TI’s broad portfolio of DC/DC modules integrate inductors, FETs, compensation, and other passive components into a single package to simplify prototyping, design, and manufacturing. Using a module reduces engineering time for design and verification to help speed development cycles for many applications, including personal electronics, industrial, and communications.
TI has the most diverse portfolio of DC/DC power modules in the industry, covering a wide range of input voltages and output currents with a variety of package options. Using the graphic below, explore the power module portfolio and find the right device for your design.
High performance, smallest size and high power density up to 430 mW/mm³ are ideal for space constrained applications.
TO-PMOD leaded packaging features a single ground pad and probeable pins for easy prototyping and mounting.
QFN modules with leadless packaging feature a small footprint for high density designs.