Find TI packages

TI’s broad packaging portfolio supports thousands of diversified products, packaging configurations and technologies, from traditional BGA and ceramics, to advanced WCSP, QFN, SiP, modules, power packages and more. Select a package family below, or search all TI packages to explore TI’s complete package portfolio.

A complete description of available TI package families can be found here.

packageName=BGA
Ball Grid Array (BGA)

High ball count substrate package

Ceramic Flat Pack (CFP)
Ceramic Flat Pack (CFP)

Ceramic rectangular package with leads on opposite sides
Chip on Flex (COF)
Chip on Flex (COF)

Well suited for high pin-count, fine pitch applications

DLP
DLP

Custom packages for DMD display and controller chips
Die-Size Ball Grid Array, WCSP (DSBGA)
Die-Size Ball Grid Array, WCSP (DSBGA)

Small form factor for low-to-moderate pin count devices
Dual In-Line (DIP)
Dual In-Line (DIP)

Through-hole package with enhanced thermal performance

Land Grid Array (LGA)
Land Grid Array (LGA)

High-pin-density solution in a miniature package
Land Grid Array (LGA)
Leaded Chip Carrier (LCC)

J-shaped lead configuration with pins on each side
Module
Module

Fully integrated with active die and passives

Plastic Grid Array (PGA)
Pin Grid Array (PGA)

High pin count, leaded substrate package
Quad Flat No Lead (QFN)
Quad Flat No Lead (QFN)

Thin profile no-lead package, enhanced thermal performance
Quad Flat Pack (QFP)
Quad Flat Pack (QFP)

Leaded package on four sides, enhanced thermal,
Radio-frequency identification (RFID)
Radio-frequency identification (RFID)

Uses radio waves to identify people or objects
Small Outline (SO)
Small Outline (SO)

Leaded package with leads on opposite sides

Small Outline No Lead (SON)
Small Outline No Lead (SON)

Low lead inductance, thin profile for handheld applications
TAB
TAB

Non-packaged die option with high test capability
Transistor Outlines (TO)
Transistor Outlines (TO)

Through-hole package with small footprint
Micro ChipScale Package (µCSP)
Micro ChipScale Package (µCSP)

High pin capacity for compact systems