TI's 3D time of flight products, tools and development kits enable the next generation of machine vision with real-time 3D imaging depth camera. From robotic navigation to gesture recognition and building automation, TI's 3D time of flight chipsets allow for maximum flexibility to customize every aspect of your camera's design.
3D time of flight operates by illuminating an area with modulated IR light. By measuring the phase change of the reflected signal the distance can be accurately determined for every pixel in the sensor creating a 3D depth map of the subject or scene.
TI's 2nd Generation QVGA (320 x 240 pixel resolution) 3D ToF Chipset provides unparalleled integration, high configurability, and ease of design.
|Device Type||Sensor + AFE||ToF Controller|
|Sensor Resolution||320 x 240||N/A||Output Format||Raw Correlation Data||Depth Data|
|Frame Rate (Max) (FPS)||150||120|
|Pixel Pitch (um)||15||N/A|
|Operating Temperature Range (C)||0 to 70||0 to 70|
|Order Now||Order Now|
After you select your 3D time of flight chipset, jumpstart your design with TI's third party design partners. These partner companies can help with everything from the design of your illumination and lensing to providing full turnkey solutions tailored to you're specific needs. Or get started yourself with TI's camera and software development kits.