Texas Instruments’ innovative approach to packaging helps customers differentiate their products and enables further cost-effective advancements in miniaturization and performance, including reliability for analog and embedded processing applications. Our broad portfolio includes thousands of diversified packaging configurations and lead-free technologies, ranging from traditional ceramics, to advanced QFNs, WCSP, BGA, fine pitch wire bond, flip chip, SiPs and modules, stacked and embedded die packaging, and more.

Our packaging solutions are based on a tradition of excellence in R&D, design and manufacturing, and decades of expertise and a continued commitment to innovation. With TI’s know-how in developing advanced packaging technologies, TI is well poised to deliver the next wave of innovative solutions to meet customers’ needs.

 
  • Battery-less measurements on the spot
Find packages

Find packages

Search various package families to find technical specifications such as dimension, pin count, pitch, and package drawing.

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SMT & application notes

SMT & packaging application notes

Get documentation on TI’s surface mount technology (SMT), and find application notes on a variety of packaging topics.

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Find a product by package

Find product by package

Search packaging information on TI products by part number, package name or pin count for package drawing, footprint information and more.

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