Packaging terminology

Following are definitions for TI common package groups, families, and preference codes, along with other important terminology you may find helpful when evaluating TI’s packaging options.

Common package groups Definition
BGA

Ball Grid Array

CFP

Both Formed and Unformed CFP = Ceramic Flat Pack

LGA

Land Grid Array

PFM

Plastic Flange Mount Package

QFP

Quad Flat Package

SIP

Single-In-Line Package

OPTO*

Light Sensor Package = optical

RFID

Radio Frequency Identification Device

CGA

Column Grid Array

COF

Chip on Flex

COG

Chip on Glass

DIP

Dual In-Line Package

DSBGA

Die Size Ball Grid Array (WCSP = Wafer Chip Scale Package)

LCC

Leaded Chip Carrier

NFMCA-LID

Substrate Metal Cavity with Lid

PGA

Pin Grid Array

POS

Package on Substrate

QFN

Quad Flatpack No Lead

SO

Small Outline

SON

Small Outline No Lead

TO

Transistor Outlines

ZIP

Zig-Zag In-Line

uCSP

Micro Chip Scale Package

DLP

Digital Light Processing

Module

Module

TAB

Tape Automated Bonding Package

 

Package family Definition
CBGA

Ceramic Ball Grid Array

CDIP

Glass-Sealed Ceramic Dual In-Line Package

CDIP SB

Side-Braze Ceramic Dual In-Line Package

CPGA

Ceramic Pin Grid Array

CZIP

Ceramic Zig-Zag Package

DFP

Dual Flat Package

FC/CSP

Flip Chip / Chip Scale Package

HLQFP

Thermally Enhanced Low Profile QFP

HQFP

Thermally Enhanced Quad Flat Package

HSOP

Thermally Enhanced Small-Outline Package

HTQFP

Thermally Enhanced Thin Quad Flat Pack

HTSSOP

Thermally Enhanced Thin Shrink Small-Outline Package

HVQFP

Thermally Enhanced Very Thin Quad Flat Package

JLCC

J-Leaded Ceramic or Metal Chip Carrier

LCCC

Leadless Ceramic Chip Carrier

LQFP

Low Profile Quad Flat Pack

PDIP

Plastic Dual-In-Line Package

SOJ

J-Leaded Small-Outline Package

SOP

Small-Outline Package (Japan)

SSOP

Shrink Small-Outline Package

TQFP

Thin Quad Flat Package

TSSOP

Thin Shrink Small-Outline Package

TVFLGA

Thin Very-Fine Land Grid Array

TVSOP

Very Thin Small-Outline Package

VQFP

Very Thin Quad Flat Package

DIMM*

Dual-In-Line Memory Module

HSSOP*

Thermally Enhanced Shrink Small-Outline Package

LPCC*

Leadless Plastic Chip Carrier

MCM*

Multi-Chip Module

MQFP*

Metal Quad Flat Package

PLCC*
Plastic Leaded Chip Carrier
PPGA*

Plastic Pin Grid Array

SDIP*

Shrink Dual-In-Line Package

SIMM*

Single-In-Line Memory Module

SODIMM*

Small Outline Dual-In-Line Memory Module

TSOP*

Thin Small-Outline Package

VSOP*

Very Small Outline Package

XCEPT*

Exceptions - May not be a real Package


Product preference code Definition
P

Preferred package. Package is qualified and orderable.

OK

Use if a preferred package is not available.

A

Requires department/business unit approval.

N

Not recommended for new designs.

X

Do not use. No longer supported. Not qualified. No longer tooled.


Quality terms Definition
JEDEC

The JEDEC Standard for this package type.

Length

The length of the device (in millimeters).

Maximum height

The maximum height above board surface form (in millimeters).

Pkg

Package designator code used in TI part numbers.

Pins

The number of pins or terminals on the package.

Package type | Pins

The TI package designator for a device, or the number of pins for a device.

Pitch

The distance between the centers of adjacent pins (in millimeters).

Thickness

The maximum thickness of the package body (in millimeters).

Type

The abbreviated acronymn for this type of package.

Width

The width of the device (in millimeters).

ePOD

Enhanced Package Online (Typically includes package outline, land pattern, and stencil design).

Land pattern

The pattern of solderable area on the PCB where a "no-lead" package may rest.

Footprint

The periphery leads and thermal pad of a "no-lead" package.

Coplanarity

The bottom surface of the package is parallel to the landing surface of the PCB.

Thermal pad = Exposed pad = Power pad

The central pad on the landing surface of a package that is electrically and mechanically connected to the board for BLR and thermal performance improvements

Search part number

The TI or customer part number entered on the initial Search page.

TI part number

The part number to use when placing orders.

PN type

Indicates whether the part number is Pb-Free or standard.

Eligibility

The device can be added to the ESL list immediately.

Assembly site

The plant location(s) where a TI device is assembled.

RoHS & High-Temp compatible (Y/N)

Indicates whether or not a device meets TI's "Pb-free" definition.

Pb-free

TI defines "Lead-free (Pb-free)" or "Pb-free" to mean semiconductor products that are compatible with the current RoHS requirements for all six substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials.

Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

RoHS

On January 27, 2003, the European Union passed the "Restriction on Use of Hazardous Substances in Electrical and Electronic Equipment," or "RoHS" legislation 2002/95/EC, which becomes effective July 1, 2006.

Pb-Free (RoHS) conversion date

The forecasted or actual conversion date for the specific device package, pin count & assembly site. When an actual conversion date is displayed, the Conversion Date Code (DC yyww) will also be displayed to help customers identify Pb-Free (RoHS compatible) parts.

To determine if parts that have already shipped are Pb-Free (RoHS compatible), compare the date and assembly site on the box label to the Conversion Date Code and corresponding assembly site location. If the assembly sites match, then boxes with dates later than the Conversion Date Code contain Pb-Free parts.

Customers can also look on the box label for the 2-character Environment Category (E-Cat) Code. If it starts with "e" or "G" (e3, e4, G3, G4, etc), then the box contains Pb-Free (RoHS compatible) parts (E-Cat Codes were added to boxes beginning on June 1st, 2004).

And finally, if the box label has the JEDEC Pb-Free logo and a Peak Reflow Rating of 250-260'C, the parts are Pb-Free (RoHS compatible).

JEDEC Pb-free logo
JEDEC Pb-Free logo
Pb-free (RoHS) available supply date

The forecasted or actual date that the device will be available for purchase.

Current Lead/Ball finish

The current metal finish on the leads or solder balls of a device.

Planned Lead/Ball finish

The planned metal finish on the leads or solder balls of a Pb-Free device.

Current MSL/reflow ratings

The moisture sensitivity level ratings and peak solder (reflow) temperatures. If 2 sets of MSL/reflow ratings are displayed, use the MSL rating associated with the actual reflow temperature that will be used to mount the part to the printed circuit board.

Green compatible (Y/N)

Indicates whether or not a device meets TI's "green" definition.

Green

TI defines "green" to mean Pb-free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).

Green conversion date

The forecasted or actual conversion date for the specific device package, pin count & assembly site. When an actual conversion date is displayed, the Conversion Date Code (DC yyww) will also be displayed to help customers identify Green compatible parts. To determine if parts that have already shipped are Green, compare the date and assembly site on the box label to the Green Conversion Date Code and corresponding assembly site location. If the assembly sites match, then boxes with dates later than the Green Conversion Date Code contain Green parts.

Customers can also look on the box label for the 2-character Environment Category (E-Cat) Code. If it starts with "G" (G3, G4, etc), the box contains Green compatible parts (E-Cat Codes were added to boxes beginning on June 1st, 2004.

Green available supply date

The forecasted or actual date that the device will be available for purchase.

RoHS restricted substances - ppm

The ppm calculations are at the homogeneous material level and are worst-case ppm for each RoHS substance.
Example:

PPM= 1000000 X total amount of lead in component (mg)

Total leadframe plating weight (mg)

RoHS restricted substances - amount (mg)

The total amount of each RoHS substance in the component

Green reportable substances - ppm

The ppm calculations are at the homogeneous material level and are worst-case ppm for each green substance.
Example:

ppm= 1000000 X total amount of antimony in component (mg)

total mold compound weight (mg)

Green reportable substances - amount (mg)

The total amount of each green substance in the component.

Recyclable metals - ppm

The WEEE Directive (Waste Electrical and Electronic Equipment) has created interest in recyclable metals. The ppm calculations are at the component level.

Example:

ppm= 1000000 X total amount of gold in component (mg)

total component weight (mg)

Recyclable metals - amount (mg) 

The total amount of each recyclable metal in the component.

Total device mass (mg) 

Weight of the component in milligrams.

IEC 62474 Database

TI products that are compliant to RoHS requirements are also compliant to the substances and thresholds defined in the IEC 62474 Database (was previously the Joint Industry Guide).

IEC 62474 Database – Mandatory

The mandatory substances contained within the IEC 62474 Database are restricted based on WW legislation. These substances shall be reported if thresholds defined within the database are exceeded.

IEC 62474 Database – Optional

The optional substances contained within the IEC 62474 Database are reportable based on industry defined reporting requirements. These substances may be reported if thresholds defined within the database are exceeded.

Extended shelf life

TI offers extended shelf life of certain products to enable up to five years of total shelf life from the time the product is manufactured to the time it is delivered by TI or a TI authorized distributor.

Mass (mg)

Representative device weight (per part) in milligram

REACH

The European Union’s Registration Evaluation, Authorization and restriction of Chemicals (EU REACH) that lists the Substances of Very High Concern (SVHC). This list is usually updated 2 times per year.

IEC 62474 DB

Is the worldwide regulatory list of restricted substances, applications and thresholds as they apply to electronic products maintained by the IEC 62474 Validation Team committee. This list was the JIG-101 but was sunset in 2012 and became the IEC 62474 DB at that time.