TI’s broad portfolio of DC/DC modules integrate inductors, FETs, compensation, and other passive components into a single package to simplify prototyping, design, and manufacturing. Using a module reduces engineering time for design and verification to help speed development cycles for many applications, including personal electronics, industrial, and communications.
High performance, smallest size and high power density up to 430 mW/mm³ are ideal for space constrained applications.
TO-PMOD leaded packaging features a single ground pad and probeable pins for easy prototyping and mounting.
QFN modules with leadless packaging feature a small footprint for high density designs.
Click the portfolio to learn more about the different product families and to find the best device for your design