection||NO CHARGE PUMP||NO||YES||YES||YES|
|Charge pump voltage with external voltage reference||NO CHARGE PUMP||3 x Vref||Programmable (15 levels)||Programmable (15 levels)||Programmable (15 levels)|
|Low-power waveforms mode||NO||NO||NO||YES||YES|
|SEG/COM mux||COM fixed||COM fixed||COM fixed||COM fixed||each LCD pin|
|LPM3.5||not supported||not supported||not supported||not supported||supported|
TI’s unique, integrated low-energy accelerator (LEA) for signal processing is featured in the MSP430FR5994 MCU family. The accelerator allows developers to efficiently process data using vector-based signal processing functions such as FFT, FIR and matrix multiplication and other math operations up to 40x faster than ARM® Cortex®-M0+ MCUs running the CMSIS DSP library.
Implementing LEA requires very little digital signal processing (DSP) expertise since TI provides a free optimized DSP Library with support for more than 50 math functions and a plug-and-play design that allows developers to unbox the MSP430FR5994 LaunchPad™ development kit and start processing complex math algorithms in less than five minutes. LEA paired with the MSP430FR5994 family of MCUs with FRAM enables signal processing in a variety of applications including metering, building and factory automation equipment and health and fitness devices.
The integrated general purpose I/O pins are designed to support a variety of needs dependent upon specific applications or pin configuration settings.
I/O pins may be multiplexed with multiple peripherals providing layout and peripheral flexibility to the system designer. These features could include serial port, analog input channels or touch-sensitive pin oscillation functionality.
While these microcontrollers typically operate with a core voltage between 1.8-3.6V depending on device, some MCUs have special features to enable an independent DVIO voltage supply to enable direct connection to true 1.8V (+/-10%) or 5V systems. Special I/O pins also support programmable drive strength up to 20mA.
The MSP Low Power + Performance MCU portfolio offers a broad portfolio of devices with integrated Universal Serial Bus (USB) and up to 512 KB of Flash memory. Development is made easy with the USB Developer’s Package and tools like the MSP430F5529 LaunchPad. TI also offers a USB Vendor ID sharing program to help jumpstart development.
MSP’s broad portfolio of microcontrollers allows our customers to innovate and create designs across a wide range of Internet of Things (IoT) applications, whether high performance or ultra low-power. These microcontrollers include system-on- chip solutions as well as software for simple pairing with external radio frequency (RF) transceivers. Software and TI Designs enable the combination of MSP MCUs and RF in complete system solutions. In addition, LaunchPad and BoosterPack hardware modules, development environments and white papers are available to help get your IoT design underway!
Integrated RF: CC430 and RF430 microcontrollers offer the industry’s lowest power, single-chip RF portfolio. These series of devices combine low power with tight integration between the MCU core, peripherals and RF interface.
External RF: TI offers radios including sub-1GHz, 6LoWPAN, Bluetooth® Smart, Wi-Fi®, NFC™ that pair with TI Low-power MCUs.
Explore TI’s extensive network of cloud partners and how they work with TI’s solutions.
|Wireless protocol||TI RF transceiver||TI MCU||Development tools||Software|
|Sub-1GHz||MSP430G2553||MSP-EXP430G2 & 430BOOST-CC110L||Energia|
|MSP430F5529||MSP-EXP430F5529LP & 430BOOST-CC110L||Energia|
|MSP430FR5969||MSP-EXP430FR5969 & 430BOOST-CC110L||Energia|
|MSP432P401R||MSP-EXP432P401R & 430BOOST-CC110L||Energia|
|Wi-fi||MSP430FR5969||MSP-EXP430FR5969 & CC3100BOOST||Energia|
|MSP430F5529||MSP-EXP430F5529LP & CC3100BOOST||MSPWare and Energia|
|Bluetooth® and Bluetooth Smart||MSP430F5438A||MSP-EXP430F5438 & CC2564MODNEM||MSPWare|
|MSP430F5529||MSP-EXP430F5529 & CC2564MODNEM||MSPWare|
|Wireless protocol||TI Design name||TI Design number|
|Bluetooth® Smart||Wireless Motor Monitor Reference Design||TIDM-WLMOTORMONITOR|
|Optical Heart Rate Monitor Reference Design with BLE Connectivity||TIDA-00011|
|Body Weight Scale Reference Design with Body Composition capability and BLE Connectivity||TIDA-00009|
|Pulse Oximeter via Finger Clip Reference Design with BLE Connectivity||TIDA-00010|
|Bluetooth®||Bluetooth and MSP430 Audio Sink Reference Design||BT- MSPAUDSINK|
|IO-LINK||Turnkey IO-Link Sensor Transmitter||TIDA-00188|
|NFC||NFC EZ430 Reader Module Reference Design|
|Dynamic Field-Powered NFC for Data Logging Access Control & Security Applications Reference Design||TIDA-00217|
|PurePath™ Wireless 2.4 GHz||Wireless Subwoofer Amplifier Reference Design||TIDA-00232|